Intel Server System SR1680MV Product Brief 322341

Product Brief
Intel® Server System SR1680MV
Intel® Server System SR1680MV
Purpose built to meet your increasing compute density needs, the cable-free, half-width,
Intel® Server System SR1680MV features high memory capacity (36 DDR3 DIMMs) and
flexible I/O capability making it ideal for virtualization and a broad range of HPC applications
Key Features
Increased Performance
Four Intel® Xeon 5600 series processors (two per node), deliver increased
memory bandwidth and greater application performance
l
n
36 DDR3 DIMMs (18 per board) ensure sufficient bandwidth and memory
capacity for all of your virtualization requirements
n
Compute Density
System supports two dual socket/18 DIMM server boards in a single 1U chassis
l
n
Reduced TCO
Delivers all of the benefits of two high performance servers in a single ultra-dense
1U rack mount system, saving you valuable data center rack space and reducing your TCO
l
n
n
High-efficiency (80-plus GOLD) power supply
Ease of Use
Modularized, cold-swappable design features an independent, cable-free main board
that can be removed without shutting down both nodes
l
n
Target Applications: High Performance Computing (HPC) segment applications that require
maximum compute density, such as Life Sciences, Energy, Financial Services and Manufacturing
Features and Benefits
• System supports two dual socket/18DIMM server boards in a single 1U chassis Delivers all of the benefits of two high performance servers in a single ultra-dense 1U
rack mount system, saving you valuable data center rack space and reducing your TCO
• Supports up to four Intel® Xeon® Processor 5500 or 5600 series Four total
Intel® Xeon processors, (two per node) deliver HPC level performance with increased
memory bandwidth, improved energy efficiency, lower TCO and greater application
performance
• Extensive DDR3 memory capacity and bandwidth A total of 36 registered or
unbuffered DIMMs (18 per board) at up to 1333 MHz, and 6 memory channels ensure
sufficient bandwidth and memory capacity for all of your virtualization requirements
• Flexible & expanded I/O Each node features an independent flexible & pluggable
I/O tray which supports a PCI-E* 2.0 x8 riser plus your choice of either a 10Gbe or
QDR Infiniband* expansion module via the Intel® I/O Expansion connectors
• Cable-free & pluggable design Maximize your up time with this modularized,
cold-swappable design, featuring an independent, cable-free main board that can be
removed without shutting down both nodes. Main board and I/O board both sit on
separate aluminum trays and are connected via a high speed PCI interconnect
• High-efficiency power supply A single high-efficiency (80-plus Gold) 1100-watt
PSU supports both nodes independently via pluggable “smart” power connectors and
power distribution board design
• Flexible storage configuration Up to four 2.5” hot swap SATA HDD (two HDD per
node) provides OS mirroring capability on each node
• Intel® Enabled Server Acceleration Alliance (Intel® ESAA) Certified
Pre-tested hardware and software configuration recipes make it easy
for you to deploy server solutions over a range of applications
Intel® Server System SR1680MV Technical Specifications
Form Factor
1U half-width rack system
Processors
Supports up to four Intel® Xeon® Processor 5500 or
5600 series1
Chipset
Intel® 5500 chipset with Intel® ICH10R
Intel® Quick Path Technology
4.8GT/s, 5.86GT/s and 6.4GT/s
Memory Capacity
Eighteen DDR3 DIMMs (Registered or Unbuffered) per
node (36 total)
l Six channel native (800/1066/1333MHz)
Drive Options
Up to 4 2.5” hot-swap SATA hard drives (2 per node)
Storage
Four SATA ports (3 Gbps) via ICH10R with
Intel® Embedded Server RAID Technology
Intel® RAID Support
Integrated SATA: Intel® Embedded Server RAID
Technology with host-based software RAID levels 0, 1
Expansion Slots
1 PCI Express* 2.0 x8 (half-length, low profile) plus
1 Intel® I/O Expansion module – PCI Express 2.0 x8
(10 Gbe and QDR Infiniband* options) per node
Power Supply
High Efficiency (80-plus Gold) 1100-watt
non-redundant PSU
Integrated LAN
Embedded Intel® Dual-Gigabit Controller 82576EB with
Intel® Virtualization Technology2
Integrated Graphics
Server Engine* LLC Pilot II* with 64 MB DDR2 memory,
8 MB allocated to graphics
Front Panel Features
Separate front panel for each node featuring:
l LEDs for one NIC, one SATA, System Health, Power
and UID
l Button for UID and Power
l One VGA port
l One Serial port
l Two USB ports
Management Hardware
l On-board Server Engines*(TM) Pilot II* Server Management Controller
l Baseboard Management Module with IPMI 2.0
l Serial-Over-LAN support
l IPMI 2.0
3
3
3
3
4
2
2
2
2
1
5
1
5
5
5
1 Modular, cable-free design
2 Two 18 DDR3 DIMMs mainboards
3 PCI-e 2.0 x8 plus Intel® I/O expansion module support
4 1100-watt High efficiency (80 Plus GOLD) PSU
5 Two 2.5” hot-swap SATA drive per node
Safety and EMC Regulatory Compliance
Regulatory compliance for an Intel host system is based on the use of an Intel server base board that was
tested in the host chassis and found compliant. Intel server base boards and host chassis are tested to
Class A EMC requirements. Intel server products comply with RoHS (Restriction of Hazardous Substances).
Region (Compliance Obtained)
Argentina (IRAM)
Board Markings
Host Chassis Markings
Regulation N/A
For more information on Intel® Server Products, visit:
www.intel.com/go/serverproducts
Australia (ACA) / New Zealand (MED)
Belarus
To build your system and get more details on server
configurations from Intel visit:
www.intel.com/go/serverconfigurator
Regulation N/A
Canada
ICES-003
China
Regulation N/A
Europe (EU Directives) - LVD & EMC require CE
mark; No mark required for RoHS; WEEE marking
added voluntarily for end integrator convenience)
Germany GS for Chassis Only; German Green
Dot (Duales System Deutschland) for Board
Packaging Only
International Compliance (CB Report &
CISPR Emission & Immunity)
Japan (VCCI for chassis only) & Japan Recycling
Marks on Board Retail Packaging Only
Marking Not Required
Regulation N/A
Marking Not Required
Korea (KCC)
Russia (GOSSTANDART)
Regulation N/A
Taiwan (BSMI)
Ukraine (UKRTEST)
United States NRTL & FCC (For Board Products
FCC Notation May Be in Documentation)
Regulation N/A
Marking Not Required
This device complies with part 15 of the FCC Rules. Operation is
subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any
interference received, including interference that may cause
undesired operation
1
When installing two processors, both processors must be from the same processor series; either two Intel® Xeon® processor 5500 series or two Intel® Xeon® processor 5600 series. Out of the box support for the Intel Xeon 5600 series processors will be indicated by the addition of the letter “R” at the end of the Product Order Code. For boards and systems currently supporting the Intel Xeon 5500 series, a BIOS update is required before installing the 5600 series processor(s). Refer to http://support.intel.com for more information. 2
Intel® Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor (VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible with all operating INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE
AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL
PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and
shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Intel, the Intel logo, Xeon and Xeon Inside are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved. 0310/JH/MD/PDF 322341-002US