IS31SE5000

IS31SE5000
IR SENSOR FOR TOUCHLESS MOTION AND PROXIMITY
October 2012
FEATURES
GENERAL DESCRIPTION
The IS31SE5000 is a low-power, reflectance-based
infrared light sensor with advanced signal processing
and digital output. The sensor can detect making
touchless motion possible.
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The IS31SE5000 uses one infrared LED and
2-channel receivers which pick up the reflectance
signal from the 2 photodiodes to perform touchless
motion detection. When horizontal motion or proximity
motion happen, the flag bits in status register will be
triggered and an interrupt signal is generated to
inform the master to read the flag bit through
I2Cinterface.
Supply voltage from 2.7V~5.5V
400kHz I2C compatible interface
1µA shutdown current
0.6mA low supply current
Detection range can be adjusted
Motion Mode and Proximity Mode
Integrated signal processing and digital output
Auto interrupt clear
Package in UTQFN-12 (2mm × 2mm)
APPLICATIONS
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IS31SE5000 is available in UTQFN-12 (2mm × 2mm).
It operates from 2.7V to 5.5V over the temperature
range of -40°C to +85°C.

Smart phones/GPS/MID/PAD/MP3
Lighting/switch controller/
household electrical appliances
Toys/game machine
TYPICAL APPLICATION CIRCUIT
VBattery
1 F
10
VBattery
VCC
0.1 F
IRLED
11
IRLED
8
PD1
7
PD2
VDD
4.7k
4.7k
4.7k
4
3
Micro
Controller
2
1
IS31SE5000
RX1
SDA
SCL
RX2
INTB
SDB
GND
12
100k
PD1
IRLED
PD2
LCD
Figure 1
Typical Application Circuit (Motion Mode)
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
1
IS31SE5000
VBattery
1 F
10
VBattery
VCC
0.1 F
IRLED
11
IRLED
VDD
4.7k
4.7k
4.7k
4
3
Micro
Controller
2
1
IS31SE5000
SDA
RX1
SCL
8
PD1
INTB
SDB
GND
12
100k
PD1
IRLED
LCD
PD1
Figure 2
IRLED
Typical Application Circuit (Proximity Mode)
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Rev. A, 10/11/2012
2
IS31SE5000
PIN CONFIGURATION
10 VCC
INTB 2
8 RX1
SCL 3
7 RX2
SDA
NC 6
9 NC
NC 5
SDB 1
4
UTQFN-12
11 IRLED
Pin Configuration (Top View)
12 GND
Package
PIN DESCRIPTION
No.
Pin
Description
1
SDB
Shutdown pin, low active.
2
INTB
Interrupt signal, pulled down to inform master to read data.
3
SCL
The input for the I2C clock signal.
4
SDA
The input for the I2C data signal.
5,6,9
NC
Not connect.
7
RX2
Input signal of channel 2 infrared LED receiver.
8
RX1
Input signal of channel 1 infrared LED receiver.
10
VCC
Power supply.
11
IRLED
IRLED emitting pin. Connect to IRLED.
12
GND
Ground.
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
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Rev. A, 10/11/2012
3
IS31SE5000
ORDERING INFORMATION
Industrial Range: -40°C to +85°C
Order Part No.
Package
QTY/Reel
IS31SE5000-UTLS2-TR
UTQFN-12, Lead-free
3000
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Rev. A, 10/11/2012
4
IS31SE5000
ABSOLUTE MAXIMUM RATINGS
Supply voltage, VCC
Voltage at any input pin
Maximum junction temperature, TJMAX
Operating temperature range, TA
Storage temperature range, TSTG
-0.3V ~ +6.0V
-0.3V ~ VCC+0.3V
150°C
-40°C ~ +85°C
-65°C ~ +150°C
Note:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other condition beyond those indicated in the operational sections of the specifications is
not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
TA = 25°C, VCC = 2.7V ~ 5.5V, unless otherwise noted. Typical value are TA = +25°C, VCC = 3.6V.
Symbol
Parameter
Condition
Min.
Typ.
Unit
5.5
V
VCC
Supply voltage
ICC
Quiescent current
VSDB = VCC
0.6
ISD
Shutdown current
VSDB = 0V
1
IIR
Average current of IRLED
VLED =3.6V(Note 1)
0.8
mA
IP
Peak current of IRLED
EC = “000” (Note 1,2)
400
mA
INTB pin output voltage low
IOL = 4mA
Maximum detect distance
EC = “000” (Note 3)
VIH
Input logic high voltage
VCC = 2.7V
VIL
Input logic low voltage
VCC = 5.5V
VINT
L
2.7
Max.
mA
3
0.2
9
μA
V
cm
0.4
1.4
V
V
DIGITAL INPUT SWITCHING CHARACTERISTICS (Note 1)
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
400
kHz
fSCL
Serial-Clock frequency
tBUF
Bus free time between a STOP and a START
condition
1.3
μs
tHD, STA
Hold time (repeated) START condition
0.6
μs
tSU, STA
Repeated START condition setup time
0.6
μs
tSU, STO
STOP condition setup time
0.6
μs
tHD, DAT
Data hold time
tSU, DAT
Data setup time
100
ns
tLOW
SCL clock low period
1.3
μs
tHIGH
SCL clock high period
0.7
μs
0.9
μs
tR
Rise time of both SDA and SCL signals,
receiving
(Note 4)
20+0.1Cb
300
ns
tF
Fall time of both SDA and SCL signals,
receiving
(Note 4)
20+0.1Cb
300
ns
Note 1: Guaranteed by design.
Note 2: The EC bit is used to set the emitting current. Please refer to the detailed information in Page 8.
Note 3: Because of different IRLED, receive LED and material of cover, the detection distance will be different. The detail parameter should be
tested. IR11-21C/TR8 (for IRLED) and PD15-22C-R/TR8 (for PD) is recommended.
Note 4: Cb = total capacitance of one bus line in pF. ISINK ≤ 6mA. tR and tF measured between 0.3 × VCC and 0.7 × VCC.
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Rev. A, 10/11/2012
5
IS31SE5000
DETAILED DESCRIPTION
After the last bit of the chip address is sent, the master
checks for the IS31SE5000’s acknowledge. The
master releases the SDA line high (through a pull-up
resistor). Then the master sends an SCL pulse. If the
IS31SE5000 has received the address correctly, then
it holds the SDA line low during the SCL pulse. If the
SDA line is not low, then the master should send a
“STOP” signal (discussed later) and abort the transfer.
I2C INTERFACE
The IS31SE5000 uses a serial bus, which conforms to
the I2C protocol, to control the chip’s functions with two
wires: SCL and SDA. The IS31SE5000 has a 7-bit
slave address (A7:A1), followed by the R/W bit, A0. Set
A0 to “0” for a write command and set A0 to “1” for a
read command.
The complete slave address is:
Following acknowledge of IS31SE5000, the register
address byte is sent, most significant bit first.
IS31SE5000 must generate another acknowledge
indicating that the register address has been received.
Table 1 Slave Address (Write only):
Bit
A7:A1
A0
Value
1010101
1/0
Then 8-bit of data byte are sent next, most significant
bit first. Each data bit should be valid while the SCL
level is stable high. After the data byte is sent, the
IS31SE5000 must generate another acknowledge to
indicate that the data was received.
The SCL line is uni-directional. The SDA line is
bi-directional (open-collector) with a pull-up resistor
(typically 4.7kΩ). The maximum clock frequency
specified by the I2C standard is 400kHz. In this
discussion, the master is the microcontroller and the
slave is the IS31SE5000.
The “STOP” signal ends the transfer. To signal “STOP”,
the SDA signal goes high while the SCL signal is high.
READING PORT REGISTERS
The timing diagram for the I2C is shown in Figure 3.
The SDA is latched in on the stable high level of the
SCL. When there is no interface activity, the SDA line
should be held high.
To read the device data, the bus master must first send
____
the IS31SE5000 address with the R/W bit set to “0”,
followed by the command byte, which determines
which register is accessed. After a restart, the bus
master must then send the IS31SE5000 address with
The “START” signal is generated by lowering the SDA
signal while the SCL signal is high. The start signal will
alert all devices attached to the I2C bus to check the
incoming address against their own chip address.
____
the R/W bit set to “1”. Data from the register defined
by the command byte is then sent from the
IS31SE5000 to the master (Figure 6).
The 8-bit chip address is sent next, most significant bit
first. Each address bit must be stable while the SCL
level is high.
Figure 3
Interface timing
Figure 4
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
Bit transfer
6
IS31SE5000
Figure 5 Writing to IS31SE5000
Figure 6
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Rev. A, 10/11/2012
Reading from IS31SE5000
7
IS31SE5000
REGISTERS DEFINITIONS
Table 2 Register Function
Address
Name
Function
R/W
Table
Default
xxxx xxxx
00h
Status Register
Store the motion information
R
3
01h
Shutdown Register
Set software shutdown
W
4
11h
Configuration Register
Configure operating function
W
5
Table 3
00h
Status Register (Read Only)
Table 4
0000 0000
01h Shutdown Register
Bit
D7:D4
D3:D2
D1:D0
Bit
D7:D1
D0
Name
-
PD
MD
Name
-
SSD
Default
0000000
0
Default
-
The Status Register stores the motion information
which detected by IS31SE5000.
PD
01
10
Others
Proximity Detection (Figure 7)
Be off
Be close
No motion
The Shutdown Register sets software shutdown mode
of IS31SE5000.
SSD
0
1
Software Shutdown Enable
Software shutdown mode
Normal operation
Table 5
11h
Configuration Register
Bit
D7:D4
D3:D1
D0
Name
-
EC
MODE
Default
0000
000
0
The Configuration Register sets the operating function.
PD1
Figure 7
MD
01
10
Others
IRLED
Proximity Mode Detect (Side View)
Motion Detection (Figure 8)
From PD2 to PD1
From PD1 to PD2
No motion
EC
Emitting Current Setting
(Adjusting detection distance,
information in Page 10)
000
400mA
001
280mA
01x
210mA
1xx
70mA
MODE
0
1
Figure 8
refer
to
detail
Mode Selection
Motion mode
Proximity mode
Motion Mode Detect (Top View)
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Rev. A, 10/11/2012
8
IS31SE5000
FUNCTIONAL BLOCK DIAGRAM
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Rev. A, 10/11/2012
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IS31SE5000
APPLICATION INFORMATION
GENERAL DESCRIPTION
DETECTION DISTANCE
The IS31SE5000 is a low-power, reflectance-based
infrared light sensor with advanced signal processing
and digital output. The sensor can detect making
touchless motion possible.
The emitting current can be adjusted by the EC bit of
Configuration Register (11h). The larger current is, the
longer distance detected.
MODE CONTROL
By setting the MODE bit of Configuration Register (11h)
IS31SE5000 operates in Motion Mode or Proximity
Mode.
When setting the MODE bit to “0”, IS31SE5000
operates in the Motion Mode. When the MODE bit is
set to “1”, IS31SE5000 operates in the Proximity
Mode.
STATUS INFORMATION
Master can get the current motion information by
reading the PD, MD bits of Status Register (00h).
MOTION MODE
Because of the different IRLED, receiver and material
of cover, the detection distance will be different for the
same emitting current. Detail information should be
decided by testing.
In the stable mode, the average emitting current for
both two modes, IIR, can be calculated by the Equation
(1):
I
IR

1
I
512 EC
(1)
In the operating mode, the average emitting current for
the Proximity Mode is the same as stable mode. And
the average emitting current for the Motion Mode can
be calculated by the Equation (2):
1
I
8 EC
The MD bit is available when IS31SE5000 operates in
the Motion Mode. If the MD bit is “01”, it means the
current motion is from PD2 to PD1. If the MD bit is “10”,
it means the current motion is from PD1 to PD2 (Table
3). If MD bit is other data, there is no motion.
The IEC is the emitting current which setting by the EC
bit.
PROXIMITY MODE
SHUTDOWN MODE
The PD bit is available when IS31SE5000 operates in
the Proximity Mode. If the PD bit is “01”, it means the
object is away from the IC. If the PD bit is “10”, it
means the object is close to the IC (Table 3). If PD bit
is other data, there is no motion.
Shutdown mode can be used as a means of reducing
power consumption. During shutdown mode all
registers retain their data.
INTERRUPTION
The changing of motion can be signed by the INTB pin.
The INTB pin will be pulled low when object moving
before the LCD panel (PD or MD bit changing). And
the MCU can get the information via reading the Status
Register (00h). The INTB will be back to high until the
MCU reading the Status Register (00h). The INTB pin
will be high automatically when it stays low last 10ms
to ensure system operating normally.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
I
IR

(2)
SOFTWARE SHUTDOWN
By setting SSD bit of the Shutdown Register (01h) to
“0”, the IS31SE5000 will operate in software shutdown
mode.
HARDWARE SHUTDOWN
The chip enters hardware shutdown mode when the
SDB pin is pulled low, wherein they consume only 1μA
(Typ.) current.
10
IS31SE5000
CLASSIFICATION REFLOW PROFILES
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
150°C
200°C
60-120 seconds
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
217°C
60-150 seconds
Peak package body temperature (Tp)*
Max 260°C
Time (tp)** within 5°C of the specified
classification temperature (Tc)
Max 30 seconds
Average ramp-down rate (Tp to Tsmax)
6°C/second max.
Time 25°C to peak temperature
Figure 9
8 minutes max.
Classification Profile
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Rev. A, 10/11/2012
11
IS31SE5000
PACKAGE INFORMATION
UTQFN-12
Note: All dimensions in millimeters unless otherwise stated.
Integrated Silicon Solution, Inc. – www.issi.com
Rev. A, 10/11/2012
12