GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Ball guide prevents over compression of elastomer 50mm sqr. Easily removable swivel socket lid 1 2 Socket ba se : Black a nodized 606 1 A luminum. Thickn ess = 7.5mm. 3 Compression Plate: B lack ano dize d 6 061 Alu min um. Thickn ess = 4.0mm. 4 Side View (Section AA) Recommended torque = 32.5 in/lbs. 5 12 4 1 Compression screw: Clear an odized 6061 A luminum. Thickn ess = 10mm, Hex socket = 5mm. Ela stomer: 4 0 micron dia go ld plated brass filaments ar ranged symmetrically in a silicone rub ber (63.5 degre e a ngle). Thickn ess = 0.75mm. 6 Ela stomer Guid e: Cirlex o r e quiva lent. Thickn ess = 0.75mm. 7 Bal l Gu ide: K apton polyimide. 8 Socket ba se screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 9.525 mm long . 9 Socket lid screw: Socket hea d cap , Alloy steel with bla ck o xid e finish, 0-80 fine th read , 4.76mm long. 10 Insulation Plate: FR4 /G1 0, 1.59mm th ick. 9 2 36.2mm 3 8 7 6 10 5 Socket Li d: Bla ck a nodized 60 61 Aluminum. Thickn ess = 2.5mm. Customer's BGA IC 11 11 Backing Plate: A nodized 60 61Alu min um 6 .35 mm thick. 12 Fan: 5 0mm square , 10mm thi ck, 10 CFM air flow, 12V Customer's Target PCB SG-BGA-6119 Drawing Status: Released © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: Heidi Hansen Date: 11/11/04 File: S G-BGA -6119 Dwg Modified: 3/1/05 Scale: - Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm(x4) Orientation Mark 2.49mm* 1mm typ. 1.25mm±0.13mm(x4) 2.54mm 2.11mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 47.725mm±0.125mm(x4) Socket size Ø 0.51mmxPAD 5.08mm 2.5mm±0.13mm 22.6125mm(x8) 2.5mm±0.13mm Ø 1.61mm ±0.05mm(x8) Mounting Hole 50.225mm±0.125mm(x4) Backing plate size Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. NOTE: Steel backing plate may be required based on end user's application SG-BGA-6119 Drawing Status: Released © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: Heidi Hansen Date: 11/11/04 File: S G-BGA -6119 Dwg Modified: 3/1/05 Scale: 2:1 Rev: B PAGE 2 of 4 Compatible BGA Spec DETAIL Y X D e E 3 Øb Ø0 .25 Z X Y Ø0 .10 0.20 BOTTOM VIEW SIDE VIEW TOP VIEW DIM 5 DETAIL Dimensions are in mil lime te rs. 2. Inte rpret dimensions and to leraces p er AS ME Y1 4.5 M-1 994. 4 0.2 Z 0.60 0.40 b 0.70 42.50 BSC E 42.50 BSC 4 Datum Z (se atin g p lane) is d efined by the sp herical cro wn s of the solder ba lls. e 1.0 BSC 5 Par allelism mea su rement shal l exclude any effe ct o f mark o n top surface of package. SG-BGA-6119 Drawing Status: Released © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: Heidi Hansen File: S G-BGA -6119 Dwg A1 D A Z 3.45 Dimension b is measure d a t th e maximum solde r b all d iameter, pa rallel to d atum pla me Z. 3 A1 MAX A 1. 0.20 Z MIN Scale: - Array: 42x42 Rev: B Date: 11/11/04 Modified: 3/1/05 PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 22.61mm±0.03mm (x8) 50.23mm 5mm Ø 1.61mm±0.05mm (x8) 8.53mm Top View 10mm Sqr. 23mm (x4) 50.23mm 1.59mm Insulation Plate Side View 6.35mm Backing Plate Description: Backing Plate with Insulation Plate PAGE 4 of 4 SG-BGA-6119 Drawing Status: Released © 2004 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Drawing: Heidi Hansen File: S G-BGA -6119 Dwg Scale: 2:1 Rev: B Date: 11/11/04 Modified: 3/1/05 All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise)