Features 60.6mm Directly mounts to target PCB (needs tooling holes) with hardware Minimum real estate required Compression plate distributes evenly A Clamshell lid 65.23mm Materials: 1 Clam Shell Lid: Black anodized Aluminum. Height = 20 mm. 2 Socket Base: Black anodized Aluminum. Height = 6 mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 12 mm. 4 Compression Screw: Clear anodized Aluminum. Height = 27 mm, Fluted Knob A Top View Side View 11 4 5 1 39.7mm + IC height 6 Elastomer Guide: Non-clad FR4. Thickness = 0.725mm. 7 Socket Base Screw: Socket Head Cap Screw, Black Oxide, 0-80 Thread, 5/8" long. 8 Backing Plate: Black anodized Aluminum 9 Insulation Plate: FR4/G10 3 2 6 Front View Section A-A Customer's PCB Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 9 10 5 7 11 10 CG-BGA-4013 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Ball Guide: Kapton polyimide. 8 Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 7/14/10 File: CG-BGA-4013 Dwg Modified: Latch: Black anodized 7075 Aluminum. All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 4 *Note: BGA pattern is shifted to the right by 0.375mm with respect to the mounting holes. Recommended PCB Layout Top View Orientation Mark 1.25mm±0.13mm(x4) 1.25mm±0.13mm(x4) 3.2825mm* 1.27mm typ. 2.54mm 2.9075mm Ø 0.85mm±0.025mm(x2) Non plated alignment hole 50.23mm±0.125mm(x4) Socket size Ø 0.64mm pad (x1152) 5.08mm Ø 1.71mm±0.1mm (x8) 23.8625mm(x8) 2.5mm±0.13mm Non plated Mounting Hole 2.5mm±0.13mm 52.73mm±0.125mm(x4) Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask Backing plate size NOTE: Steel backing plate may be required based on end user's application CG-BGA-4013 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 7/14/10 File: CG-BGA-4013 Dwg Modified: PAGE 2 of 4 Compatible BGA Spec D X DETAIL Y e E 3 Øb Ø0.30 Z X Y Ø0.15 0.20 5 1. Dimensions are in millimeters. 0.35 Z 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. A1 3 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. D 45 BSC 4 E 45 BSC 5 Parallelism measurement shall exclude any effect of mark on top surface of package. e 1.27 BSC DIM DETAIL A A1 Z 4 BOTTOM VIEW SIDE VIEW TOP VIEW 0.2 Z MIN MAX 2.51 A 0.7 0.5 b 0.90 Array: 34 x 34 CG-BGA-4013 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 7/14/10 File: CG-BGA-4013 Dwg Modified: PAGE 3 of 4 2.5mm 1.27mm (x4) 2.5mm 23.8625mm±0.025mm (x8) 52.73mm 5mm Ø 1.71mm±0.1mm (x8) 8.53mm Top View 10mm Sqr. 23mm (x4) 52.73mm Note: Backing plate holes are tapped to accept 0-80 screws. 1.59mm Side View Insulation Plate Backing Plate 6.35mm Description: Backing Plate with Insulation Plate CG-BGA-4013 Drawing © 2010 IRONWOOD ELECTRONICS, INC. 11351 Rupp Drive, Suite 400, Burnsville, MN 55337 Tele: (952) 229-8200 www.ironwoodelectronics.com PAGE 4 of 4 Status: Released Scale: - Rev: A Drawing: E Smolentseva Date: 7/14/10 File: CG-BGA-4013 Dwg Modified: All dimensions are in mm. All tolerences are +/- 0.125mm. (Unless stated otherwise)