SG-BGA-7154 Dwg.mcd - Ironwood Electronics

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
A
Recommended torque = 0.38 in-lb
(6 in-oz)
4
1
2
8
6
12
SG-BGA-7154 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351, Rupp Dr., Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
5
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
5
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7
Ball Guide: Kapton polyimide.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
9
Socket lid screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
10
Insulation Plate: FR4/G10, Thickness = 1.59mm.
11
Backing Plate: Black anodized Aluminum.
Thickness = 6.35mm.
12
IC Guide: FR4/G10
7
Side View
(Section AA)
Customer's
BGA IC
2
6
Assembled
8.55mm +
IC thickness
11
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
9
3
10
1
Customer's Target PCB
Status: Released
Scale: -
Rev: A
Drawing: M.A. Fedde
Date: 11/5/09
File: SG-BGA-7154 Dwg
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout
Top View
*Note: BGA pattern is not symmetrical
with respect to the mounting holes. It is
offset by 0.25mm to the right of center
with respect to the mounting holes.
Orientation Mark
1.25mm±0.125mm(x4)
3.3625mm*
0.5mm typ.
1.25mm±0.125mm(x4)
Socket Body
Size
Note: Full BGA pattern shown.
Please adjust pattern according
to individual requirements.
2mm
3.11mm
Ø 0.85mm±0.025mm (x2)
Non plated alignment hole
3.5mm
3mm
Ø 0.3mm (x64)
Ø 1.61mm±0.05mm (x4)
Non plated mounting hole
3.5mm
9.725mm (x4)
12.225mm (x4)
14.73mm sqr.
backing plate outline
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: Same or higher than solder mask
All dimensions are in mm unless stated otherwise
Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise.
SG-BGA-7154 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351, Rupp Dr., Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: 4:1
Rev: A
Drawing: M.A. Fedde
Date: 11/5/09
File: SG-BGA-7154 Dwg
Modified:
PAGE 2 of 4
Compatible BGA Spec
3.5mm
E
X
Y
A1
e
3.5mm
D
3
Øb
Ø0.05 X Y
Ø0.05
Bottom View
Top View
DIM
5
1.
Dimensions are in millimeters.
A
2.
Interpret dimensions and tolerances per
ASME Y14.5M-1994.
A1
3
Dimension b is measured at the
maximum solder ball diameter, parallel
to datum plane Z.
4
Datum Z (seating plane) is defined
by the spherical crowns of the solder balls.
5
Parallelism measurement shall exclude
any effect of mark on top surface of
package.
b
0.10 Z
A
0.08 Z
Z
A1
4
End View
MIN
MAX
0.8
0.15
0.35
0.25
D
4.0 BSC
E
4.0 BSC
e
0.5 BSC
8x8 array
All dimensions are in mm unless stated otherwise
SG-BGA-7154 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351, Rupp Dr., Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: A
Drawing: M.A. Fedde
Date: 11/5/09
File: SG-BGA-7154 Dwg
Modified:
PAGE 3 of 4
14.73mm
2.5mm
Top View
1.27mm (x4)
2.5mm
1.5mm
14.73mm
9.725mm±0.025mm (x4)
3.5mm
Ø 1.61mm±0.05mm (x4)
3mm sqr.
5.94mm
Note: Backing plate holes are tapped to accept 0-80 screws.
1.59mm
Side View
Insulation Plate
Backing Plate
6.35mm
Description: Insulation Plate and Backing Plate
SG-BGA-7154 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351, Rupp Dr., Suite 400, Burnsville, MN 55337
Tele: (952) 229-8200
www.ironwoodelectronics.com
All dimensions are in mm.
All tolerences are +/- 0.125mm.
(Unless stated otherwise)
Status: Released
Scale: -
Rev: A
Drawing: M.A. Fedde
Date: 11/5/09
File: SG-BGA-7154 Dwg
Modified:
PAGE 4 of 4