12030

P/Ns 1106396 & 1107254
Row-to-Row DIP Adapter Socket
FEATURES
• Adapter Socket allows the use of 0.300 [7.62] center devices when the PCB is drilled on 0.600
[15.24] centers and vice versa, giving the flexibility of using 0.600 [15.24] or 0.300 [7.62] center
devices in the same application.
GENERAL SPECIFICATIONS
• SOCKET BODY: Black UL 94V-0 Glass-filled 4/6 Nylon
• PIN BODY: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M
• PIN BODY PLATING: 200µ [5.08µ] min. Sn per ASTM B545 Type 1 over 100µ [2.54µ]
Ni per SAE AMS-QQ-N-290B
• 4-FINGER COLLET CONTACT: BeCu per UNS C17200, ASTM B194-08
• CONTACT PLATING: 30µ [0.762µ] min. Au per MIL-G-45204 over 50µ [1.27µ] min. Ni
per SAE AMS-QQ-N-290
• CONTACT CURRENT RATING: 3 amps
• OPERATING TEMPERATURE: 221°F [105°C]
• INSERTION FORCE: 180g/pin; based on 0.018 [0.46] dia. test lead
• WITHDRAWAL FORCE: 90g/pin; based on 0.018 [0.46] dia. test lead
• NORMAL FORCE: 140g/pin; based on 0.018 [0.46] dia. test lead
• ACCEPTS LEADS: 0.015-0.025 [0.38-0.64] dia., 0.110-0.150 [2.79-3.81] long
ORDERING INFORMATION
For 0.300 [7.62] DIP to 0.600 [15.24] PCB
1106396-XX
No. of Pins – (6 thru 40)
For 0.600 [15.24] DIP to 0.300 [7.62] PCB
1107254-XX
No. of Pins – (6 thru 40)
MOUNTING CONSIDERATIONS
• SUGGESTED PCB HOLE SIZE: 0.035 ±0.002 [0.89 ±0.05] dia.
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL DIMENSIONS: INCHES [MILLIMETERS]
ALL
TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS
CUSTOMIZATION: ARIES SPECIALIZES IN CUSTOM DESIGN AND PRODUCTION.
SPECIAL MATERIALS, PLATINGS, SIZES, AND CONFIGURATIONS CAN BE
FURNISHED, DEPENDING ON QUANTITY.
ARIES RESERVES THE RIGHT TO CHANGE PRODUCT GENERAL SPECIFICATIONS
WITHOUT NOTICE
PRINTOUTS OF THIS DOCUMENT MAY BE OUT-OF-DATE AND SHOULD BE
CONSIDERED UNCONTROLLED
2609 Bartram Road • Bristol, PA 19007-6810 USA
TEL 215-781-9956 • FAX 215-781-9845
WWW.ARIESELEC.COM • INFO@ARIESELEC.COM
12030
Rev. 2.1
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