23019

CSP/µBGA Test & Burn-in Socket
for Devices up to 40mm Square
FEATURES
•Aries unique universal socketing system allows the socket to be easily configured for any package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no
tooling charge or extra lead-time.
•For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP,
SOIC, LGA, LCC, PLCC, TO and any SMT package style made. Also can be compatible with PGA
packaged devices.
•Quick and easy Probe Replacement System: the complete set of probes can be removed and
a new set (interposer) can be inserted quickly and easily. The old set can be returned to the
factory for repair and sent back within one day.
•4-point crown insures “scrub” on solder oxides.
•Single Point Probes available for small land area contact pads.
•Signal path during test only 0.077 [1.96].
•Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression Spring-Probes which are
accurately located by 2 molded plastic alignment pins and mounted with 4 stainless
ORDERING INFORMATION
steel screws.
Consult Factory
•The Au over Ni-plated compression Spring-Probes leave very small witness marks
on the bottom surface of the device solder balls.
•Standard molded socket format can accommodate any device package of 40mm or smaller.
•Pressure pad compression spring provides proper force against device and allows for height variations in device thickness.
GENERAL SPECIFICATIONS
•MOLDED SOCKET COMPONENTS: UL94V-0 PEEK and/or Ultem
•1dB BANDWIDTH: 1GHz (0.80mm pitch) (large probe)
•ESTIMATED CONTACT LIFE: 500,000 cycles
•COMPRESSION SPRING PROBES: heat-treated BeCu with 30µ [0.75µ] min. Au per MilG-45204 over 30µ [0.75µ] min. Ni per SAE-AMS-QQ-N-290
•CONTACT FORCE: 6g per contact on 0.20-0.29mm pitch
: 15g per contact on 0.30-0.35mm pitch
: 16g per contact on 0.40-0.45mm pitch
: 25g per contact on 0.50-0.75mm pitch
: 25g per contact on 0.80mm pitch or larger
•OPERATING TEMPERATURE: -55°C [-67°F] min. to 150°C [302°F] max.
•ALL HARDWARE: Stainless Steel
•TYPICAL BURN-IN TEMPERATURE: 150°C max.
MOUNTING CONSIDERATIONS
•See “PCB FOOTPRINT TOP VIEW” for requirements
•SOCKETS: must be handled with care when mounting or removing sockets to/from PCB
•TEST PCB MINIMUM DIAMETER “G”: 0.025 [0.64] (large probe 0.80mm pitch and larger)
: 0.015 [0.38] (small probe 0.50-0.75mm pitch)
: 0.012 [0.31] (small probe 0.40-0.45mm pitch)
: 0.009 [0.23] (small probe 0.30-0.35mm pitch)
: 0.004 [0.10] (small probe 0.20-0.20mm pitch)
•TEST PCB DIAMETER SPRING PROBE PAD PLATING: 30µ [0.75µ] min. Au per MIL-G-45204
over 30µ [0.75µ] min. Ni per SEA-AMS-QQ-N-290. Pad must be the same height as top
surface of PCB. Please refer to the Custom Socket Drawing supplied by Aries after receipt of
your order for your specific application.
•Some applications may require a Backup Plate. See drawing for more information.
A detailed device drawing must be
sent to Aries to quote and design
a socket.
__________________________
See Data Sheet for...
CSP Sockets
23016 Hybrid Socket
23021 µBGA up to 6.5mm
23017 µBGA up to 13mm
23018 µBGA up to 27mm
23018-APP w/Adj Pressure Pad
23020 µBGA up to 55mm
23023 Optical Failure Analysis
RF Sockets
24013 RF up to 6.5mm
24008 RF up to 13mm
24009 RF up to 27mm
24009-APP w/Adj Pressure Pad
24011 RF up to 40mm
24012 RF up to 55mm
24010 RF Machined Socket
23022 Kelvin Test Socket
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23019
1 of 2
Rev. 1.3
CSP/µBGA Test & Burn-in Socket
for Devices up to 40mm Square
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL TOLERANCES: ±0.005 [0.13]
UNLESS OTHERWISE SPECIFIED
CUSTOMIZATION: In addition to the
standard products shown on this
page, Aries specializes in custom
design and production. Special materials, platings, sizes, and configurations can be furnished, depending on
the quantity. NOTE: Aries reserves
the right to change product general
specifications without notice.
SPRING PROBES
Bristol, PA 19007-6810 USA
TEL (215) 781-9956 • FAX (215) 781-9845
WWW.ARIESELEC.COM • [email protected]
PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED
23019
2 of 2
Rev. 1.3