EnerChip™ CBC012 - Cymbet Corporation

Product Discontinued - Not for New Designs
EnerChip™ CBC012
Rechargeable Solid State Energy Storage: 12µAh, 3.8V
All Solid State Construction
SMT Package and Process
Lead-Free Reflow Tolerant
Thousands of Recharge Cycles
Low Self-Discharge
Eco-friendly, RoHS compliant
Electrical Properties
Output voltage (nominal):
Capacity (nominal):
Charging source:
Recharge time to 80%:
Charge/discharge cycles:
4.00V to 4.15V
10 minutes
>5000 to 10% DOD
Package size (DFN): Operating temperature:
Storage temperature:
5 mm x 5 mm x 0.9 mm
-40°C to 70°C
-40°C to 125°C
Physical Properties
• Standby supply for non-volatile SRAM, real-time
clocks, controllers, supply supervisors, and other
system-critical components.
• Wireless sensors and RFID tags and other
powered, low duty cycle applications.
• Localized power source to keep microcontrollers
and other devices alert in standby mode.
• Power bridging to provide backup power to
system during exchange of primary batteries.
• Embedded Energy where bare die can be
embedded into modules or co-packaged with
other ICs
Pin Number(s)
Note: NIC = No Internal Connection
5 mm x 5 mm
DFN SMT Package
The EnerChip™ CBC012 is a surface-mount, solid
state, thin film, rechargeable energy storage device
rated for 12µAh at 3.8V. It is ideal as a localized
on-board power source for SRAMs, real-time clocks
and microcontrollers which require standby power
to retain time or data. It is also suitable for RFID
tags, smart sensors, and remote applications which
require a miniature, low-cost, and rugged power
source. For many applications, the CBC012 is a
superior alternative to button cell batteries and
Because of their solid state design, EnerChip™
storage devices are able to withstand solder reflow
temperatures and can be processed in highvolume manufacturing lines similar to conventional
semiconductor devices. There are no harmful gases,
liquids or special handling procedures, in contrast to
traditional rechargeable batteries.
The CBC012 is based on a patented, all solid state,
rechargeable energy cell with a nominal 3.8V output.
Recharge is fast and simple, with a direct connection
to a 4.1V voltage source and no current limiting
components. Recharge time is 10 minutes to 80%
capacity. Robust design offers thousands of charge/
discharge cycles. The CBC012 is packaged in a 5 mm
x 5 mm 6-pin DFN package. It is shipped in tubes,
tape-and-reel, or waffle pack trays.
6 5
CBC012 Schematic Representation
Top View
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev CPage 1 of 5
EnerChip™ CBC012 Solid State Energy Storage
Operating Characteristics
Discharge Cutoff Voltage
Charge Voltage
Pulse Discharge Current
Cell Resistance (25°C)
Charge cycle 2
Charge cycle 1000
% per year
% per year
Operating Temperature
Storage Temperature
Self-Discharge (5-yr. average; 25°C)
Recharge Cycles
(to 80% of rated
capacity; 4.1V charge
Recharge Time (to 80% of rated capacity;
4.1V charge voltage)(5)
Variable - see App. Note 1025
10% depth-of-discharge
50% depth-of discharge
10% depth-of-discharge
50% depth-of-discharge
Charge cycle 2
Charge cycle 1000
50µA discharge; 25°C
Failure to cutoff the discharge voltage at 3.0V will result in EnerChip performance degradation.
Charging at 4.0V will charge the cell to approximately 70% of its rated capacity.
First month recoverable self-discharge is 4% average.
Storage temperature is for uncharged EnerChip.
EnerChip charging time and cell resistance increase approximately 2x per 10°C decrease in temperature.
EnerChip Discharge Characteristics
Note: All specifications contained within this document are subject to change without notice
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev C
Page 2 of 6
EnerChip™ CBC012 Solid State Energy Storage
Package Dimensions - 6-pin DFN (package code D5)
Cymbet Logo
Lot Number
Part Number
Date Code
Bottom view
Side view
1. All linear dimensions are in millimeters.
Pin Number(s)
Chip Labeling
Note: NIC = No Internal Connection
Printed Circuit Board (PCB) Layout Guidelines and Recommendations
Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup
energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering
power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the
board following soldering.
The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each
other and under the package, where it is difficult to wash the flux residue away. In this scenario, solder flux
residue can wick from the positive solder pad, covering both the positive pad and the via. This results in a high
resistance current path between the EnerChip terminals. Such a current path will make the cell appear to be
defective or make the application circuit appear to be drawing too much current. To avoid this situation, make
sure positive and negative traces are routed outside of the package footprint, thus ensuring flux residue will not
cause a discharge path between the positive and negative pads.
Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the
underside of the package as well as any solder pad on the PCB that would be connected to that exposed die
pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a
solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder
pads only where the package leads will be. That region of the PCB where the exposed die pad will land must
not have any solder pads, traces, or vias.
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev C
Page 3 of 6
EnerChip™ CBC012 Solid State Energy Storage
When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of
the package and all metal pads. Failure to observe this precaution can result in package cracking during solder
reflow due to the silk screen material interfering with the solder solidification process during cooling.
For the CBC012-D5C the PCB layout of Figure 4 is recommended. Note that there should NOT be a center pad
on the PCB that could contact the exposed die pad on the D5C package. Again, this is to reduce the possible
number and severity of leakage paths between the EnerChip terminals.
Recommended PCB layout to accommodate CBC012 package.
There are several PCB layout considerations that must be taken into account when using the EnerChip:
• All capacitors should be placed as close as possible to the EnerChip.
• Power connections should be routed on the layer the EnerChip is placed.
• Any flying capacitor connections must be as short as possible and routed on the same layer as the
EnerChip is placed.
• A ground (GND) plane in the PCB should be used for optimal performance of the EnerChip.
• Very low parasitic leakage currents from the VBAT pin to power, signal, and ground connections, can
result in unexpected drain of charge form the integrated power source. Maintain sufficient spacing
of traces and vias from the VBAT pin and any traces connected to the VBAT pin in order to eliminate
parasitic leakage currents that can arise from solder flux or contaminants on the PCB.
• On the EnerChip CC, Pin 1 VBAT and Pin 4 VCHG must be tied together for proper operation.
• See the section on assembly repair techniques for additional information on board layout guidelines.
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev C
Page 4 of 6
EnerChip™ CBC012 Solid State Energy Storage
When soldering the EnerChip using by hand at a soldering station, adhere to the following guidelines:
• Observe the ESD precautions outlined in this document.
• Never solder an EnerChip that has been partially or fully charged, even if the EnerChip is in a
discharged state. This includes wave soldering and reflow soldering.
• Minimize the amount of time that heat is applied to the EnerChip. Using a tweezer-type soldering iron
tip that applies heat to two opposite sides or the entire perimeter of the device simultaneously will
result in more uniform heating of the package and for a shorter period of time than when soldering one
pin or package edge at a time.
• If possible, apply solder paste to the solder pads on the PCB prior to placing the EnerChip on the board;
this will promote wetting of the solder and reduce the amount of time the soldering iron is applied to the
component and solder pads.
• Place the EnerChip onto the PCB by hand and solder in place rather than grabbing the EnerChip with
a heated tweezer-type tip and placing the EnerChip on the board with the iron. This will minimize the
amount of time the EnerChip is exposed to heat.
• Most surface mount packages have metal leadframe tie points that do not extend to the bottom surface
of the package but are exposed on two more of the package sidewalls. When soldering, ensure that
solder does not cover these tie points, as this situation could result in package pins being shorted to
one another through the metal leadframe.
Should the need arise to replace an EnerChip that has already been soldered to a circuit board, due to battery failure, improper package placement, or other circumstances, it is recommended that the EnerChip being
replaced be discarded and replaced with a new EnerChip. When removing the EnerChip from the board, use
a tweezer-type soldering iron tip that heats opposite sides of the package simultaneously and lift the package
from the board. When applying the new EnerChip to the board, follow the hand soldering guidelines in the previous section.
For QFN-style packages, use a hot air rework station to remove a defective or misplaced EnerChip package. If
there are other EnerChips in the vicinity of the EnerChip being replaced, use proper heat shielding to protect
the adjacent EnerChip package from the heat source and turn off any heat source that would otherwise be
used to heat the bottom of the board during removal of the EnerChip. This will prevent the adjacent EnerChip(s)
from being damaged during the rework procedure.
If it is not possible to replace the EnerChip with a new EnerChip, use extreme care when removing the EnerChip
from the board to minimize the amount of time heat is applied to the package during removal and re-soldering.
Follow the guidelines in the previous section pertaining to hand soldering. Under no circumstances should an
EnerChip that has been partially or fully charged - even if subsequently discharged - be subjected to reflow,
wave, or hand soldering.
Conductive epoxy may also be used as an attachment method. If the cure temperature is above 70°C, then a
new (i.e., never charged) EnerChip must be used.
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev C
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EnerChip™ CBC012 Solid State Energy Storage
Ordering Information - available for Last Time Buy until September 12, 2014
EnerChip Part Number
12µAh EnerChip in 6-pin DFN, tube
Not for new designs
12µAh EnerChip in 6-pin DFN, Tape/Reel 1k parts
Not for new designs
12µAh EnerChip in 6-pin DFN, Tape/Reel 5k parts
Not for new designs
12µAh EnerChip in 6-pin DFN, Waffle Pack
Not for new designs
Disclaimer of Warranties; As Is
The information provided in this data sheet is provided “As Is” and Cymbet Corporation disclaims all representations or warranties of any
kind, express or implied, relating to this data sheet and the Cymbet EnerChip product described herein, including without limitation, the
implied warranties of merchantability, fitness for a particular purpose, non-infringement, title, or any warranties arising out of course of
dealing, course of performance, or usage of trade. Cymbet EnerChip products are not approved for use in life critical applications. Users
shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted
for use and are solely responsible for all legal, regulatory, and safety-related requirements concerning their products and applications and
any use of the Cymbet EnerChip product described herein in any such product or applications.
Cymbet, the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation. All Rights Reserved
©2009-2014 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com
DS-72-02 Rev C
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