ITT Cannon Micro Wireless Access Point High-Bandwidth RF Connector System We connect a wireless world in flight. “Turn off all electronic devices before take-off.” That statement will soon be a thing of the past. With legislative rulings set to allow the use of wireless devices during flight, the need for connectors that enable system RF connections is very near, and ITT Cannon is already there. The new series of lightweight ITT Cannon Micro-D connectors are capable of carrying 802.11n wireless transmission frequencies in a Micro-D package that opens up a world of wireless connectivity for passengers in flight. The Cannon Difference: •E xceptional bandwidth performance •Integrates into small PCB and Panel I/O applications with minimal space required •D urability to withstand high shock and vibration environments •High bandwidth RF 6 GHz performance •G lass-filled thermoset connector shell and insulator significantly cuts weight and provides superior electrical dielectric properties and strength. •Made of lightweight glass-filled thermoset and high performance dielectric materials •O ptimized for high-bandwidth frequencies, RF contacts are made of a very high-performance dielectric material. Maximizing connectivity inside and outside the cabin. Transmission of RF up to 6 GHz with maximum performance is critical to in-flight connectivity and complies with the 802.11n wireless standard. Key features: • Transmission of RF up to 6 GHz with maximum performance • Glass-filled thermoset connector shell and insulator • RF contacts made of very high-performance dielectric material • Small and lightweight • Complies with the 802.11n wireless standards Applications TABLET MOBILE LAPTOP HANDHELD GAMING ITT Cannon Micro Wireless Access Point High-Bandwidth RF Connector System Integratable into the following connector styles: Micro Connectors • Micro density 1.27 mm (.050") pitch #26 contacts • 3 amp/contact current rating • 7- to 85- position versions available • Stainless and aluminum shell • Rear grommet stress relief • Cable assemblies available Fiber Optics • Single mode/multi-mode • High density layouts • Available in standard and custom connector styles • D-Subminiature PhD • KJ/38999G PhD • Cable assemblies D-Sub Connectors • Up to 104 contact positions • Power contacts to 70 amps • High voltage contacts to 700 VDC • Standard, high density, double density versions • RF to 18 GHz • High-bandwidth ethernet contacts Nano-D Connectors • Ultra high density 0.63 mm pitch • Ultra lightweight • 1 amp contact current rating • 9- to 51- position layouts • High operating temperature limit of 200° C Rack and Panel • Blind mate connectors designed per ARINC 600 • Available in 3- and 6- gang configurations • Can accommodate up to 800 low insertion force contacts • Inserts are field replaceable • BKA connectors are available in environmental and non-environmental versions Quadrax • Characteristic impedance 100 ohms • A size 8 multi-pin contact providing four signal pins to yield a single ethernet port • Available in rear release, crimp, and front release PCB versions • Straight plug, jam nut box mount, flange mount, and thru-bulkhead ITT is a focused multi-industrial company that designs and manufactures highly engineered critical components and customized technology solutions. ITT Interconnect Solutions’ Cannon brand is a leading global manufacturer of connector products serving international customers in the aerospace and defense, medical, energy, transportation and industrial end markets. ITT’s Interconnect Solutions business manufactures and supplies a variety of connectors and interconnects that make it possible to transfer data, signal and power in an increasingly connected world, including its VEAM and BIW Connector Systems brands. Connect with your ITT Cannon representative today or visit us at www.ittcannon.com United States 666 East Dyer Road Santa Ana, CA 92705 Europe Jays Close, Viables Estate Basingstoke Hampshire RG22 4BA United Kingdom Asia 11-3, 5-Chome, Hibarigaoka Zama-shi, Kanagawa 228-0003 Japan Specifications and other data are based on information available at time of printing and are subject to change without notice. © 2014 ITT Corporation RD_DATA_ra_20140702