GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid A A Top View Recommended torque = 1.1 in lbs./ 18 in oz. 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 6 Side View (Section AA) 7 10 10 11 Customer's BGA IC SG-BGA-7074 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 5 11 Customer's Target PCB Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 8/24/06 File: SG-BGA-7074 Dwg Modified: 7/7/09, AE Insulation Plate: FR4/G10, Thickness = 1.59mm. Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation Mark 1.25mm±0.13mm (x4) *2.11mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 0.5mm typ. 1.25mm±0.13mm (x4) 1.86mm Socket Body Size 2.54mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 10mm Ø 0.3mm pad 5.08mm Ø 1.61mm±0.05mm (x4) Non plated mounting hole 10mm 13.725mm (x4) 16.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask SG-BGA-7074 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com 18.73mm sqr. backing plate outline All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 8/24/06 File: SG-BGA-7074 Dwg Modified: 7/7/09, AE PAGE 2 of 4 Compatible BGA Spec. X D Detail Y 5 DETAIL 0.10 Z A E A1 0.10 Top View e Z 0.08 Z 4 Side View 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 3 Øb Ø0.05 Z X Y Ø0.05 Z Bottom View SG-BGA-7074 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Status: Released Scale: - DIM MIN MAX 1.46 A A1 0.17 0.27 b 0.40 D 11.0 BSC E 11.0 BSC e 0.5 BSC 21 x 21 array Rev: B Drawing: H. Hansen Date: 8/24/06 File: SG-BGA-7074 Dwg Modified: 7/7/09, AE PAGE 3 of 4 18.73mm 2.5mm 2.5mm 1.27mm (x4) Top View 13.725mm±0.025mm (x4) 18.73mm 2mm 4mm Ø 1.61mm±0.05mm (x4) Note: Backing plate holes are tapped to accept 0-80 screws. 4mm sqr. 7.94mm 1.59mm Insulation Plate Side View Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-7074 Drawing © 2009 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 8/24/06 File: SG-BGA-7074 Dwg Modified: 7/7/09, AE All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4