Series 511 Standard DIP Socket w/Bifurcated Contacts & Solder Pin Tails FEATURES • Bifurcated Contacts with Solder Tail or Wire Wrap Pins GENERAL SPECIFICATIONS • STANDARD BODY: Black UL 94V-0 Glass-filled 4/6 Nylon • BIFURCATED CONTACTS: Grade A Spring-tempered Phosphor Bronze per QQ-B-750 • PIN PLATING: 50-130µ min. matte Sn per ASTM B545-97(2004)e1 over 50µ Ni per SAE AMSQQ-N-290B; –OR– 50-130µ 90/10 Sn/Pb per MIL-T-10727 Type 1 over 50µ Ni per SAE AMSQQ-N-290B; –OR– 10µ [0.25µ] min. Au per MIL-G-45204 over 50µ Ni per SAE AMS-QQ-N-290B • CONTACT CURRENT RATING: 1 amp ORDERING INFORMATION • OPERATING TEMPERATURE: -67°F to 221°F [-55°C to 105°C] Sn; -67°F to XX-X 511-X XXX XX 257°F [-55°C 125°C] Au • INSERTION FORCE: 110g/pin average Rails Option • WITHDRAWAL FORCE: 75g/pin average WR=Without Rails • ACCEPTS LEADS: Flat up to 0.014 thick x 0.020 wide [0.36 x 0.51], Round up to Plating 0.020 [0.51] dia. 0=Sn • LEAD LENGTHS: accepts lengths from seating plane from 0.075-0.160 [1.91 1=Au 4.06] 0TL=Sn/Pb Termination 1=Solder Pin Tail MOUNTING CONSIDERATIONS • SUGGESTED PCB HOLE SIZE: 0.035 ±0.002 [0.89 ± 0.05] dia. Series Row-to-Row Spacing (Dim. “C”) 2 =0.200 [5.08] 3 =0.300 [7.62] 4 =0.400 [10.16] 6 =0.600 [15.24] No. of Pins (See Table) Centers “C” 0.200 [5.08] 0.300 [7.62] 0.400 [10.16] 0.600 [15.24] ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED FOR WIRE WRAP PINS, SEE DATA SHEETS 12005 CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Width “D” 0.290 [7.36] 0.390 [9.90] 0.490 [12.45] 0.690 [17.54] Available Sizes 8, 10 8, 14-20 22 8-24, 28-40, 48 CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION. SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE FURNISHED, DEPENDING ON QUANTITY. ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS WITHOUT NOTICE PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE CONSIDERED UNCONTROLLED 2609 Bartram Road • Bristol, PA 19007-6810 USA TEL 215-781-9956 • FAX 215-781-9845 WWW.ARIESELEC.COM • [email protected] 12004 Rev. 5.2 1 of 1