HD74HC368 Hex Bus Drivers (Inverted Data Outputs with 3-state outputs) REJ03D0618-0200 (Previous ADE-205-497) Rev.2.00 Mar 30, 2006 Features • High Speed Operation: tpd (A to Y) = 9 ns typ (CL = 50 pF) • High Output Current: Fanout of 15 LSTTL Loads • Wide Operating Voltage: VCC = 2 to 6 V • Low Input Current: 1 µA max • Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C) • Ordering Information Part Name Package Type HD74HC368P DILP-16 pin HD74HC368FPEL SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) PRSP0016DH-B (FP-16DAV) Package Abbreviation P — FP EL (2,000 pcs/reel) PRSP0016DG-A RP (FP-16DNV) Note: Please consult the sales office for the above package availability. HD74HC368RPEL SOP-16 pin (JEDEC) Taping Abbreviation (Quantity) EL (2,500 pcs/reel) Function Table Inputs Note: G A Output Y H L X L Z H L H 1. H; High level, L; Low level, X; Irrelevant, Z; High impedance Rev.2.00 Mar 30, 2006 page 1 of 6 L HD74HC368 Pin Arrangement G1 1 16 VCC 1A 2 15 G2 1Y 3 14 6A 2A 4 13 6Y 2Y 5 12 5A 3A 6 11 5Y 3Y 7 10 4A GND 8 9 4Y (Top view) Absolute Maximum Ratings Item Symbol Ratings Unit Supply voltage range Input / Output voltage VCC VIN, VOUT –0.5 to 7.0 –0.5 to VCC +0.5 V V IIK, IOK IOUT ±20 ±35 mA mA ICC or IGND PT ±75 500 mA mW Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Tstg –65 to +150 °C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Symbol VCC Ratings 2 to 6 Unit V Input / Output voltage Operating temperature VIN, VOUT Ta 0 to VCC –40 to 85 V °C tr , tf 0 to 1000 0 to 500 ns Input rise / fall time Note: *1 0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Rev.2.00 Mar 30, 2006 page 2 of 6 Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V HD74HC368 Electrical Characteristics Ta = 25°C Item Input voltage Symbol VCC (V) 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 Min 1.5 3.15 4.2 — — — 1.9 4.4 Typ — — — — — — 2.0 4.5 Max — — — 0.5 1.35 1.8 — — Min 1.5 3.15 4.2 — — — 1.9 4.4 Max — — — 0.5 1.35 1.8 — — IOZ 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 5.9 4.18 5.68 — — — — — — 6.0 — — 0.0 0.0 0.0 — — — — — — 0.1 0.1 0.1 0.26 0.26 ±0.5 5.9 4.13 5.63 — — — — — — — — — 0.1 0.1 0.1 0.33 0.33 ±5.0 Iin ICC 6.0 6.0 — — — — ±0.1 4.0 — — ±1.0 40 VIH VIL Output voltage VOH VOL Off-state output current Input current Quiescent supply current Ta = –40 to+85°C Unit Test Conditions V V V V Vin = VIH or VIL IOH = –20 µA Vin = VIH or VIL IOH = –6 mA IOH = –7.8 mA IOL = 20 µA IOH = 6 mA IOH = 7.8 mA µA Vin = VIH or VIL, Vout = VCC or GND µA Vin = VCC or GND µA Vin = VCC or GND, Iout = 0 µA Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Item Symbol VCC (V) Propagation delay time tPLH tPHL Output enable time tZH tZL Output disable time tHZ tLZ Output rise/fall time tTLH tTHL Input capacitance Cin Min Ta = 25°C Typ Max Ta = –40 to +85°C Unit Min Max 2.0 4.5 — — — 9 95 19 — — 120 24 6.0 2.0 — — — — 16 190 — — 20 240 4.5 6.0 — — 13 — 38 32 — — 48 41 2.0 4.5 — — — 15 175 35 — — 220 44 6.0 2.0 — — — — 30 60 — — 37 75 4.5 6.0 — — 4 — 12 10 — — 15 13 — — 5 10 — 10 Rev.2.00 Mar 30, 2006 page 3 of 6 ns ns ns ns pF Test Conditions HD74HC368 Test Circuit VCC VCC Output G1, G2 1 kΩ See Function Table Input Pulse Generator Zout = 50 Ω 1Y to 6Y OPEN S1 GND CL = 50 pF 1A to 6A VCC TEST t PLH / t PHL S1 OPEN t ZH/ t HZ t ZL / t LZ GND VCC Note : 1. CL includes probe and jig capacitance. Waveforms • Waveform – 1 Input A tf tr 10 % 10 % t PLH 0V t PHL 90 % Output Y VOH 90 % 50 % 10 % 50 % 10 % t TLH • Waveform – 2 Input G VCC 90 % 50 % 90 % 50 % VOL t THL tf tr 90 % 50 % VCC 90 % 50 % 10 % 10 % GND t LZ t ZL VOH Waveform - A 50 % t ZH Waveform - B 50 % 10 % VOL t HZ 90 % VOH VOL Notes : 1. Input waveform : PRR ≤ 1 MHz, duty cycle 50%, tr ≤ 6 ns, tf ≤ 6 ns 2. Waveform - A is for an output with internal conditions such that the output is low except when disabled by the output control. 3. Waveform - B is for an output with internal conditions such that the output is high except when disabled by the output control. 4. The output are measured one at a time with one transition per measurement. Rev.2.00 Mar 30, 2006 page 4 of 6 HD74HC368 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g D 9 E 16 1 8 b3 0.89 A1 A Z L Reference Symbol θ bp e e1 D E A A1 bp b3 c θ e Z L c e1 ( Ni/Pd/Au plating ) JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B *1 Previous Code FP-16DAV Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 1.12 2.54 MASS[Typ.] 0.24g D F 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 9 c HE *2 E bp Index mark Terminal cross section ( Ni/Pd/Au plating ) 1 Z 8 e *3 bp x Reference Symbol M A L1 A1 θ y L Detail F Rev.2.00 Mar 30, 2006 page 5 of 6 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15 HD74HC368 JEITA Package Code P-SOP16-3.95x9.9-1.27 RENESAS Code PRSP0016DG-A *1 Previous Code FP-16DNV MASS[Typ.] 0.15g D F 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 9 c *2 Index mark HE E bp Terminal cross section ( Ni/Pd/Au plating ) 1 Z Reference Symbol 8 e *3 bp x M A L1 A1 θ L y Detail F Rev.2.00 Mar 30, 2006 page 6 of 6 D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 9.90 10.30 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. 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