GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB (needs tooling holes) with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer Easily removable swivel socket lid A A 1 Socket Lid: Black anodized Aluminum. Thickness = 2.5mm. 2 Socket base: Black anodized Aluminum. All holes are 0-80 tapped. Thickness = 6.5mm. 3 Compression Plate: Black anodized Aluminum. Thickness = 2.5mm. 4 Compression screw: Clear anodized Aluminum. Thickness = 5mm, Hex socket = 5mm. 40.225mm 4 Recommended torque = 24 in lbs. Side View (Section AA) 1 9 3 Assembled 8.25mm + IC thickness 2 5 7 6 5 8 Customer's Target PCB Assembled 8.25mm + IC thickness Elastomer: 40 micron dia gold plated brass filaments arranged symmetrically in a silicone rubber (63.5 degree angle). Thickness = 0.75mm. 6 Elastomer Guide: Cirlex or equivalent. Thickness = 0.75mm. 7 Ball Guide: Kapton polyimide. 8 Socket base screw: Socket head cap, alloy steel with black oxide finish, 0-80 fine thread , 12.7mm long. 9 Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine thread. 2 1 Customer's BGA IC 4 SG-BGA-6132 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 9 Recommended torque = 24 in lbs. Status: Released Scale: - Rev: B Drawing: H. Hansen Date: 9/13/05 File: SG-BGA-6132 Dwg Modified: 5/19/09 All tolerances: ±0.125mm (unless stated otherwise). Materials and specifications are subject to change without notice. PAGE 1 of 3 Recommended PCB Layout Top View Note: BGA pattern is not symmetrical with respect to the mounting holes. 1.25mm±0.13mm typ. Orientation Mark 33mm 1.25mm±0.13mm typ. 2.74mm 1mm typ. 2.36mm 2.54mm (x2) Ø 0.85mm±0.025mm (x4) Non plated alignment hole 40.225mm±0.125mm typ. (socket body) 33mm Ø 0.51mm PAD 5.08mm (x2) Note: Full BGA pattern shown. Please adjust pattern according to individual requirements. Ø 1.61mm±0.05mm (x8) Non plated mounting hole 18.863mm(x8) Target PCB Recommendations Total thickness: 2.4mm min. Plating: Gold or Solder finish PCB Pad height: Same or higher than solder mask NOTE: Steel backing plate may be required based on end user's application SG-BGA-6132 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com Status: Released Recommended PCB Layout Tolerances: ±0.025mm [±0.001”] unless stated otherwise. Scale: - Rev: B Drawing: H. Hansen Date: 9/13/05 File: SG-BGA-6132 Dwg Modified: 5/19/09 PAGE 2 of 3 Compatible BGA Spec X D Y DETAIL e E Øb Ø0.25 Z X Y Ø0.10 Z 0.20 Top View DETAIL Bottom View Side View 5 1. Dimensions are in millimeters. 2. Interpret dimensions and toleraces per ASME Y14.5M-1994. 3 Dimension b is measured at the maximum solder ball diameter, parallel to datum plame Z. 4 Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. 0.20 Z A A1 Z 4 SG-BGA-6132 Drawing © 2005 IRONWOOD ELECTRONICS, INC. PO BOX 21151 ST. PAUL, MN 55121 Tele: (651) 452-8100 www.ironwoodelectronics.com 0.2 Z Status: Released DIM Scale: - MIN MAX A 3.4 A1 0.4 0.6 b 0.5 0.7 D 35.0 BSC E 35.0 BSC e 1.00 BSC Array 34x34 Rev: B Drawing: H. Hansen Date: 9/13/05 File: SG-BGA-6132 Dwg Modified: 5/19/09 PAGE 3 of 3