IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide

IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
Description
Quick Start
The IS31LT3916 is a primary side, peak
current mode, isolated or non-isolated type
HBLED driver. The device works at a constant
frequency in discontinuous conduction mode
to provide a constant power to the output. It
eliminates the need for an opto-coupler,
TL431, or any other type of secondary side
feedback. It operates from a wide input
voltage range of 90VAC to 260VAC.
The IS31LT3916 integrates over current
protection, over voltage protection, as well as
includes a thermal shutdown to halt the
switching action in the case of abnormally
high operating temperatures.
Recommended Equipment
Features









Power factor correction to > 0.90
5% typical current accuracy
High efficiency
No loop compensation required
Wide input voltage range: 90V to 260VAC
Isolation and Non-isolation application
Internal over-temperature protection
Over voltage protection
Primary side over current protection
Applications
 LED bulb lamp
 LED tube lamp
 General LED lamp
 90~260VAC/50~60Hz power supply
 LED array(24 LEDs in series)
Recommended Input and Output Ratings
 Input: 90~260VAC
 Output: 24LEDs in series(76V/240mA)
Absolute Maximum Ratings
≤ 265VAC power supply
≤ 80V Vout (Total Vf)
Caution: Do not exceed the conditions listed above,
otherwise the board will be damaged or the output
will be limited.
Procedure
The IS31LT3916 DEMO Board is fully
assembled and tested. Follow the steps listed
below to verify board operation.
Caution: Do not turn on the power supply until all
connections are completed.
1) Connect the positive terminal of the LEDs
to the LED+ pin of the DEMO and the
negative terminal of the LEDs to the LEDpin of the DEMO.
2) Connect the input pins (L and N) of the
DEMO via the main power switch to AC
power supply.
3) Turn on the power supply.
Order information
Part Number
Package Type
IS31LT3916-SLS2-EBT8
MSOP-8
Figure 1 Picture of DEMO Board (NOTE: Physical dimensions are (L x W x H): 220mm x 17mm x 12mm)
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
Bill of Materials
No.
Name
Description
Ref Des.
Qty.
Cost(RMB)
1
Fuse
1A,250V,3*10
F1
1
0.1
2
MOV
7D471K
MOV
1
0.1
3
X Cap
0.1uF,275VAC
CX1,CX2
2
0.3
4
AL Cap
100uF±10%,100V,10mm*23mm
C3,C4
2
0.4
5
SMD Cap
NC
C5
1
0
6
CBB Cap
100nF±10%,400V
C6
1
0.15
7
SMD Cap
1nF±10%,16V,0805
C7
1
0.04
8
SMD Cap
1uF±10%,50V,0805
C8
1
0.1
9
SMD Cap
10uF±10%,50V,1206
C9
1
0.1
10
SMD Cap
1uF±10%,50V,1206
C10
1
0.1
11
Rectifying Bridge
DB107,1A,1000V,DB-1
BD1
1
0.3
12
FR Diode
ES2J,2A,600V,SMA
D1
1
0.15
13
SMD Diode
NC
D3
1
0
14
SMD Diode
1N4148,200mA,75V,LL34
D4
1
0.05
15
SMD Diode
M7,1A,1000V,SMA
D5
1
0.05
16
SMD Resistor
NC
R2
1
0
17
SMD Resistor
4.7KΩ±5%,0805
R4
1
0.006
18
SMD Resistor
1MΩ±1%,1206
R5,R9
2
0.016
19
SMD Resistor
180KΩ±5%,1206
R6,R10
2
0.016
20
SMD Resistor
910KΩ±1%,1206
R7,R11
2
0.016
21
SMD Resistor
68KΩ±5%,1206
R8
1
0.008
22
SMD Resistor
0Ω,0805
R12
1
0.006
23
SMD Resistor
1Ω±1%,1206
R13
1
0.008
24
SMD Resistor
NC
R14
1
0
25
SMD Resistor
1.6MΩ±1%,0805
R15
1
0.006
26
SMD Resistor
68KΩ±1%,0805
R16
1
0.006
27
SMD Resistor
240KΩ±1%,0805
R17
1
0.006
28
SMD Resistor
13KΩ±1%,0805
R18
1
0.006
29
SMD Resistor
20KΩ±1%,0805
R19
1
0.006
30
SMD Resistor
0.91Ω±1%,1206
R20,R21
2
0.016
31
SMD Resistor
130KΩ±1%,0805
R22
1
0.006
32
SMD Resistor
10KΩ±1%,0805
R23
1
0.006
33
Inductor
3mH±10%,8*10mm,Isat≥200mA
L1
1
0.15
Common Mode
EE12,L2-1=L2-2=30mH±10%,
Chock
0.25mm,100Ts
L2
1
0.3
35
Transformer
ER2010,Tp:Ta=78:16,Lp=0.43mH±5%
TR
1
2
36
NMOS
4N60,4A/600V,TO-220
Q1
1
1.5
37
PCB
230mm x 17mm
1
0.8
38
IC
IS31LT3916,MSOP-8
1
-
34
Total Cost(Exclude IC)
Integrated Silicon Solution, Inc. – www.issi.com
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U1
6.824
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
L3
F1
90-260VAC
L2
MOV
CX1
BD1
L1
LED-
R2
R4
CX2
C6
R5
R7
R9
R11
R6
R10
U1
VCC
3916
C7
R18
R19
C8
R15
R17
FSET
FB
C4
C5
R8
D1
R14 D3
Q1
GATE
LED+
R12
VSINE
R16
C3
TR
CS
NC
GND
R13 R20 R21
D5
D4
C9
R22
C10
R23
Figure 2. Schematic of DEMO Board
Figure 3 PCB Layout- Top Layer
Figure 4 PCB Component Placement Guide - Top Layer
Figure 5 PCB Layout- Bottom Layer
Transformer Design
ELECTRICAL SPECIFCATIONS:
1. Primary inductance(Lp)=430uH@60kHz.
MATERIALS:
1. Core: ER2010 (Ferrite Material TDK PC40 or equivalent)
2. Bobbin: ER2010, Primary: 5 pins, Secondary: 5 pins
3. Magnet Wires: Type 2-UEW
4. Layer Insulation Tape :3M1298 or equivalent.
Figure 6 Transformer
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
number of
number of
turns
plies
number of
diameter
tape
NO.
winding
Start
End
1
Np
3
1
78T
0.33mm-2UEW
2
0.02*4mm
2
Ns
5
6
16T
0.19mm-2UEW
3
0.02*4mm
plies
remarks
Test result
PF THD(%) 1 0.999 0.998 0.997 0.997 0.996 0.994 0.993 0.991 0.988 0.985 0.982 0.978 0.973 0.969 0.963 0.956 0.955 0.9 1.0 1.1 1.1 1.2 1.1 1.2 1.2 1.4 1.6 1.6 1.6 1.7 1.7 1.8 1.8 1.9 1.9 Input
Output
Output
Output
Efficiency(%)
power(W) voltage(V) current(mA) power(W) 20.60 75.2 240 18.05 87.61 20.37 75.2 239 17.97 88.23 20.44 75.2 241 18.12 88.67 20.20 75.1 239 17.95 88.86 20.40 75.1 242 18.17 89.09 20.45 75.2 243 18.27 89.36 20.37 75.2 243 18.27 89.71 20.43 75.2 244 18.35 89.81 20.69 75.2 246 18.50 89.41 20.10 75.1 240 18.02 89.67 20.21 75.1 242 18.17 89.93 19.84 75.0 238 17.85 89.97 19.90 75.0 238 17.85 89.70 19.66 75.0 235 17.63 89.65 19.83 75.0 237 17.78 89.64 19.94 75.0 238 17.85 89.52 19.77 75.0 235 17.63 89.15 19.39 74.9 231 17.302 89.23 280
100
260
95
240
90
220
Efficiency(%)
Output current(mA)
Input
voltage(VAC) 90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 200
180
160
85
80
75
70
65
140
60
120
55
50
100
85
110
135
160
185
Vin(VAC)
210
235
Figure 7 Line regulation
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260
85
110
135
160
185
Vin(VAC)
210
235
260
Figure 8 Efficiency&Vin
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
10
0.95
9
0.9
8
0.85
7
0.8
6
0.75
5
0.7
4
0.65
3
0.6
2
0.55
1
0.5
THD(%)
PF
1
PF
THD
0
85
110
135
160
185
Vin(VAC)
210
235
260
Figure 9 PF,THD&Vin
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
EMI test
Figure 10 Conduction EMI_L
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IS31LT3916 Non-Isolation T8 Lighting DEMO Board Guide
Figure 11 Conduction EMI_N
Copyright © 2013 integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and
before placing orders for products.
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