GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 16.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Black anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, Alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 16.225mm Side View (Section AA) Recommended torque = 1-2 in lbs. 4 1 3 Assembled 8.25mm + IC thickness 9 2 8 7 6 10 5 Customer's BGA IC 11 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 10 Socket base nut: 18-8 Stainless steel, 0-80 fine thread. 11 Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. Customer's Target PCB Scale: - SG-BGA-6213 Drawing Status: Released © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 12/14/06 File: SG-BGA-6213 Dwg.mcd Modified: 7/7/09, AE Rev: B All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1mm typ. 1.25mm±0.13mm(x4) 2.74mm 1.25mm±0.13mm(x4) Socket Body Size 2.36mm 2.54mm Ø 0.85mm±0.025mm(x2) Alignment Hole Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 0.51mm Pad (x100) 5.08mm Ø 1.61mm±0.05mm(x4) Mounting Hole 13.725mm (x4) 16.225mm±0.125mm (x4) Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: 3:1 SG-BGA-6213 Drawing Status: Released © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Drawing: J. Glab Date: 12/14/06 File: SG-BGA-6213 Dwg.mcd Modified: 7/7/09, AE Rev: B PAGE 2 of 3 Compatible BGA Spec X DETAIL D Y 5 DETAIL 0.20 Z A E Z A1 0.20 TOP VIEW e 3 SIDE VIEW Dimensions are in millimeters. 2 Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Ø0.25 Z X Y Ø0.10 DIM 1 Parallelism measurement shall exclude any effect of mark on top surface of package. © 2006 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com MAX 1.7 0.25 0.45 b 0.7 D 11.00 BSC E 11.00 BSC e 1.00 BSC Array 10x10 BOTTOM VIEW SG-BGA-6213 Drawing MIN A A1 Øb 0.12 Z 4 Status: Released Scale: - Rev: B Drawing: J. Glab Date: 12/14/06 File: SG-BGA-6213 Dwg.mcd Modified: 7/7/09, AE PAGE 3 of 3