APPENDIX C - Environmental & Mechanical Specifications

APPENDIX C - Environmental & Mechanical
Specifications
FREQUENCY CONTROLLED PRODUCTS
GROUP 1
Temperature Cycling
Thermal Shock
Vibration
Drop Test
Humidity
Marking Permanency
Fine Leak Test
Gross Leak Test
Solderability
Lead Bend
GROUP 2
Temperature Cycling
Thermal Shock
Vibration
Drop Test
Humidity
Marking Permanency
Fine Leak Test
Gross Leak Test
Solderability
GROUP 3
Drop Test
Marking Permanency
Sealing
Soldering
±5 ppm max., -55°C to +85°C, 3 cycles,
2 hours max., reference to 25°C ±3°C.
+85°C and -55°C. Exposure time at
extreme temperature for 5 min., 3 cycles.
Frequency with an amplitude of 1.5mm
sweeping between 10Hz to 55Hz within
1 minute for 2 hours minimum on each
axis (X, Y, Z).
Natural drop on a hard wood board at
75 cm and 1 m, 3 times.
85% RH at +85°C, 96 hours minimum
Dip units in solvent, 10 strokes with
brush, 3 times.
Helium leak, less than 2 x 10-8 atm.cc /sec.
100% in De-ionized H 2O or Perfluorocarbon for 60s min. at 125°C
Dip in solder (230°C ±5°C) for 5 seconds.
More than 95% of surface being tested
should be coated uniformly with solder.
Will withstand maximum bend of 90°
reference to base for 2 bends.
±5 ppm max., -40°C to +85°C at 95% RH
ten times for 24 hours, 3 cycles then for
2 hours at 25°C ±3°C.
+85°C and -40°C. Exposure time at an
extreme temperature for 5 min., 3 cycles.
Frequency with an amplitude of 1.5mm
sweeping between 10Hz to 55Hz within
1 minute for 2 hours minimum on each
axis (X, Y, Z).
Natural drop on a hard wood board at
75cm, 3 times.
85% RH at +85°C, 96 hours minimum
Dip units in solvent, 10 strokes with
brush, 3 times.
Helium leak, less than 2 x 10 -8 atm.cc / sec.
100% in De-ionized H 2O or Perfluoro
carbon for 60s min. at 125°C
Dip in solder (230°C ±5°C) for 5 seconds.
More than 95% of surface being tested
should be coated uniformly with solder.
±5 ppm max. with natural drop on a hard
wood board at 75cm, 3 times or shock test
of 3000g x 0.3ms x ½ sine wave, 3 directions.
Dip units in solvent, 10 strokes with
brush, 3 times.
1 x 10 -2 μPa.m3 / s max.
Lead wires should be soldered within 105
with the iron heated to a temperature no
higher than 270°C
GROUP 4 (INTERNAL CRYSTAL)
±5 ppm max., -55°C to +85°C, 3 cycles,
2 hours max., reference to 25°C ±3°C.
Thermal Shock
+85°C and -55°C.
Exposure time at extreme temperature
for 5 minutes, 3 cycles.
Vibration
Frequency with an amplitude of 1.5mm
sweeping between 10Hz to 55Hz within
1 minute for 2 hours minimum on each
axis (X, Y, Z).
Drop Test
Natural drop on a hard wood board at
75 cm, 3 times.
Humidity
85% RH at +85°C, 96 hours minimum
Marking Permanency
Dip units in solvent, 10 strokes with brush,
3 times.
Fine Leak Test
Helium leak, less than 2 x 10 -8 atm.cc/sec.
Gross Leak Test
100% in De-ionized H 2O or Perfluoro
carbon for 60s min. at 125°C
Solderability
Dip in solder (230°C ± 5°C) for 5 seconds.
More than 95% of surface being tested
should be coated uniformly with solder.
Lead Bend
Will withstand maximum bend of 90°
reference to base for 2 bends.
Temperature Cycling
GROUP 5
Temperature Cycling
Thermal Shock
Vibration
Drop Test
Humidity
Solderability
Oscillation
Frequency change:
Capacitance Change:
Soak for 30 minutes at -55°C and +85°C
for 5 times, release to 25°C for 1 hour
prior to measurement.
Keep at 80°C ±5° for 96 ±4 hours,
release to 25°C for 1 hour prior to
measurement.
Keep at -30°C ±5° for 96 ±4 hours,
release to 25°C for 1 hour prior to
measurement.
Frequency with an amplitude of 1.5mm
sweeping between 10Hz to 55Hz within
1 minute for 2 hours minimum on each
axis (X, Y, Z).
Natural drop on a concrete floor at 1m
for 3 times.
90% RH at +40°C, 96 ±4 hours.
Dip in solder the leads no closer than
1.5mm at (350°C ± 10°C) for 5 ± 1 seconds.
More than 95% of surface being tested
should be coated uniformly with solder.
±0.3% Max.
±20% Max.
Fig. 1
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
Abracon Corporation. 30332 Esperanza, Rancho Santa Margarita, California 92688 Ph 949.546.8000 | Fx 949.546.8001 | www.abracon.com | abinfo@abracon.com
APPENDIX C - Environmental & Mechanical
Specifications
FREQUENCY CONTROLLED PRODUCTS
GROUP 6
Temperature cycling
High temperature
Low temperature
Humidity
Drop test
Soldering heat
.resistance
Washability
Vibration
Terminal strength
Solderability
For SMD
Soldering heat
.resistance
PCB bend strength
For Automotive
Temperature cycling
Subject the resonator to a low temperature of
-55°±2°C for 30 minutes, followed by a high
temperature of +85°C ±2°C. Cycling shall be
replaced 10 times. Then release the resonator
into the room condition for 1 hour prior to
measurement.
Subject the resonator to 85° ±2°C (125°C for
automotive) for 1,000 hours ±12 hours. Then
release the resonator into the room condition for
1 hour prior to measurement.
Subject the resonator to -55°C for 1,000 hours
±12 hours. Then release the resonator into the
room condition for 1 hour prior to measurement .
Subject the resonator to 60° ±2°C at 90 -95%
RH for 1,000 hours ±12 hours. Then release
the resonator into the room condition for 1 hour
prior to measurement.
Drop the resonator onto concrete floor from the
height of 1.0m at 3 times. No visible damage.
Dip the leads 2.0 ~ 2.5mm depth from bottom of
the resonator body for 10 ±1s at 260°C ±5°C
solder bath.
Ultrasonic wash 1 minute at 60°C in TCE, IPA,
and DI water (Frequency 28kHz, Output 20W/L).
Apply the resonator to vibration for 2 hours in the
X, Y, Z axes with the amplitude of 1.5mm. The
vibration shall be varied uniformly between the
limits and returned to 10Hz in 1 minute.
Apply 1kg pulling force along with the direction
of leads for 10 ±1s. Lead shall be subjected to
with stand against 90° bending in the direction of
thickness. No visible damage.
Dip the leads into the solution of 25% rosin and
ethyl alcohol and then into the solder bath (60/40
Sn/Pb) for 2 ±0.5 s at 235° ±5°C. Then release
the resonator into the room condition for 1 hour
prior to measurement. 95% min. lead terminals
shall be wet with solder.
Reflow: Preheat 140° ~ 160°C for 1 min. max.
temperature 230° ±5°C and above 200°C for
20s. max. and then leave in natural condition for
1 hour before measurement.
After soldered on the PCB, press it by up to
1mm and keep it for 5s, 5 times repeatedly.
Temperature cycling
( Continued)
Salt spray
Sulfuration
GROUP 7
Temperature cycling
High temperature
Low temperature
Humidity
Drop test
Solder heat resistance
Vibration
Terminal strength
Solderability
After being kept at room temperature, resonator
shall be placed at -55°C. After 30 minutes at this
temperature, resonator shall be taken out at
room temperature for 15 min. then placed at
temperature of +85°C.
Leak test
Requirements: Oscillating frequency deviation (from initial value): < ±0.3%
Capacitance change: < ±20%
After 30 minutes at this temperature, resonator
shall be returned to -55°C again. After 100
cycles, resonator shall be returned to room
temperature. Then release the resonator into
the room condition for 1 hour prior to
measurement.
After being placed in a chamber at 35° ±2°C,
density 5 ±1% (by weight) for 48 hours and
then being placed in natural condition for 1
hour, resonator shall be measured.
After being placed in a chamber with 1000ppm
sulfur density for 24 hours, and then being
placed in natural condition for 1 hour, resonator
shall be measured.
Subject the resonator to a 5 temperature
variations at low temperature of -40°± 2°C for
30 minutes, followed by a high temperature of
+100°C ± 2°C for 30 minutes in each cycle.
Then release the resonator into the room
condition for 1 hour prior to measurement.
Subject the resonator to 85° ±2°C for 500
hours ±12 hours. Then release the resonator
into the room condition for 1 hour prior to
measurement.
Subject the resonator to -40°C for 500 hours
±12 hours. Then release the resonator into the
room condition for 1 hour prior to
measurement.
Subject the resonator to 65° ± 2°C at 90 - 95%
RH for 500 hours ±12 hours. Then release
the resonator into the room condition for 1
hour prior to measurement.
Drop the resonator onto a hardwood board
with thickness of 3 cm from the height of 75cm
at 3 times. No visible damage.
Meet reflow conditions. see Fig. 1
Apply the resonator to vibration for 2 hours in
the X, Y, Z axes with the amplitude of 1.5mm.
The vibration shall be varied uniformly
between the limits at frequency 10Hz to
500Hz or acceleration 10g.
Apply 0.5 kg pulling force to each of the leads
for 30 ±5s. No visible damage.
Dip the leads into the solution of RMA flux for
5 ±0.5s under room temperature and then
into the solder bath (60/40 Sn/Pb) for 5 ±0.5s
at 230° ±5°C. Then release the resonator into
the room condition for 1 hour prior to
measurement. 95% min. lead terminals shall
be wet with solder.
Take measurement with a Helium leakage
detector at 1 x 10-2μPa.m3/s max.
Requirements: Oscillating frequency deviation (from initial value): < ±10ppm
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
Abracon Corporation. 30332 Esperanza, Rancho Santa Margarita, California 92688 Ph 949.546.8000 | Fx 949.546.8001 | www.abracon.com | abinfo@abracon.com
APPENDIX C - Environmental & Mechanical
Specifications
QUALITY NOTES
Abracon has been awarded ISO9000/QS9000
certification. In the early design and development stage,
we conduct extensive qualification tests to ensure that
each of the units manufactured will meet the minimum
reliability conditions as specified in the control drawings.
Reliability tests include physical dimensions, hermeticity,
solderability, humidity, operating life, heat and cold,
thermal shock, aging, resistance to solder heat,
flammability, lead strength, residual gas analysis, reflow.
We will apply customer’s test plan if it is more stringent
than Abracon test plan.
Products have been 100% inspected and tested with
Statistical Process Control (SPC) with CpK of 1.33 to
make sure that our products meet quality standards. Our
quality goals are:
Total Customer Satisfaction
Six Sigma Concepts
100% on-time delivery
8D/10-step Problem Solving Methodology
Potential Failure Mode and Effects Analysis (FMEA)
and Quality Control Plan.
SPC in manufacturing processes to minimize variation
between lots
Early participation in customer programs
Product Part Approval Process (PPAP)
Mean Time To Failure (MTTF):
Mean of the life
distribution for the population of devices under operation or
expected lifetime of an individual, MTTF = 1/ \ , which is the
time where 63.2% of the population has failed. Example:
For \ = 10FITs, MTTF = 100 millions hours.
Confidence Level (CL): Probability level at which
population failure rate estimates are derived from sample life
test. The upper confidence level interval is used (60%).
Acceleration Factor (AF): \ A constant derived from
experimental data which relates the times to failure at two
different stresses.
1
FAILURE RATE ( \ ) = ————————
TDH x AF
Where: TDH = No. of devices x hours at elevated
temperature
AF = Acceleration factor
Acceleration factor =
e
EA
____
k
1 _ ____
1
____
T1
T2
Theta = 60% Upper Confidence Limit
R = Number of Failures (see table)
EA = 0.4eV
K = Boltzmann constant 8.62 x 10 -5 eV/°K
T1 = 298°K (25°C)
T2 = 358°K (85°C)
X2 = Chi square value (see table)
Chi Square Distribution Function (60% Upper Confidence Level)
NUMBER
OF
FAILURES
X
VALUE
NUMBER
OF
FAILURES
X
VALUE
2
NUMBER
OF
FAILURES
X
VALUE
0
1
2
3
1.833
4.045
6.211
8.351
4
5
6
7
10.47
12.58
14.68
16.78
8
9
10
18.87
20.95
23.03
2
2
FAILURE IN TIME (FIT) = ( \ ) x 109
CALCULATION OF FIT AND MTTF (or MTBF)
Failure rate ( \ ): Measure of failure per unit of time. The
life failure rate is based on the exponential life distribution.
Failure in Time (FIT): Measure of failure rate in 109
device hours, e.g. 1 FIT = 1 failure in 109 device hours.
Total Device hours (TDH): The total number of units in
life test or operation multiplied by the time of test or
operation.
MEAN TIME TO FAILURE (MTTF) = 1/ \ x 109 hours
Example: No. of devices: 100, To tal hours =1,000 hours,
Te mperature (T2) at 125°C = 398K, zero failure
Device hours (TDH) = 100 x 1,000 = 100,000 device hours
Acceleration factor (AF) = 49.3
Failure rate ( \ ) = 202 x 10-9
Failure in time (FIT) = 202 FIT
Mean time to failure (MTTF) = 4.95 million hours
or Mean time between failure (MTBF)
ABRACON IS
ISO 9001 / QS 9000
CERTIFIED
Abracon Corporation. 30332 Esperanza, Rancho Santa Margarita, California 92688 Ph 949.546.8000 | Fx 949.546.8001 | www.abracon.com | abinfo@abracon.com