XG-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR TEST APPLICATIONS Agilent Probe Sold Seperately 8.0 74.00 Recommended Torque: 10 in. lbs. 17.2250 37 8.0 37 13.0647 2.6650 38 (x4) 65 4.6000 18.7250 Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5007 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.21 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET 1 OF 5 DRAWN BY: V. Panavala SCALE: 3:2 File: XG-BGA-5007 DATE: 8/16/2012 REV. A 18.725 BACKING PLATE 14.725±0.050 (4) 1.7625±0.0250 1.25±0.13 1.25±0.13 1.7625±0.0250 2.54±0.025 0.850±0.025 (2) NON-PLATED ALIGNMENT HOLE 0.40 TYP 5.080±0.025 0.27 PAD TYP 11.20 17.225±0.125 SOCKET BASE 1.70±0.05 (4) NON-PLATED MOUNTING HOLE BGA617 A1 Corner Description: Recommmended PCB layout Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5007 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.21 MATERIAL: N/A FINISH: N/A STATUS: Released Target PCB Recommendations Total thickness: 1.5mm min. Plating: Gold or Solder finish SHEET 2 OF 5 DRAWN BY: V. Panavala SCALE: 6:1 File: XG-BGA-5007 DATE: 8/16/2012 REV. A 0.1250 B D 11.0000 E 0.5000 E 0.2 A b 0.15 M e A B C 0.10 C A A1 1. Dimensions are in millimeters. 2. Interpret dimensions and tolerances per ASME Y14.5M-1994. 3. Dimension b is measured at the maximum solder ball diameter, parallel to datum plane Z. 4. Datum Z (seating plane) is defined by the spherical crowns of the solder balls. 5. Parallelism measurement shall exclude any effect of mark on top surface of package. 0.20 C C DETAIL E SCALE 12 : 1 Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5007 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.21 MATERIAL: N/A FINISH: N/A STATUS: Released DIM A A1 b D E e PIn Count MIN 0.11 0.20 12.00 BSC 12.00 BSC 0.40 617 /168 on top MAX 0.94 0.21 0.30 Array SHEET 3 OF 5 DRAWN BY: V. Panavala SCALE: 6:1 File: XG-BGA-5007 DATE: 8/16/2012 REV. A 12 MAX (4) BGA168 Probe A1 Corner 0.5 Typ. 1.863±0.025 0.678±0.025 7.105±0.025 3.218±0.025 0.850±0.025 (2) NON-PLATED ALIGNMENT HOLE 1.863±0.025 11.0 14.725±0.025 TOP VIEW DESCRIPTION: Probe Board Layout Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"],all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5007 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.21 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET: 4 of 5 DRAWN BY: M. Tully SCALE: 6:1 File: XG-BGA-5007 DATE: 8/17/2012 REV. A 10 11 ITEM NO. 1 2 3 4 5 6 13 7 8 9 12 14 10 11 12 1 13 17 14 15 8 16 17 9 9 8 6 7 3 15 2 DESCRIPTION Socket Base 12mm POP socket Cflex 12mm 0.4mm pitch BGA617 Ball Guide BGA 12x12mm, 0.4mm Pitch Target PCB BGA617 12x12mm, 5 post Clamshell Backing Plate BGA chip 617pin with 0.4mm Pitch and 29x29 array BGA168 0.5mm pitch top IC guide 12mm IC Cflex BGA168 0.5mm pitch Agilent BGA168 Probe board 0.5mm pitch Compression Screw M10 Socket Lid 12mm Compression Plate #0-80 Shoulder Screw, 0.062" thread length Memory chip BGA168 Dowel pin, 1/32" X 1/2", SS #0-80 X .313 LG, SOC HD CAP SCREW, ALLOY STL, BLK OXIDE Ball Guide BGA168 0.5mm pitch Material 7075-T6 Aluminum Alloy Kapton Polyimide Kapton Polyimide Material <not specified> 7075-T6 Aluminum Alloy Kapton Polyimide/ Cirlex Kapton Polyimide/Cirlex 7075-T6 Alumium Alloy 7075-T6 Alumium Alloy 7075-T6 Aluminum Alloy Stainless Steel (303) Material <not specified> Alloy Steel Alloy Steel Kapton Polyimide 17.225 4.00 (x4) 1.70 1.60 4 18.725 5 3.00 16 Description: XG-BGA617/BGA168 PoP socket for Agilent Probe board 14.725 4.60 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice. XG-BGA-5007 Drawing Ironwood Electronics, Inc. Tele: (800) 404-0204 www.ironwoodelectronics.com WEIGHT: 10.21 MATERIAL: N/A FINISH: N/A STATUS: Released SHEET 5 OF 5 DRAWN BY: V. Panavala SCALE: 3:1 File: XG-BGA-5007 DATE: 8/16/2012 REV. A