Tempus HS Connector Series

2003
Tempus HS Connector Series
2 mm Interconnect
TEMPUS HS
Contents
Introduction
Introduction
2
PRODUCT OVERVIEW:
General Data
3
5-Row - Female Signal Modules
5
5-Row - Male Signal Modules - Standard
6
5-Row - Male Signal Modules - Wide Body
7
5-Row - Male Signal Modules - Feed-Through
8
5-Row - Male Signal Modules - Shrouds
9
ITT Industries, Cannon’s TEMPUS CBC-20-HS series is a
2 mm backpanel connector system consisting of
receptacles and headers. Headers are available with
outside ground shields (Series 1000) or with an outer
shield in addition to column-wise stripline shields (Series
2000). Both headers mate to the Series 2000 receptacle,
which has outer shielding top and bottom with unique
column-wise stripline shielding.
8-Row - Female Signal Modules
10
8-Row - Male Signal Modules
11
8-Row - Male Signal Modules - Feed-through
12
8-Row - Male Signal Modules - Shrouds
13
Plating Cross Reference
14
Hole Geometry Notes
15
Application and Repair
15
Product Safety Information
16
Apart from these features, the HS series is similar to the
Cannon TEMPUS CBC-20 Connectors in profile, footprint
and mating interface. The stripline structure and shields
allow the Tempus HS Series to have improved signal
performance when routed in either a single-ended or a
differential pair configuration.
The Tempus HS product line is designed to conform to
the same equipment practice as all other CBC-20
products. This gives the customer access to the largest
variety of complementary products and sources within the
backplane connector market.
Standards
The Cannon Tempus HS product is designed to meet the identical product standards as FCI to assure our products are
form, fit and function compatible. The HS product standard is also drafted to be compatible with the existing
equipment practice defined in IEC 61076-4-104.
Product standard:
·CAS-21031 (5-row)
·CAS-21032 (8-row)
Environmental:
·Telcordia GR-1217-CORE (pending)
Flammability:
·UL 94V-0
Testing and Qualification
Full test reports are available upon request:
Signal Integrity Validation Report: 02072K
ITT Industries, Cannon, a Division of ITT Industries, Inc. manufactures the highest quality products available in the marketplace; however these products are intended to be used in accordance
with the specifications in this publication. Any use or application that deviates from the stated operating specifications is not recommended and may be unsafe. No information and data
contained in this publication shall be construed to create any liability on the part of Cannon.
Any new issue of this publication shall automatically invalidate and supersede any and all previous issues. A limited warranty applies to Cannon products. Except for obligations assumed
by Cannon under this warranty, Cannon shall not be liable for any loss, damage, cost of repairs, incidental or consequential damages of any kind, whether or not based on express
or implied warranty, contract, negligence, or strict liability arising in connection with the design, manufacture, sale, use, or repair of the products. Product availability, prices and
delivery dates are exclusively subject to our respective order confirmation form; the same applies to orders based on development samples delivered. This publication is not to be construed as
an offer. It is intended merely as an invitation to make an offer. By this publication, Cannon does not assume responsibility or any liability for any patent infringements or other rights of third
parties which may result from its use. Reprinting this publication is generally permitted, indicating the source. However, Cannon‘s prior consent must be obtained in all cases.
Cannon is a trademark of ITT Industries, Inc in the United States.
Dimensions are shown in mm (inch)
Dimensions subject to change
2
TEMPUS HS
2 mm Interconnect
General Data
GENERAL:
ITT Industries, Cannon TEMPUS
CBC-20-HS 1000 and 2000 Series
are consistent with standard
TEMPUS. The system is a typical
right-angle female socket on the
removable daughtercards and vertical male header on the backplane.
Both mating halves are offered
with press-fit termination.
Contact Pitch
2.00 x 2.00 (.079 x .079)
Standard Contact Mating Lengths
5.00, 5.75, 6.50, 7.25. and 8.00.
Rear plug-up lengths of 13.6 and 17.0
are also standard.
Standard module arrangements
Number of Contacts
Layout
Module Length
30
5X6
12.0
96
8 X 12
24.0
Contact Arrangements
Refer to relevant connector design
notes, all arrangements are standardized in accordance with IEC,
EIA, and IEEE specifications.
Flammability Rating
UL 94V-0
Contact Materials
Cu Alloy
Plating Options
Press-fit Area: Tin-Lead over Nickel
base.
Contact Area: Gold over Nickel base
or Gold over Palladium Nickel over a
Nickel base.
Insulator Material
High-Temperature Thermoplastic
Electrical
Current Rating
1.0 A at 30°C T-rise above ambient,
all pins powered.
2.0 A at 30°C T-rise above ambient,
one contact powered.
Contact Resistance
Maximum initial contact resistance
on signal contacts and on grounds
25 mΩ.
Voltage Proof
500 VDC or 500 VAC peak RMS
or AC, 60 Hz.
Capacitance
<3.0 pF at 1MHz, 1V.
Inductance
<15 nH at 1 MHz
Propagation Delay
Prop delay <300 ps
Skew between rows < 40 ps
Insulation Resistance
>1000 MΩ at 500 VDC.
Measured at 500 ps risetime, 50 Ω
reference impedance.
Characteristic Impedance
55±5 Ω single ended except where
last column is unbounded by another
connector, then 61±5 Ω single ended.
Measured at 500 ps (10-90%).
Cross Talk
Please refer to the Signal Integrity
Performance Report.
MECHANICAL:
Compliant Pin Terminal
Backplane
Male/Header
Daughtercard
Female/Socket
Press-in < 100 N
< 32 N
Push-out> 20 N
>7N
Forces measured per pin average
at 5.1mm/min.
Total 8x12 header insertion force
shall not exceed 11,400 N.
Total 8x12 receptacle insertion
force shall not exceed 3,776 N.
Repairability
3 repair cycles.
Radial hole distortion
<50 mm max, <37.5 mm average
over 10.
PCB Hole Wall Damage
>7.5 mm min copper between
pin and laminate. No cracks
permitted.
PCB Thickness Recommendations
1.30 mm min BP & DC
2.50 mm max DC (5-row std)
3.40 mm max DC
(5-row wide-body & 8-row)
Mating/Unmating Force
Insertion < 0.55 N
Withdrawal >0.15 N
Per contact force measured
at 25.4 mm/min.
Max Mating
5 X 6 16.5 N [3.67 lbs]
8 X 12 52.8 N [11.75 lbs]
Min Unmating
5 X 6 4.5 N [1.00 lbs]
8 X 12 14.4 N [3.20 lbs]
Dimensions are shown in mm (inch)
Dimensions subject to change
3
2 mm Interconnect
TEMPUS HS
Connector Selection
Single-Ended Selection Table
Size
Connector
Density Ground Configuration
Backward Crosstalk @ Signal Risetime
2 ns
1 ns
500 ps 200 ps
5 row
1000 Series
32 contacts/in. Staggered (S/G=1/1)
0.9%
1.9%
3.6%
8.9%
1000 Series
51 contacts/in. Row C grounded
4.6%
8.8%
-
-
2000 Series
51 contacts/in. Row C grounded
4.4%
8.3%
-
-
1000 Series
63 contacts/in. None
9.4%
-
-
-
1000 Series
50 contacts/in. Staggered (S/G=1/1)
1.1%
2.5%
4.6%
8.7%
1000 Series
76 contacts/in. Rows C and F grounded
4.8%
9.6%
-
-
2000 Series
76 contacts/in. Rows C and F grounded
4.7%
9.2%
-
-
2000 Series
101 contacts/in. None
9%
-
-
-
8 row
The single-ended selection table gives an estimate of the worst-case noise to be expected for a given HS
connector in a particular grounding pattern. Starting with a particular signal edge rate, the table will
tell what the theoretic worst-case noise is for the listed configurations. This can be weighed against
the signal density requirement to select the 5 or 8 row version required.
Differential Pair Selection Table
PCB Material
Size
Density
Connector
Maximum Trace Length @ Bit Rate
1.25 Gb/s
2.5 Gb/s
3.2 Gb/s
FR-4
5 row
25 pairs/in.
1000 Series
1.25 m
0.42 m
-
2000 Series
1.40 m
0.52 m
0.32 m
1000 Series
1.25 m
0.42 m
-
2000 Series
1.40 m
0.52 m
0.32 m
1000 Series
>1.50 m
0.66 m
0.50 m
2000 Series
>1.50 m
0.80 m
0.65 m
1000 Series
>1.50 m
0.66 m
0.45 m
2000 Series
>1.50 m
0.80 m
0.65 m
8 row
Rogers 4350
5 row
8 row
38 pairs/in.
25 pairs/in.
38 pairs/in.
The differential pair selection table compares the connector versions based on simulated system
link. For each connector and two popular PCB materials, the table lists the length of the backplane
trace where the signal losses become unacceptable.
The data in these tables was compiled from simulations using standard PCB manufacturing rules and edge-coupled traces for differential pairs.
Other board materials and advanced design rules can improve the signal performance from that shown.
Dimensions are shown in mm (inch)
Dimensions subject to change
4
TEMPUS HS
2 mm Interconnect
5-ROW - FEMALE SIGNAL MODULES
11,98
(.471)
10,00
(.394)
10,80
(.425
4,00
(.157)
9,50
(.374)
8,00
(.315)
8,00
(.315)
2,00
(.079)
2,00
(.079)
4,12
(.162)
Ø1,53
(.060)
Ø2,05
(.081)
2,00
(.079)
8,00
(.315)
5,00
(.197)
4,00
(.157)
2,00
(.079)
1,62
(.064)
2,00
(.079)
2,00
(.079)
3,00
(.118)
Ø0.65
(.026)
23,60
(.929)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
(1)
(Refer to Customer Drawing Number K026717Y2011.)
(2)
(Refer to Customer Drawing Number K026717Y2020.)
No. of Signal
Part Number
Version
PCB Thickness
Dim 'A'
30
CBC20HS2000-030FDP1-500- y -VR
1,3 - 2,5 (.05-.10)
13,3 (.52)
30
CBC20HS2000-030FXP1-500- y -VR
Standard(1)
Wide-Body(2)
1,3 - 3,4 (.05-.13)
14,3 (.56)
Positions
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27µm Au (Gold)
3 : 0.8 µm Au (Gold)
Dimensions are shown in mm (inch)
Dimensions subject to change
5
2 mm Interconnect
TEMPUS HS
5-ROW - MALE SIGNAL MODULES
11,98
(.471)
Ø0,65
(.026)
10,00
(.394)
2,00
(.079)
12,00
(.472)
13,50
(.532)
17,80
(.701)
0,50
(.020)
2,00
(.079)
0,50
(.020)
2,00
(.079)
10,00
(.394)
17,00
(.669)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
*
(Refer to Customer Drawing Number K026717Y2010.)
**
(Refer to Customer Drawing Number K026717Y2018.)
Part Number Nomenclature: CBC20HSwwww-030WDP3-zzz-y-VR
wwww : Series Number:
1000 = without stripline shield *
2000 = with stripline shield * *
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27µm Au (Gold)
3 : 0.8 µm Au (Gold)
zzz : Sequencing/Pin Length, dim 'L':
Pattern No.*
GND-Row
Row-A
Row-B
Row-C
Row-D
Row-E
501
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
502
5.00 (.196)
6.50 (.255)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
503
5.00 (.196)
6.50 (.255)
5.75 (.226)
5.75 (.226)
6.50 (.255)
5.75 (.226)
505
5.00 (.196)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
509
5.00 (.196)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
*Other loading patterns possible upon request.
Dimensions are shown in mm (inch)
Dimensions subject to change
6
TEMPUS HS
2 mm Interconnect
5-ROW - MALE SIGNAL MODULES - WIDE BODY
11,98
(.471)
Ø0,65
(.026)
10,00
(.394)
2,00
(.079)
12,00
(.472)
14,50
(.532)
18,80
(.701)
0,50
(.020)
2,00
(.079)
0,50
(.020)
2,00
(.079)
10,00
(.394)
17,00
(.669)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
*
(Refer to Customer Drawing Number K026717Y2016.)
**
(Refer to Customer Drawing Number K026717Y2025.)
Part Number Nomenclature: CBC20HSwwww-030WXP3-zzz-y-VR
wwww : Series Number:
y : Plating Selection:
1000 = without stripline shield *
2000 = with stripline shield * *
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27µm Au (Gold)
3 : 0.8 µm Au (Gold)
zzz : Sequencing/Pin Length, dim 'L':
Pattern No.*
GND-Row
Row-A
Row-B
Row-C
Row-D
Row-E
501
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
502
5.00 (.196)
6.50 (.255)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
503
5.00 (.196)
6.50 (.255)
5.75 (.226)
5.75 (.226)
6.50 (.255)
5.75 (.226)
505
5.00 (.196)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
509
5.00 (.196)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
*Other loading patterns possible upon request.
Dimensions are shown in mm (inch)
Dimensions subject to change
7
2 mm Interconnect
TEMPUS HS
5-ROW - MALE SIGNAL MODULES - FEED-THROUGH
11,98
(.471)
Ø0,65
(.026)
10,00
(.394)
L
2,00
(.079)
0,50
(.020)
K
12,00
(.472)
K + 4.3
2,00
(.079)
0,50
(.020)
2,00
(.079)
3,50
(.138)
10,00
(.394)
17,00
(.669)
Refer to Design
(1)*
(2)*
(1)* *
(2)* *
Recommended P.C.B. Hole Pattern
Component Side
Notes on page 14 for circuit board drill and hole plating details.
(Refer to Customer Drawing Number K026717Y2021.)
(Refer to Customer Drawing Number K026717Y2022.)
(Refer to Customer Drawing Number K026717Y2027.)
(Refer to Customer Drawing Number K026717Y2028.)
Part Number Nomenclature : CBC20HSwwww-030Wuvv-zzz-y-VR
vv-zzz : Sequencing/Pin Length:
Pattern No.*
vv-zzz
wwww : Series Number:
1000 = without stripline shield *
2000 = with stripline shield * *
Dim 'L'
GND
-Row
Dim 'M'
Signals
All
A-F
U1-501
5.00 (.196)
5.00 (.196)
13.60 (.535)
u : Housing Version:
Dim 'K'
PCB Thickness
U1-503
5.00 (.196)
6.50 (.255)
13.60 (.535)
u=D
Standard (1)
13.50 (.532)
1.20 - 2.50 (.047 - .098)
U1-509
5.00 (.196)
5.75 (.226)
13.60 (.535)
u=X
Wide-Body (2)
14.50 (.571)
1.20 - 3.40 (.047 - .134)
V2-501
5.00 (.196)
5.00 (.196)
17.00 (.669)
V2-503
5.00 (.196)
6.50 (.255)
17.00 (.669)
V2-509
5.00 (.196)
5.75 (.226)
17.00 (.669)
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27 µm Au (Gold)
3 : 0.8 µm Au (Gold)
*Other loading patterns possible upon request.
Dimensions are shown in mm (inch)
Dimensions subject to change
8
TEMPUS HS
2 mm Interconnect
5-ROW - MALE SIGNAL MODULES - SHROUDS
11,98
(.471)
3,50
(.138)
Ø0,65
(.026)
10,00
(.394)
K
12,00
(.472)
K + 4.3
2,00
(.079)
2,00
(.079)
17,00
(.669)
10,00
(.394)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
(1)*
(Refer to Customer Drawing Number K026717Y2023.)
(2)**
(Refer to Customer Drawing Number K026717Y2029.)
Part Number Nomenclature : CBC20HSwwww-030R5u-y-VR
wwww : Series Number:
1000 = without stripline shield*
2000 = with stripline shield **
u : Housing Version:
u = D Standard (1)
u = X Wide-Body (2)
Dim 'K'
13.50 (.531)
14.50 (.571)
PCB Thickness
1.20 - 2.50 (.047 - .098)
1.20 - 3.40 (.047 - .134)
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27 µm Au (Gold)
3 : 0.8 µm Au (Gold)
Dimensions are shown in mm (inch)
Dimensions subject to change
9
2 mm Interconnect
TEMPUS HS
8-ROW - FEMALE SIGNAL MODULES
23,90
(.941)
22,00
(.866)
20,20
(.735)
9,50
(.374)
14,00
(.551)
4,00
(.157)
23,98 MAX
(.944)
2,00
(.079)
2,00
(.079)
2,00
(.079)
Ø0.65
(.026)
Ø2,05
(.081)
14,00
(.551)
Ø1,53
(.060)
2,00
(.079)
2,00
(.079)
3,30
(.130)
1,62
(.064)
29,60
(1.165)
3,70
(.146)
1,62
(.064)
1,00
(.039)
2,00
(.079)
12,00
(.472)
Recommended P.C.B. Hole Pattern
Component Side
4,00
(.157)
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
(Refer to Customer Drawing Number K026717Y2015.)
No. of Signal
Positions
Part Number
Version
PCB Thickness
96
CBC20HS2000-096FDP1-800-y-VR
Wide-Body
1,3 - 3,4 (.05 - .13)
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27µm Au (Gold)
3 : 0.8 µm Au (Gold)
Dimensions are shown in mm (inch)
Dimensions subject to change
10
TEMPUS HS
2 mm Interconnect
8-ROW - MALE SIGNAL MODULES
23,98
(.944)
22,00
(.866)
2,00
(.079)
Ø0,65
(.026)
1
M
1
20,35
(.801)
0,50
(.020)
12
12
18,00
(.709)
24,15
(.951)
0,50
(.020)
2,00
(.079)
16,70
(.657)
2,00
(.079)
22,00
(.866)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
*
(Refer to Customer Drawing Number K026717Y2013.)
**
(Refer to Customer Drawing Number K026717Y2019.)
Part Number Nomenclature: CBC20HSwwww-096WDP3-zzz-y-VR
wwww : Series Number:
1000 = without stripline shield *
2000 = with stripline shield * *
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27 µm Au (Gold)
3 : 0.8 µm Au (Gold)
zzz : Sequencing/Pin Length, dim 'L':
Pattern No.*
GND-Row
Row-A
Row-C
Row-D
Row-E
Row-F
Row-G
Row-H
801
5.00 (.196)
5.00 (.196)
5.00 (.196)
Row-B
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
805
5.00 (.196)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
809
5.00 (.196)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
*Other loading patterns possible upon request.
Dimensions are shown in mm (inch)
Dimensions subject to change
11
2 mm Interconnect
TEMPUS HS
8-ROW - MALE SIGNAL MODULES - FEED-THROUGH
23,98
(.944)
22,00
(.866)
3,50
(.138)
2,00
(.079)
1
Ø0,65
(.026)
12
1
20,35
(.801)
0,50
(.020)
12
18,00
(.079)
24,15
(.951)
2,00
(.079)
0,50
(.020)
2,00
(.079
16,70
(.657)
22,00
(.866)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
*
(Refer to Customer Drawing Number K026717Y2024.)
**
(Refer to Customer Drawing Number K026717Y2030.)
Part Number Nomenclature : CBC20HSwwww-096WDvv-zzz-y-VR
wwww : Series Number:
1000 = without stripline shield *
2000 = with stripline shield * *
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27 µm Au (Gold)
3 : 0.8 µm Au (Gold)
zzz : Sequencing/Pin Length, dim 'L':
Pattern No.*
GND-Row
Row-A
Row-B
Row-C
Row-D
Row-E
Row-F
Row-G
Row-H
801
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
5.00 (.196)
805
5.00 (.196)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
6.50 (.255)
809
5.00 (.196)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
5.75 (.226)
*Other loading patterns possible upon request.
Dimensions are shown in mm (inch)
Dimensions subject to change
12
TEMPUS HS
2 mm Interconnect
8-ROW - MALE SIGNAL MODULES - SHROUDS
23,98
(.944)
22,00
(.866)
3,50
(.138)
1
Ø0,65
(.026)
12
12
1
20,35
(.801)
18,00
(.079)
24,15
(.951)
2,00
(.079)
16,70
(.657)
2,00
(.079
22,00
(.866)
Recommended P.C.B. Hole Pattern
Component Side
Refer to Design Notes on page 14 for circuit board drill and hole plating details.
*
(Refer to Customer Drawing Number K026717Y2026.)
**
(Refer to Customer Drawing Number K026717Y2031.)
Part Number Nomenclature : CBC20HSwwww-096R8D-y-VR
wwww : Series Number:
1000 = without stripline shield *
2000 = with stripline shield * *
y : Plating Selection:
1 : 0.7 µm PdNi (Palladium Nickel)
2 : 1.27 µm Au (Gold)
3 : 0.8 µm Au (Gold)
Dimensions are shown in mm (inch)
Dimensions subject to change
13
2 mm Interconnect
TEMPUS HS
PLATING CROSS REFERENCE
Mating Area:
We Recommend:
Tempus
Plating : “Y”
Durability
0.7 µm PdNi
1
1000 Cycles
1.27 µm Au
2
500 Cycles
0.8 µm Au
3
250 Cycles
Environment
If You Use:
Metral * Plating: “X”
Header
Receptacle
TBA
(Please contact product manager
at ITT Industries, Cannon for
detailed information)
9S
9
3
1
5
9
3
2
1
ASSEMBLY DRAWING REFERENCE
2000 - Series
1000 - Series
Standard
5-Row Female
Wide-Body
(See 2000 Series)
Standard
Wide-Body
K026717Y2011
K026717Y2020
5-Row Male
K026717Y2010
K026717Y2016
K026717Y2018
K026717Y2025
5-Row Male Feed-Thru
K026717Y2021
K026717Y2022
K026717Y2027
K026717Y2028
5-Row Shroud
K026717Y2023
K026717Y2029
8-Row Female
(See 2000 Series)
K026717Y2015
8-Row Male
K026717Y2013
K026717Y2019
8-Row Male Feed-Thru
K026717Y2024
K026717Y2030
8-Row Shroud
K026717Y2026
K026717Y2031
Wide-Body vs. Standard
Standard Body
2.5 MAX PCB Thickness
Wide-Body
3.4 MAX PCB Thickness
Cutout for oversized Boards 6.2 MIN
The "standard' housing style follows the rest of the Tempus
product line in equipment practice. The standard only allows
for up to 2.5 mm thick PCB's. With increased row count and
increased signal speeds, it is likely that the daughtercard PCB
will exceed 2.5 mm thick. For this reason, the "wide-body"
version has been developed for the 5-row which allows up to
3.4 mm PCB thickness. This allowance is standard on 8-row.
If the PBC is larger than 3.4 mm, it is allowable to remove PCB
material from the under side of the daughtercard at least
6.2 mm back from the edge as shown in the figure to the left.
Care must be taken in this approach, since the first row of
ground pins are 5 mm and the first signals are 7 mm from the
card edge.
3.4 or 2.5, as required for housing style
* Trademark of the FCI Corporation
Dimensions are shown in mm (inch)
Dimensions subject to change
14
TEMPUS HS
2 mm Interconnect
HOLE GEOMETRY NOTES
Ø
Ø
Ø
Ø
The recommended plated through hole configuration is a tin-lead finish over copper. The Tempus products have been
tested for repairability and environmental conformance with this design. It is acknowledged that for many reasons
alternate hole finishes may be considered. Please note that although these treatments (such as OSP, immersion gold or
immersion silver over copper) have been used successfully, they have not been verified to conform to Telcordia GR-1217CORE.
APPLICATION AND REPAIR
The TEMPUS CBC-20-HS product line is designed to be compatible with standard CBC-20 press-fit assembly and repair
methods. The system is supported by a full range of application tooling for prototype to mass-production volumes. For
a complete overview of products available and instructions please refer to Cannon document CAS 25012E.
Dimensions are shown in mm (inch)
Dimensions subject to change
15
Product Safety Information
THIS NOTE MUST BE READ IN CONJUNCTION
WITH THE PRODUCT DATA SHEET/
CATALOGUE.
Failure to observe the advice in this
information sheet and the operating
conditions specified in the Product Data
Sheet
/Catalogue could result in hazardous
situations.
MATERIAL CONTENT AND PHYSICAL FORM
Electrical connectors do not usually contain
hazardous materials. They contain conducting
and non-conducting materials and can be
divided into two groups.
a) Printed circuit types and low cost audio
types which employ all plastic insulators and
casings.
b) Rugged, fire barrier and high reliability
types with metal casings and either natural
rubber, synthetic rubber, plastic or glass
insulating materials. Contact materials vary
with type of connector and also application and
are usually manufactured from either: Copper,
copper alloys, nickel, alumel, chromel or steel.
In special applications, other alloys may be
specified.
FIRE CHARACTERISTICS AND ELECTRIC
SHOCK HAZARD
There is no fire hazard when the connector
is correctly wired and used within the
specified parameters. Incorrect wiring or
assembly of the connector or careless use of
metal tools or conductive fluids, or transit
damage to any of the component parts may
cause electric shock or burns. Live circuits
must not be broken by separating mated
connectors as this may cause arcing,
ionisation and burning.
Heat dissipation is greater at maximum
resistance in a circuit. Hot spots may occur
when resistance is raised locally by damage,
e.g. cracked or deformed contacts, broken
strands of wire. Local overheating may also
result from the use of the incorrect application
tools or from poor quality soldering or slack
screw terminals. Overheating may occur if the
ratings in the product Data Sheet/Catalogue are
exceeded and can cause breakdown of
insulation and hence electric shock.
If heating is allowed to continue it intensifies
by further increasing the local resistance
through loss of temper of spring contacts,
formation of oxide film on contacts and wires
and leakage currents through carbonisation of
insulation and tracking paths.
Fire can then result in the presence of
combustible materials and this may release
noxious fumes. Overheating may not be
visually apparent. Burns may result from
touching overheated components.
HANDLING
Care must be taken to avoid damage to any
component parts of electrical connectors during
installation and use. Although there are
normally no sharp edges, care must be taken
when handling certain components to avoid
injury to fingers.
Electrical connectors may be damaged in transit
to the customers, and damage may result in
creation of hazards. Products should therefore
be examined prior to installation/use and
rejected if found to be damaged.
DISPOSAL
Incineration of certain materials may release
noxious or even toxic fumes.
APPLICATION
Connectors with exposed contacts should not
be selected for use on the current supply side
of an electrical circuit, because an electric shock
could result from touching exposed contacts on
an unmated connector. Voltages in excess of
30 V ac. or 42.5 V dc are potentially hazardous
and care should be taken to ensure that such
voltages cannot be transmitted in any way to
exposed metal parts of the connector body. The
connector and wiring should be checked,
before making live, to have no damage to
metal parts or insulators, no solder blobs, loose
strands, conducting lubricants, swarf, or any
other undesired conducting particles.
Insulation resistance should be checked to
make certain that no low resistance joints or
spurious conducting paths are existing between
contacts and exposed metal parts of the
connector body. Further, the contact resistance
of the connectors should be measured within
the electrical circuit in order to identify high
resistances, which result in excessive connector
heating.
IMPORTANT GENERAL INFORMATION
(i) Air and creepage paths/Operating
voltage
The admissible operating voltages depend on
the individual applications and the valid
national and other applicable safety
regulations.
For this reason the air and creepage path data
are only reference values. Observe reduction of
air and creepage paths due to PC board and/or
harnessing.
(ii) Temperature
All information given are temperature limits.
The operation temperature depends on the
individual application.
(iii) Other important information
Cannon continuously endeavours to improve
their products. Therefore, Cannon products may
deviate from the description, technical data and
shape as shown in this catalog and data
sheets.
(iv) Harnessing and Assembly Instructions
If applicable, our special harnessing and/or
assembly instruction has to be adhered to. This
is provided on request.
Always use the correct application tools as
specified in the Data Sheet/Catalogue.
Do not permit untrained personnel to wire,
assemble or tamper with connectors.
For operation voltage please see appropriate
national regulations.
Dimensions are shown in mm (inch)
Dimensions subject to change
16
Notes
Dimensions are shown in mm (inch)
Dimensions subject to change
Cannon Worldwide Facilities
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Heinrich von Buol - Gasse 10
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FAX: 43.1.259.47.72
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Denmark:
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FAX: 33.1.64.33.16.82 PH: 33.1.60 24 51 51
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FAX: 41.1.830.3104
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FAX: 852.2732.2919
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FAX: 44.1256.323356
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FAX: 1.860.635.2010
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20123 Milano
FAX: 39.2.8372036
PH: 39.2.58180.1
Tempus HS 1/1102 2002 ITT Industries, Inc. Printed in the United Kingdom, All Rights Reserved
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