GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 20.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A Top View 20.225mm 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. Thickness = 5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 5 Elastomer: 20 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.5mm. 6 Elastomer Guide: Non-clad FR4. Thickness = 0.475mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. Recommended torque = 2 in lbs. 4 1 9 3 Assembled 8.25mm + IC thickness 2 8 7 Side View (Section AA) 10 6 Customer's BGA IC 11 5 10 Customer's Target PCB 11 SG-BGA-8015 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Socket base nut: 18-8 Stainless steel, 0-80 fine thread. Status: Released Scale: - Rev: B Drawing: E Smolentseva Date: 05/06/09 File: SG-BGA-8015 Dwg Modified: 7/2/09, AE Nylon washer: 1.73mm ID; 4.78mm OD 0.64mm thickness. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View *Note: BGA pattern is not symmetrical with respect to the mounting holes. Orientation mark 0.8mm typ. 2.3125mm * 2.0625mm 2.54mm Ø 0.85mm±0.025mm(x2) Alignment Hole 20.225mm±0.125mm sqr. Socket size Ø 0.356mm PAD 5.08mm 1.25mm±0.125mm Ø 1.61mm±0.05mm(x4) Mounting Hole 17.725mm(x4) 1.25mm±0.125mm Target PCB Recommendations Total thickness: 1.6mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-8015 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: - Rev: B Drawing: E Smolentseva Date: 05/06/09 File: SG-BGA-8015 Dwg Modified: 7/2/09, AE PAGE 2 of 3 Compatible BGA Spec. X D Y 3 Øb Ø0.08 X Y Ø0.15 E e Bottom View Top View Array:18x18 A1 0.53 Z 1. Dimensions are in millimeters. A DIM 2. Z 4 5 SG-BGA-8015 Drawing © 2009 IRONWOOD ELECTRONICS, INC. Tele: (952) 229-8200 www.ironwoodelectronics.com 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.08 Z Side View Interpret dimensions and tolerances per ASME Y14.5M-1994. Status: Released Scale: - MIN MAX 1.20 A A1 b 0.16 0.26 0.4 D 15.0 BSC E 15.0 BSC e 0.8 BSC 18x18 Array Rev: B Drawing: E Smolentseva Date: 05/06/09 File: SG-BGA-8015 Dwg Modified: 7/2/09, AE PAGE 3 of 3