GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 20.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. Top View 20.225mm Recommended torque = 2 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 Side View (Section AA) 10 6 Customer's BGA IC 11 5 10 Customer's Target PCB 11 SG-BGA-6028 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: E Drawing: W. Watson Date: 12/12/01 File: SG-BGA-6028 Dwg.mcd Modified: 7/02/09, AE Socket base nut: 18-8 Stainless steel, 0-80 fine thread. Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View Orientation Mark *Note: BGA pattern is not symmetrical with respect to the mounting holes. Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 2.84mm 0.8mm typ. 2.54mm 2.46mm Ø 0.85mm±0.03mm (x2) Non plated alignment hole 20.225mm±0.125mm sqr. Socket size Ø 0.43mm PAD 5.08mm Ø 1.75mm±0.1mm (x4) Non plated mounting hole 17.725mm(x4) 1.25mm±0.13mm 1.25mm±0.13mm Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6028 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 4:1 Rev: E Drawing: W. Watson Date: 12/12/01 File: SG-BGA-3028 Dwg.mcd Modified: 7/02/09, AE PAGE 2 of 3 Compatible BGA Spec. X D Y 3 Øb Ø0.25 X Y Ø0.10 E e Bottom View Top View Array:17x17 A1 0.20 Z 1. Dimensions are in millimeters. A 2. Z 4 5 Side View SG-BGA-6028 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.20 Z Status: Released Scale: - DIM MIN MAX 1.4 A A1 0.35 0.45 b 0.55 D 15.0 BSC E 15.0 BSC e 0.8 BSC Rev: E Drawing: W. Watson Date: 12/12/01 File: SG-BGA-6028 Dwg.mcd Modified: 7/02/09, AE PAGE 3 of 3