VINCOTECH JZD720 20130110

(CP608)JZD720
HIGH VOLTAGE RECTIFIER CHIPS
1. FEATURE
(1) SIPOS and Glass passivation structure
(2) High voltage (1600V)
(3) Suitable for wire bond assembly
2. Die Size
(1) 7.2mm×7.2mm
3. Application
(1) Rectifier power supply
(2) Other application for rectifier
4. Maximum Rating
Items
Repetitive Peak Reverse Voltage
Non Repetitive Peak Revers Voltage
Average Forward Current
Peak Surge Forward Current
Value For Fusing
Operating Junction Temperature
Symbol
VRRM
VRSM
IF(AV)
IFSM
I2 t
Tj
K
A
Ta=25℃, Unless otherwise specified
Condition
Unit
V Assembled for TO-247 Package
V Assembled for TO-247 Package
A Tj = 150 °C,Assembled for TO-247 Package
A Tj = 150 °C,50HZ, Assembled for TO-247(W/B)
A2s Tj = 150 °C, tp=10 ms, sin 180°
Value
1600
1700
60
890
3960
-40~150
℃
5. Out-going Inspection
Items
Reverse Current
Forward Voltage
Visual Inspection
Symbol Unit
IR
VF
mA
V
Standard Value
Condition
VR=1600V
Min
Ave
Max
Tj=25℃
-
-
0.1
Tj=150℃
-
-
2
-
-
1.5
-
-
0.95
-
-
1.1
-
-
IF=60A, Assembled by TO-247
IF=5A,CP Test
(1) Glass Crack
(2) Bristletail and dirty level of metal layer surface
Inspection
Numbers
Extraction
All
Numbers
A
U
V
Name of Part
Explanation
Symbol Unit
Size
Die Size
U
mm 7.2±0.05
Outer size of the Moat
V
mm 7.06±0.05
Inner size of the Moat
W
mm 6.18±0.1
Metallization area
X
mm 6.06±0.1
Wafer Thickness
Y
μm 300±10
Depth of the Moat
Z
μm 115±20
Thickness of the
Front μm
6~8
Al(top)
metal layer
Rear μm 1.7~2.3 Ti-Ni-Ag
X
W
6. Die Structure
Z
Y
K
Qidong JieJie Micro-electronic Co., Ltd.
http://www.jiejie-cn.com
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