GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable swivel socket lid A A Top View Recommended torque = 2 in lbs./ 32 in oz. 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 9.525mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 6 7 10 Side View (Section AA) 10 11 Customer's BGA IC SG-BGA-7067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 11 5 Insulation Plate: FR4/G10, Thickness = 1.59mm. Backing Plate: Black anodized Aluminum. Thickness = 6.35mm. Customer's Target PCB Status: Released Scale: - Rev: C Drawing: H. Hansen Date: 6/17/05 File: SG-BGA-7067 Dwg Modified: 7/7/09, AE All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 *Note: BGA pattern is not symmetrical with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1.25mm±0.13mm (x4) *2.36mm Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. 0.5mm typ. 1.25mm±0.13mm (x4) 2.11mm Socket Body Size 2.54mm Ø 0.85mm±0.025mm (x2) Non plated alignment hole 9.5mm Ø 0.3mm pad 5.08mm Ø 1.61mm±0.05mm (x4) Non plated mounting hole 9.5mm 13.725mm (x4) 16.225mm±0.125mm (x4) 18.73mm sqr. backing plate outline Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask SG-BGA-7067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com All dimensions are in mm unless stated otherwise Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: 4:1 Rev: C Drawing: H. Hansen Date: 6/17/05 File: SG-BGA-7067 Dwg Modified: 7/7/09, AE PAGE 2 of 4 Compatible BGA Spec. X D Detail Y 5 DETAIL 0.10 Z A E A1 0.10 Top View e Z 0.08 Z 4 Side View 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3 Øb Ø0.05 Z X Y Ø0.05 Z 3 Bottom View SG-BGA-7067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. Status: Released Scale: 1:0.2 DIM MIN MAX 1.4 A A1 0.2 0.3 b 0.35 D 11.0 BSC E 11.0 BSC e 0.5 BSC 20 x 20 array Rev: C Drawing: H. Hansen Date: 6/17/05 File: SG-BGA-7067 Dwg Modified: 7/7/09, AE PAGE 3 of 4 18.73mm 2.5mm 2.5mm 1.27mm (x4) Top View 13.725mm±0.025mm (x4) 18.73mm 2mm 4mm Ø 1.61mm±0.05mm (x4) Note: Backing plate holes are tapped to accept 0-80 screws. 4mm sqr. 7.94mm 1.59mm Side View Insulation Plate Backing Plate 6.35mm Description: Insulation Plate and Backing Plate SG-BGA-7067 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: 3:1 Rev: C Drawing: H. Hansen Date: 6/17/05 File: SG-BGA-7067 Dwg Modified: 7/7/09, AE All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise) PAGE 4 of 4