Opi2000M issM.pub - Bedford Opto Technology

OPI 2000M
This
component
is RoHS
compliant
High Speed Opto Isolator
Surface Mount
ATEX / IECEx Certified
Pb
The OPI 2000M High Speed Optically Coupled Isolator consists of a High Speed Infrared emitter
coupled to a silicon photo I.C. The unit is designed for applications requiring high voltage isolation
between input & output.
•
Surface Mount in Trays // Tape & Reel
•
High Speed 2Mb/sec.
•
10KV isolation
•
Low Propagation Delay
CERTIFICATE ATEX BAS01ATEX1285U/5
Confirmed conform to:EN60079-0:2012
EN60079-11:2012
EN60079-26:2007
Conditions of use apply:- See ‘Schedule of
limitations’ on certificate / Details repeated on
Page 4 this datasheet.
CERTIFICATE IECEx BAS 06.0021U/4
Confirmed conform to:IEC 60079-0:2011 Edition 6
IEC 60079-11:2011 Edition 6
IEC 60079-26:2006 Edition 2
Conditions of use apply:- See Schedule of
limitations on certificate / Details repeated
on Page 4 this datasheet
MECHANICAL DATA
14.45-0.0+0.2
6.65
9.25
SURFACE MOUNT LEAD FORM
CONDITIONS OF USE APPLY
+0.2
0
Emitter 0.4x0.45
6.5
1.75
0.4
10.50-0.0+0.2
SENSOR 0.5 SQ
0.5
2.54
1.91
1.91
GRD
K
PIN OUT
(TOP VIEW)
Vout
Vcc
BEDFORD OPTO TECHNOLOGY LTD
1,BIGGAR BUSINESS PARK, BIGGAR,LANARKSHIRE, ML12 6FX
Tel: +44 (0) 1899 221221 Fax : +44 (0) 1899 221009
Website: bot.co.uk E-mail: [email protected]
Iss M 20.10.12
An
1/5
OPI2000M
This
component
is RoHS
compliant
Pb
ABSOLUTE MAXIMUM RATINGS (25O C unless otherwise noted)
INPUT DIODE
FORWARD DC CURRENT
REVERSE DC VOLTAGE
POWER DISSIPATION
100mA
5 Volts
150mW (ii)
OUTPUT IC
MAX SUPPLY VOLTAGE
POWER DISSIPATION
7 Volts
165mW
OPERATING TEMP
-40 OC TO +80 OC
STORAGE TEMP
-40 OC TO +80 OC
+ 10KV DC (i)
INPUT-TO-OUTPUT ISOLATION VOLTAGE
i)
ii)
Measured w ith the input leads and output leads shorted together for one min.
Thermal resistance 450 K/W
Whilst the devices are capable of operating continually at the noted elevated
temperatures users should be aw are of the possibility of the need to increase the diode
current to trigger the device over long periods at high temperatures & currents.
CIRCUIT
Vgen
Rf
GND
+
+
RL
Vout
C
Vcc
R L=560 ohm C=0.01uF
Waffle Trays - 100 per tray 290mm x 200mm.
Tape & Reel - 300 Devices per 13” Diam Reel with 7” Hub 24mm Wide tape.
BEDFORD OPTO TECHNOLOGY LTD
1,BIGGAR BUSINESS PARK, BIGGAR,LANARKSHIRE, ML12 6FX
Tel: +44 (0) 1899 221221 Fax : +44 (0) 1899 221009
Website: bot.co.uk E-mail: [email protected]
Iss M 20.10.12
Packing
2/5
OPI 2000M
This
component
is RoHS
compliant
Pb
BEDFORD OPTO TECHNOLOGY LTD
1,BIGGAR BUSINESS PARK, BIGGAR,LANARKSHIRE, ML12 6FX
Tel: +44 (0) 1899 221221 Fax : +44 (0) 1899 221009
Website: bot.co.uk E-mail: [email protected]
Iss M 20.10.12
ADVISED SOLDERING CONDITIONS
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OPI 2000M
OPTO ELECTRONIC DATA (TA = 25OC)
PARAMETER
This
component
is RoHS
compliant
Pb
SYMBOL
MIN
TYP
MAX
UNITS
TEST CONDITIONS
Forward Voltage
VF
-
1.35
1.6
V
If=100mA tp=20mS
Reverse Voltage
VR
5.0
-
-
V
Ir = 100uA
INPUT DIODE
OUTPUT IC ( Vcc=4.75 to 5.25 )
High level Output Current
I CH
-
100
uA
Ic = 10 uA
Low Level Output Voltage
VOL
-
0.6
V
IF= 10mA IOL= 2.6mA
High Level Supply Current
ICCH
15
mA
IF=0
Low Level Supply Current
ICCL
18
mA
IF=7.5mA
COUPLED(Vcc=5v olts)
Propagation Delay to Low Output lev el
t PLH
800
nSecs
R L= 560ohms C=0.01uF
Propagation Delay to High Output Lev el
t PHL
800
nSecs
ditto
Input/Output Isolation Voltage
Vi-o
Volts
Input and output leads shorted
10kV
SCHEDULE OF LIMITATIONS
EC TYPE EX AMIN ATION CERTIFICATE No. BAS01 ATEX1285U/5
28th September 2012
SCHEDULE OF LIMITATIONS
1 ) - The surface mounted Opto Is olator OPI2000M must be mounted on a p.c.b. having a CTI of at least 175 so that creepage and clearanc e distances are
not impaired. The surface mounted device is designed for the pins to be s oldered to the pads on the same si de of the printed circuit board as the
c omponent and must onl y be used either:a) on a printed circuit board which is potted provi ded that the pad s egregation mai ntains at least 2mm under potting.
OR
b) on a printed circuit board which is c oated provided that the pad segregation mainyains at least 3.3mm under coating. Where the coating shall
seal the connections after s oldering and s hall be two coats if applied by s praying OR a single coat if dipped, brus hed or vacuum i mpregnated.
A CTI of at least 175 shall appl y to both the pc b substrate and the coating material.
This c ondition 1), does not apply to the thr ough hole version, OPI2000MTH for voltages up to 375V peak or d.c. provided that the mounti ng arrangement
does not reduce the creepage distances to less than 10mm.
2) - The Opto Isol ators OPI2000M and OPI2000MTH may be us ed to provide isolati on between either:(i) A non-intrinsically s afe circuit and an intrinsicall y safe circuit, (Non IS:IS), where the IS circuit voltage is not greater than 75 Volts peak or d.c ..
OR
(ii) Two intrinsicall y safe circuits (IS:IS), where the sum of the two circuit voltages is not greater than 375 Volts peak or d.c..
3) - The Opto Isol ators OPI2000M and OPI2000MTH must be ins talled suc h that the connection pins are provided with a degree of protection of at least
IP20 where gass es and vapours may be pres ent. If the Opto Is olators are to be i nstalled where dusts r epres ent a hazar d, then it must be pr ovi ded with
a degree of protec tion of at l east IP54 and the overall apparatus must be appropriatel y certified for the requirements for Dusts.
4) - The Opto Isol ators OPI2000M and OPI2000MTH must be ins talled with external power limiting components as s pecifi ed in:EN60079-11:2012, Claus e 8.9.2.
CERTIFICATE No.:- IECEx BAS 06.0021U
Date of Issue:- 2012-10-02
ISSUE No.: 4
SCHEDULE OF LIMITATIONS
1. W hen used in intrinsically safe apparatus it will be necessary to determ ine a surface tem perature
classification for the opto-isolator:2. The Opto Isolator m ust be m ounted on a printed circuit board such that creepage and clearance
distances are not im paired.
3. The Opto C oupler m ust be installed such that the connection pins are provided with a degree of
protection of IP20 where gasses and vapours m ay be present. If the Opto C oupler is to be installed within apparatus where flamm able
dusts represent the hazard then it m ust be prov ided with a degree of protection of IP54 and the
apparatus m ust be appropriately certi
f ied f or dust hazards.
4. Surface Mount OPI2000M only and in addition to above:
The surf ace m ount OPI2000M m ust only be used on a printed circuit board that is either:
a) potted, providing the pad segregation rem ains at least 2m m under the potting
OR
b) conf orm ally coated, prov ided the pad segregation rem ains at least 3.3m m under the coating. The conf orm al coating m ust hav e C TI
in excess of 175.
5. The Opto Isolator m ust be installed with external power lim iting com ponents as specif ied in:- IEC 60079-11:2011 Ed 6, C lause 8.9.2.
BEDFORD OPTO TECHNOLOGY LTD
1,BIGGAR BUSINESS PARK, BIGGAR LANARKSHIRE, ML12 6FX
Tel: +44 (0) 1899 221221 Fax: +44 (0) 1899 221009
Website: bot.co.uk E-mail: [email protected]
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Iss M 20.10.12
OPI 2000M
CONFORMITY STATEMENT
OPI2000M
This
component
is RoHS
compliant
Pb
Manufacturer:- BEDFORD OPTO TECHNOLOGY LTD
Address:1 Biggar Business Park, Market Road, Biggar,
Lanarkshire, ML12 6FX, Scotland
Directive 94/9/EC
EC-Type Examination Certificate:BAS01ATEX1285U – Latest supplement BAS01ATEX1285U/5 issued Sept 2012
Provisions of the Directive fulfilled by the component:Ex ia IIC Ga (-40°C ≤ Ta ≤ +80°C)
II 1 GD
Ex ia IIIC Da (-40°C ≤ Ta ≤ +80°C)
Notified Body for EC-Type Examination
BASEEFA Ltd.
Rockhead Business Park,
Staden Lane,
Buxton,
Derbyshire SK17 9RZ,
England
& Production:- BASEEFA Ltd. – No.1180
Tel:- +44 (0)1298 766600
Fax:- +44 (0)1298 766601
e-mail:- [email protected]
Harmonised Standards used:EN60079-0:2012
EN60079-11:2012
EN60079-26:2007
Other Standards used:-
_________________________________
Mr R.W.Stott
PPManaging Director
Iss M 20.10.12
On Behalf of Bedford Opto Technology Ltd., I declare that, the date the component
accompanied by this statement is placed on the market, the component conforms
with all technical and regulatory requirements of the ATEX Directive 94/9/EC and
the RoHS Directive 2011/65/EU.
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