IS43/46TR16128A/AL, IS43/46TR82560A/AL 256Mx8, 128Mx16 2Gb DDR3 SDRAM ADVANCED INFORMATION DECEMBER 2011 FEATURES Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V Refresh Interval: 7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C 3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C High speed data transfer rates with system frequency up to 933 MHz 8 internal banks for concurrent operation 8Bits pre-fetch architecture Programmable CAS Latency: 5, 6, 7, 8, 9, 10 and 11 Programmable Additive Latency: 0, CL-1,CL-2 Programmable CAS WRITE latency (CWL) based on tCK Programmable Burst Length: 4 and 8 Programmable Burst Sequence: Sequential or Interleave BL switch on the fly Auto Self Refresh(ASR) Self Refresh Temperature(SRT) Partial Array Self Refresh Asynchronous RESET pin TDQS (Termination Data Strobe) supported (x8 only) OCD (Off-Chip Driver Impedance Adjustment) Dynamic ODT (On-Die Termination) Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω) Write Leveling Operating temperature: Commercial (TC = 0°C to +95°C) Industrial (TC = -40°C to +95°C) Automotive, A1 (TC = -40°C to +95°C) Automotive, A2 (TC = -40°C to +105°C) ADDRESS TABLE Parameter Row Addressing Column Addressing Bank Addressing Page size Auto Precharge Addressing BL switch on the fly OPTIONS Configuration: 256Mx8 128Mx16 Package: 96-ball FBGA (9mm x 13mm) for x16 78-ball FBGA (9mm x 10.5mm) for x8 256Mx8 A0-A14 A0-A9 BA0-2 1KB 128Mx16 A0-A13 A0-A9 BA0-2 2KB A10/AP A10/AP A12/BC# A12/BC# SPEED BIN Speed Option 187F 15H 125K 107L JEDEC Speed Grade DDR3-1066F DDR3-1333H DDR3-1600K DDR3-1866L CL-nRCD-nRP tRCD,tRP(min) 7-7-7 13.125 9-9-9 13.125 11-11-11 13.125 12-12-12 12.84 Units tCK ns Copyright © 2011 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 1 IS43/46TR16128A/AL, IS43/46TR82560A/AL 1. DDR3 PACKAGE BALLOUT 1.1 DDR3 SDRAM package ballout 78-ball FBGA – x8 A B C D E F G H J K L M N 1 VSS VSS VDDQ VSSQ VREFDQ NC1 ODT NC VSS VDD VSS VDD VSS 2 VDD VSSQ DQ2 DQ6 VDDQ VSS VDD CS# BA0 A3 A5 A7 RESET# 3 NC DQ0 DQS DQS# DQ4 RAS# CAS# WE# BA2 A0 A2 A9 A13 4 5 6 7 NU/TDQS# DM/TDQS DQ1 VDD DQ7 CK CK# A10/AP A15 A12/BC# A1 A11 A14 8 VSS VSSQ DQ3 VSS DQ5 VSS VDD ZQ VREFCA BA1 A4 A6 A8 9 VDD VDDQ VSSQ VSSQ VDDQ NC CKE NC VSS VDD VSS VDD VSS Note: NC balls have no internal connection. NC/15 is one of NC pins and reserved for higher densities. Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 2 IS43/46TR16128A/AL, IS43/46TR82560A/AL 1.2 DDR3 SDRAM package ballout 96-ball FBGA – x16 A B C D E F G H J K L M N P R T 1 VDDQ VSSQ VDDQ VSSQ VSS VDDQ VSSQ VREFDQ NC ODT NC VSS VDD VSS VDD VSS 2 DQU5 VDD DQU3 VDDQ VSSQ DQL2 DQL6 VDDQ VSS VDD CS# BA0 A3 A5 A7 RESET# 3 DQU7 VSS DQU1 DMU DQL0 DQSL DQSL# DQL4 RAS# CAS# WE# BA2 A0 A2 A9 A13 4 5 6 7 DQU4 DQSU# DQSU DQU0 DML DQL1 VDD DQL7 CK CK# A10/AP NC/A15 A12/BC# A1 A11 NC/A14 8 VDDQ DQU6 DQU2 VSSQ VSSQ DQL3 VSS DQL5 VSS VDD ZQ VREFCA BA1 A4 A6 A8 9 VSS VSSQ VDDQ VDD VDDQ VSSQ VSSQ VDDQ NC CKE NC VSS VDD VSS VDD VSS Note: NC balls have no internal connection. NC/14 and NC/15 are one of NC pins and reserved for higher densities. Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 3 IS43/46TR16128A/AL, IS43/46TR82560A/AL 1.3 Pinout DESCRIPTION - JEDEC Standard Symbol Type Function CK, CK# Input CKE, (CKE0), (CKE1) Input CS#, (CS0#), (CS1#), (CS2#), (CS3#) ODT, (ODT0), (ODT1) Input RAS#. CAS#. WE# DM, (DMU), (DML) Input BA0 - BA2 Input A0 - A14 Input A10 / AP Input A12 / BC# Input RESET# Input DQ Input / Output Input / Output DQU, DQL, DQS, DQS#, DQSU, DQSU#, DQSL, DQSL# Input Input Clock: CK and CK# are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK#. Clock Enable: CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down and Self-Refresh operation (all banks idle), or Active Power-Down (row Active in any bank). CKE is asynchronous for Self-Refresh exit. After VREFCA and VREFDQ have become stable during the power on and initialization sequence, they must be maintained during all operations (including Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK#, ODT and CKE, are disabled during power-down. Input buffers, excluding CKE, are disabled during Self-Refresh. Chip Select: All commands are masked when CS# is registered HIGH. CS# provides for external Rank selection on systems with multiple Ranks. CS# is considered part of the command code. On Die Termination: ODT (registered HIGH) enables termination resistance internal to the DDR3 SDRAM. When enabled, ODT is only applied to each DQ, DQSU, DQSU#, DQSL, DQSL#, DMU, and DML signal. The ODT pin will be ignored if MR1 and MR2 are programmed to disable RTT. Command Inputs: RAS#, CAS# and WE# (along with CS#) define the command being entered. Input Data Mask: DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS# is enabled by Mode Register A11 setting in MR1. Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write, or Precharge command is being applied. Bank address also determines which mode register is to be accessed during a MRS cycle. Address Inputs: Provide the row address for Active commands and the column address for Read/ Write commands to select one location out of the memory array in the respective bank. (A10/AP and A12/BC# have additional functions; see below). The address inputs also provide the op-code during Mode Register Set commands. Auto-precharge: A10 is sampled during Read/Write commands to determine whether Autoprecharge should be performed to the accessed bank after the Read/Write operation. (HIGH: Autoprecharge; LOW: no Autoprecharge). A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank addresses. Burst Chop: A12 / BC# is sampled during Read and Write commands to determine if burst chop (on-the-fly) will be performed. (HIGH, no burst chop; LOW: burst chopped). See command truth table for details. Active Low Asynchronous Reset: Reset is active when RESET# is LOW, and inactive when RESET# is HIGH. RESET# must be HIGH during normal operation. RESET# is a CMOS rail- to-rail signal with DC high and low at 80% and 20% of VDD, i.e., 1.20V for DC high and 0.30V for DC low. Data Input/ Output: Bi-directional data bus. Data Strobe: output with read data, input with write data. Edge-aligned with read data, centered in write data. For the x16, DQSL corresponds to the data on DQL0-DQL7; DQSU corresponds to the data on DQU0-DQU7. The data strobes DQS, DQSL, and DQSU are paired with differential signals DQS#, DQSL#, and DQSU#, respectively, to provide differential pair signaling to the system during reads and writes. DDR3 SDRAM supports differential data strobe only and does not support single-ended. Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 4 IS43/46TR16128A/AL, IS43/46TR82560A/AL TDQS, TDQS# Output Termination Data Strobe: TDQS/TDQS# is applicable for x8 DRAMs only. When enabled via Mode Register A11 = 1 in MR1, the DRAM will enable the same termination resistance function on TDQS/TDQS# that is applied to DQS/DQS#. When disabled via mode register A11 = 0 in MR1, DM/TDQS will provide the data mask function and TDQS# is not used. x16 DRAMs must disable the TDQS function via mode register A11 = 0 in MR1. No Connect: No internal electrical connection is present. VDDQ Supply DQ Power Supply: 1.5 V +/- 0.075 V and 1.35V +0.1V, -0.067V VSSQ Supply DQ Ground VDD Supply Power Supply: 1.5 V +/- 0.075 V and 1.35V +0.1V, -0.067V VSS Supply Ground VREFDQ Supply Reference voltage for DQ VREFCA Supply Reference voltage for CA ZQ, (ZQ0), (ZQ1), (ZQ2), (ZQ3) Supply Reference Pin for ZQ calibration Input only pins (BA0-BA2, A0-A13, RAS#, CAS#, WE#, CS#, CKE, ODT, and RESET#) do not supply termination. NC Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 5 IS43/46TR16128A/AL, IS43/46TR82560A/AL ORDERING INFORMATION 128Mx16 - Commercial Range: (0°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 1333MT/s 1600MT/s 7-7-7 9-9-9 11-11-11 IS43TR16128A -187FBL IS43TR16128A -15HBL IS43TR16128A -125KBL 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 128Mx16 - Industrial Range: (–40°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 1333MT/s 1600MT/s 7-7-7 9-9-9 11-11-11 IS43TR16128A -187FBLI IS43TR16128A -15HBLI IS43TR16128A -125KBLI 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 128Mx16 – Automotive, A1 Range: (–40°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 1333MT/s 1600MT/s 7-7-7 9-9-9 11-11-11 IS46TR16128A -187FBLA1 IS46TR16128A -15HBLA1 IS46TR16128A -125KBLA1 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 128Mx16 – Automotive, A2 Range: (–40°C ≤ TC ≤ 105°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 1333MT/s 1600MT/s 7-7-7 9-9-9 11-11-11 IS46TR16128A -187FBLA2 IS46TR16128A -15HBLA2 IS46TR16128A -125KBLA2 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free 96-ball FBGA,Lead-free Note: Contact ISSI for availability of options. Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 6 IS43/46TR16128A/AL, IS43/46TR82560A/AL ORDERING INFORMATION 256Mx8 - Commercial Range: (0°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 7-7-7 IS43TR82560A -187FBL 78-ball FBGA,Lead-free 1333MT/s 9-9-9 IS43TR82560A -15HBL 78-ball FBGA,Lead-free 1600MT/s 11-11-11 IS43TR82560A -125KBL 78-ball FBGA,Lead-free 256Mx8 - Industrial Range: (–40°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 7-7-7 IS43TR82560A -187FBLI 78-ball FBGA,Lead-free 1333MT/s 9-9-9 IS43TR82560A -15HBLI 78-ball FBGA,Lead-free 1600MT/s 11-11-11 IS43TR82560A -125KBLI 78-ball FBGA,Lead-free 256Mx8 – Automotive, A1 Range: (–40°C ≤ TC ≤ 95°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 7-7-7 IS46TR82560A -187FBLA1 78-ball FBGA,Lead-free 1333MT/s 9-9-9 IS46TR82560A -15HBLA1 78-ball FBGA,Lead-free 1600MT/s 11-11-11 IS46TR82560A -125KBLA1 78-ball FBGA,Lead-free 256Mx8 – Automotive, A2 Range: (–40°C ≤ TC ≤ 105°C) Data Rate CL-tRCD-tRP Order Part No. Package 1066MT/s 7-7-7 IS46TR82560A -187FBLA2 78-ball FBGA,Lead-free 1333MT/s 9-9-9 IS46TR82560A -15HBLA2 78-ball FBGA,Lead-free 1600MT/s 11-11-11 IS46TR82560A -125KBLA2 78-ball FBGA,Lead-free Note: Contact ISSI for availability of options. Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 7 IS43/46TR16128A/AL, IS43/46TR82560A/AL PACKAGE OUTLINE DRAWING 78-ball BGA (9mm x 10.5mm): 0.8mm x 0.8mm Pitch (x8) Bottom View Top View 9.0 +/- 0.1 6.40 Pin A1 Index 0.8 9.6 10.5 +/- 0.1 0.8 Pin A1 Index 78 Balls Min. 0.42 Max. 0.52 Min. 0.30 Max. 0.40 Max. 1.20 Units: mm Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 8 IS43/46TR16128A/AL, IS43/46TR82560A/AL PACKAGE OUTLINE DRAWING 96-ball BGA (9mm x 13mm): 0.8mm x 0.8mm Pitch (x16) Bottom View Top View 6.40 9.0 +/- 0.1 Pin A1 Index 0.8 12 13.0 +/- 0.1 0.8 Pin A1 Index 96 Balls Min. 0.42 Max. 0.52 Min. 0.30 Max. 0.40 Max. 1.20 Units: mm Integrated Silicon Solution, Inc. – www.issi.com – Rev. 00A 10/10/2011 9