Patent Pending 19.00mm [0.748"] Top View 1.00mm [0.039"] Ordering Information: Solder Ball Alloy Part Number Suffix Sn63Pb37 1.00mm [0.039"] -42 Sn96.5Ag3.0Cu0.5 19.00mm [0.748"] -42F* *RoHS Compliant 1.33mm [0.052"] 2.36mm [0.093"] Side View 1.00mm typ. Detail A 2 3 Detail A 2.87mm [0.113"] 1 4 0.51mm [0.020"] CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins 3-finger 37/25 gram, Initial insertion force (with 0.254mm/0.203mm dia. pin) 30/22 gram, normal force (with 0.254mm/0.203mm dia. pin) 20/17 gram, extraction force (with 0.254mm0.203mm dia. pin) 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. RoHS 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). 3 Contacts: Beryllium Copper Alloy172, HT; Finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). 4 Solder Balls (See table above) Description: Giga-snaP BGA SMT Foot 324 position (1.0mm pitch) gold plated female receptacle pins to SMT solder balls (BGA type). Pin asignment 1:1. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.18mm [±0.007"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SF-BGA324G-B-42(F) Drawing © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Scale: 5:1 Rev: D Drawing: H. Hansen Date: 7/27/04 File: SF-BGA324G-B-42 Dwg Modified: 1/6/06 R R 1 2 R 1 2 3