Introduction to ESMT Known Good Die 1Q of Y2006 Why Choose ESMT as Partner of MCP / MCM / SiP ESMT’s KGD(Known Good Die) Can meet top level (level1) requirement as definition of EIAJ EDR-4703 : Make KGD reach the same quality/reliability level as packaged products should be. Level 1: KGD (Known Good Dice) Level 2 : KTD (Known Tested Die) Level 3 : PD (Probed Die) KGD Definition in EIAJ EDR-4703 EIAJ EDR-4703 : Bare die quality level classification Level 1 Level 2 LEVEL KGD KTD Visual mechanical V Level 3 PD V V Electric characteristics V V not assured after mounting Early failures V not assured not assured Long-term reliability V not assured not assured Why Choose ESMT as Partner of MCP / MCM / SiP Well-experienced KGD business relationship with alliances. Excellent power consumption makes your MCP solution much powerful in handset/portable solution. ESMT Mobile SDRAM series product perform 88% off power consumption against normal SDRAM. Well Experience in KGD for MCP/SiP of Diverse Applications DSC Digital TV LCD Controller MP3 Mobile phone Optical Storage Portable Multimedia Player ESMT KGD Ordering Information - List of Available part 1Mx16 SDRAM (1.8V~3.3V) : M12L16161A / M12S16161A / M12D16161A 4Mx16 SDRAM (1.8V~3.3V) : M12L64164A / M12S64164A / M12D64164A 2Mx32 SDRAM (1.8V~3.3V) : M12L64322A / M12S64322A / M12D64322A 4Mx32 SDRAM (2.5V~3.3V) : M12L128324A / M12S128324A 4Mx32 DDR SDRAM (2.5V) : M13S128324A Logistic Control of ESMT KGD Stable supply and reasonable delivery schedule(lead-time) reduce risk on your production control. ESMT supports logistic control for your MCP assembly both in data flow and material flow. Further Information Requirement on ESMT’s KGD Welcome to contact us for further information you need such as wafer testing flow, power consumption and quality/reliability control flow. Emmie Wang : Technical Marketing , [email protected] 886-3-5781970 ext 1113 ESMT is your best partner on memory die support for your Multi-chip package