3mm dia hole for thermocouple SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • Wide temperature range (-55C to +180C). • High current capability (up to 8A). • Excellent signal integrity at high frequencies. • Low and stable contact resistance for reliable production yield. • Highly compliant to accommodate wide IC package coplanarity variations. DETAIL A SCALE 2 : 1 30.00 fan 30.00 heat sink 10.00 fan 41.46 12.00 heat sink 9.59 A Description: Socket Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6021 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 85.02 STATUS: Released SHEET: 1 OF 5 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 1.5:1 FILE: SBT-BGA-6021 Dwg DATE: 9/8/2012 *Note: BGA pattern is not symmetrical with respect to the mounting holes. 34.725±0.125 backing plate 32.600±0.125 socket base 2.500±0.125 29.725 Orientation mark 1.250±0.125 2.7375 Backing plate outline Socket base outline 2.500±0.125 1.63±0.125 2.3625 2.54 32.98 34.725±0.125 backing plate 29.725 32.225±0.125 socket base 1.0 typ. 5.08 1.70±0.10 x4 places 0.51 BGA Pads x676 places 0.850±0.025 x2 places DXF DATA WILL BE PROVIDED 33.35 Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish Description: Recommended PCB layout Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6021 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 85.02 STATUS: Released SHEET: 2 OF 5 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 3:1 FILE: SBT-BGA-6021 Dwg DATE: 9/8/2012 0.68 (x676) 0.10 M C 0.25 M C A S B S 1.00 27.00±0.15 27.00 25.00 27.00 1.00 0.15 (X4) 25.00 27.00 1.55 2.05 C Seating Plane 0.77±0.05 Description: BGA Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6021 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 85.02 STATUS: Released SHEET: 3 OF 5 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 3:1 FILE: SBT-BGA-6021 Dwg DATE: 9/8/2012 2.500±0.125 1.27 (x4) 1.61±0.10 (x4) thru 2.500±0.125 34.725±0.125 5.00 5.03 10.00 16.00 (x4) 29.725±0.050 1.59 Insulating plate 6.35 Backing plate Description: Backing Plate Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6021 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 85.02 STATUS: Released SHEET: 4 OF 5 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 1:1 FILE: SBT-BGA-6021 Dwg DATE: 9/8/2012 ITEM NO. 1 15 14 16 13 1 2 4 19 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 3 20 9 DESCRIPTION flat hd phillips M3-0.5, x 5mm long SS, 90 deg Countersunk #0-80 Shoulder Screw, 0.062" thread length Compression Plate, 27mm IC with TC access hole Socket Lid, 32.225 X 32.225 Floating Guide 26x26 array 1mm pitch Middle Guide 26x26 array 1mm pitch Bottom Guide 26x26 array 1mm pitch Pogo Pin, 1mm Pitch SBT BGA pin Dowel Pin, 1/32" dia, 7/16" Long, 18-8 SS #0-80 X .75 LG, SOC HD CAP SCREW, 18-8 SS Washer, #0 x .025", Nylon SBT Ni plt backing plt 27mm IC compression screw with heat sink M18x1.5 thread DC fan 30mmx30mmx10mm, 5V, 5.5CFM Cheese Head 18-8 M3 Size, 14 mm Length spacer round M3-0.5 female thread 10mm long Ni pltd brass Floating Guide Spring Insulation Plate 27mm IC Material Stainless Steel (303) 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy PEEK Ceramic filled PEEK Ceramic filled PEEK Ceramic filled Chrome Stainless Steel Stainless Steel (18-8) Nylon 6/6 7075-T6 Aluminum Alloy 7075-T6 Aluminum Alloy PP Copolymer Cast Stainless Steel Brass Alloy Steel (SS) FR4 7075-T6 Aluminum Alloy 21 BGA676 device Socket Base SBT 27x27mm Ni plated 0.375mm shift 1mm and 1.27 mm pitch IC #0-80, 90 deg., head pin guide screw, Peek material 5.5715mm overall Length 22 Test PCB BGA676C FR4 20 FR4 Standard PEEK unfilled 5 8 7 17 21 6 18 12 10 11 SBT Pin 15:1 scale Rev A B Description: Socket detail, Pin Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams. Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. SBT-BGA-6021 Drawing ©2015 Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com Material: N/A Finish: N/A Weight: 85.02 STATUS: Released Date 09/08/12 03/12/15 Initials MR DH Description Original Updated layout page. SHEET: 5 OF 5 REV. B ENG: S. Huang DRAWN BY: M. Raske SCALE: 3:2 FILE: SBT-BGA-6021 Dwg DATE: 9/8/2012