DDR3 - LOGIC Devices, Inc.

SHORT FORM PRODUCT GUIDE
DDR2, DDR3, SRAM, SSD
00101010101100001110100001
010
011001000 01
01010
010101
1 011011011000011010000001101010101010101011011011001000110100001010110000110
1100100
00001010001010011010100
00
10001011101010101101010101
101
011010110000110101011
011010
0 1001010101011000110001000111010101000101110101010101010101010101010100100100101011010110000
01
11001001
00110011001000100101010
011 000011010101010101010110110
11011100100011011000
000010
01010
1001
01100
100001
00111010
010000
000101
101000
000101
101001
001101
1010100011
011001
001010
010100
100110
110
1011001011011011100001001110110
101
01000011101010100101010
001 101010101011010110000110100000
0011
110101010
01011010101011011101100100011010000101011000011010000101000101
0100011101010001111011
0110101001110101
011000011010000011101
1101011000011
111010000
000110101010101101010110110011001000110100001
01010
0 110000110100
0000010010101110101010
0101101001001010
010010101010110000011
101
010101
110010 01010
10 10101011101011000001
001101000
000001
001101
101010
01011010
0101101
1 0100110110110010
101010
11011011001
110
10110
10
110010001
10001101
01101
1101
1010000010
101000
000010101
01010
010101
1010
101
01001010
100101
101110001111010
101110001111
100001
001111
1 101
0 101110001110
010
001010101011000001101
10101010101101001101101
1011
01 011001
01000
00 110100001
010000101
0100110
11000
10000
10
0000110
11010
0100
10000101000
00001010
1000011010011010100
0010101100001101001
0100100
00001101000011101010101010101011000110010001010101010110101100001101000
000011010000001
00011
110101010101010101101101111001010111000110101011
0110101010
00101010101010101101101111001010111
101010010010100101101101111
1011101
101101101
1 101111
101111110
100
0010010
00
001
10011100011010101
11100011010101
000110101
001101010111000111010101
0001
0010101010110000110
0011011
110101010101010101100011001000101010101011010110000110100000110101010101011010011011
01101
011001000
00110100
10 001101
01001110000
000110
110100
100001
00 010001
01010011010100
0010101010110000011011
10101010101101011101
011011
1100
001000
00110
110100
10000010
01010
010110000110100001010001010011010100
00110100000110101010101010101101101100100011010000101011000101011010000101
01010101
1011011001000110100
000100
0000
00001101101010101101010111010111101
101011000101011010000101
0101010100010100010110
00101001010101011011110101010101010101010100111010101010101010110001100100
10001100100
1000110
010000101010101011010110000110
001010101010110101100001
0101010101011010110000110
1101
10100
10
000
00001101101010101101010111010111101
11010101110101000
001101
101
0101010101000101110101010100001011000010000100000101001110000101010100010100011111010101011010001
100011111010101011010001
0100101
0101
0100100101001010010000111010100100100011
1010100010111010110
10100
0010001110101010001011101010101101
0100101
01010101010101010101010110101100001101
01
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CompanyPROFILE
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ŚŝŐŚͲƉĞƌĨŽƌŵĂŶĐĞŝŶƚĞŐƌĂƚĞĚĐŝƌĐƵŝƚƐ͘KƵƌƚĞĐŚŶŽůŽŐŝĞƐĂƌĞƵƟůŝnjĞĚŝŶĂǁŝĚĞ
ƌĂŶŐĞ ŽĨ ǀŝĚĞŽ ĂŶĚ ŵĞĚŝĐĂů ŝŵĂŐĞ ƉƌŽĐĞƐƐŝŶŐ͕ ƚĞůĞĐŽŵŵƵŶŝĐĂƟŽŶƐ͕
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ƉƌŽǀŝĚŝŶŐ ŽƵƌ ĐƵƐƚŽŵĞƌƐ ǁŝƚŚ ƚŚĞ ŚŝŐŚĞƐƚ ƉĞƌĨŽƌŵŝŶŐ ƉƌŽĚƵĐƚƐ͕ ƉƌŽĐĞƐƐĞĚ
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ƉƌŝĐĞ͘
ProductOVERVIEW
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memory modules.
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ǁŚŝĐŚŽīĞƌƐŚŝŐŚͲƌĞůŝĂďŝůŝƚLJ͕ĞdžĐĞƉƟŽŶĂůĞŶĚƵƌĂŶĐĞ͕ĂŶĚĨƌĞĞĚŽŵĨƌŽŵƐŚŽĐŬĂŶĚǀŝďƌĂƟŽŶŝƐƐƵĞƐƚŚĂƚ
ŽŌĞŶ ƉůĂŐƵĞ ĐŽŶŶĞĐƚŽƌ ďĂƐĞĚ ^^Ɛ͘ KƵƌ ^^ ĨĂŵŝůLJ ŝƐ ŶŽƚ ũƵƐƚ Ă ŚŝŐŚ ƉĞƌĨŽƌŵĂŶĐĞ͕ ŚŝŐŚͲƌĞůŝĂďŝůŝƚLJ
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ƚŚĞ ƵƐĞ ŽĨ ŚŝŐŚ ƋƵĂůŝƚLJ ĂƐƐĞŵďůLJ ŵĂƚĞƌŝĂůƐ Θ ƚĞĐŚŶŝƋƵĞƐ͕ ĂŶĚ ǁŽƌůĚ ĐůĂƐƐ ƐƵďĐŽŶƚƌĂĐƚŽƌƐ ƚŚĂƚ ƌĞƐƵůƚ
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ƉƌŽĚƵĐƚƐƚŽD/>ͲWZ&ϯϴϱϯϱ͘
Typical Digital Processing:
Analog Real World
Interfaces
Processor
Digital Interfaces
Cache Memory
Main Memory
Mass Memory
Off-line Storage
SRAM
10ns
SDRAM
50ns
Solid State Drive
500μs
Magnetic Tape,
Removable Media
LOGIC Memory Solutions
1
Short Form Product Guide
INTEGRATED MEMORY SOLUTIONS
DDR2
DDR3
Integrated Memory Modules
ϮϱŵŵdžϮϱŵŵW'
L9D232MxxSBG5
Ϯ'ď͕ϯϮDdžϲϰ;ϮϱϲDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
Ϯ͘ϯ'ď͕ϯϮDdžϳϮ;ϮϴϴDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
Ϯ͘ϱ'ď͕ϯϮDdžϴϬ;ϯϮϬDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
L9D264MxxSBG5
ϰ'ď͕ϲϰDdžϲϰ;ϱϭϮDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
ϰ͘ϲ'ď͕ϲϰDdžϳϮ;ϱϳϲDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
ϱ'ď͕ϲϰDdžϴϬ;ϭ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϲ
Integrated Memory Modules
ϭϭŵŵdžϭϰŵŵƐƚĂŶĚĂƌĚ^ZDĨŽŽƚƉƌŝŶƚW'
L9D3256M32SBG1
ϴ'ď͕ϮϱϲDdžϯϮ;ϭ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
L9D3512M32SBG1
ϭϲ'ď͕ϱϭϮDdžϯϮ;Ϯ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϲ
ϭϲŵŵdžϮϮŵŵW'
L9D364M64SBG2
ϰ'ď͕ϲϰDdžϲϰ;ϱϭϮDďͿ͕^ŝŶŐůĞŚĂŶŶĞů
L9D3256M32DBG2
ϭϲ'ď͕ϮϱϲDdžϯϮ;Ϯ'Ϳ͕ƵĂůŚĂŶŶĞůͬdžϲϰ^ŝŶŐůĞŚĂŶŶĞů
L9D3512M32DBG2
ϯϮ'ď͕ϱϭϮDdžϯϮ;ϰ'Ϳ͕ƵĂůŚĂŶŶĞůͬdžϲϰ^ŝŶŐůĞŚĂŶŶĞů
L9D3256M72SBG2
ϭϴ'ď͕ϮϱϲDdžϳϮ;Ϯ͘Ϯϱ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
L9D3256M80SBG2
ϮϬ'ď͕ϮϱϲDdžϴϬ;Ϯ͘ϱ'Ϳ͕^ŝŶŐůĞŚĂŶŶĞů
ϳ
ϳ
ϴ
ϵ
ϵ
ϭϬ
ϭϬ
/Ed'ZdDDKZz^K>hd/KE^ĐŽŶƟŶƵĞĚ͘͘͘
^ZD
SSD
ƐLJŶĐŚƌŽŶŽƵƐ^ƚĂƟĐZĂŶĚŽŵĐĐĞƐƐDĞŵŽƌLJ
ϭϮϴ<džϴ͕ůŽǁƉŽǁĞƌ͕ŚĞƌŵĞƟĐƉĂĐŬĂŐĞ
L7C108Y/D; L7C109Y/D/K/KA
ϭDď͕ϭϮŶƐ
ϱϭϮ<džϴ͕ůŽǁƉŽǁĞƌ͕ŚĞƌŵĞƟĐƉĂĐŬĂŐĞ
L7C1049Y
ϰDď͕ϭϬŶƐ
11
11
Serial ATA Solid State Drive-on-Chip
L8SCxxxxxxxx
ϭϮ
ϯϱŵŵdžϯϱŵŵW'
Ϯϱ'ͲϰϬϬ'
Assembly Flows
WůĂƐƟĐ
Ceramic
SSD
YƵĂůŝĮĐĂƟŽŶĂƚĂ
ϭϯ
ϭϰ
ϭϱ
ϭϲ
Product Nomenclature Guide:
ZEÊÛđ½ƒãçٛ
Logic Devices Incorporated
Product Type
9D = DDR
2 = DDR2
3 = DDR3
Words
32M = 32 MB
64M = 64 MB
128M = 128 MB
256M = 256 MB
512M = 512 MB
1G = 1024 MB
Wordwidth
32 = x32
64 = x64
72 = x72
80 = x80
S = Single Channel
D = Dual Channel
Package
L
XXX XXXX XXX XXX X XX X
G
BG1 = 9 x 14 PBGA
BG2 = 16 x 22 PBGA
BG5 = 25 x 25 PBGA
Green Product Offering
G = RoHS compliant, lead-free
Power
L = Low Voltage
Speed Grade
5=
5ns / 200MHz / 400Mbs
38 = 3.75ns / 267 MHz / 533Mbs
3=
3ns / 333MHz / 667Mbs
25 = 2.5ns / 400MHz / 800Mbs
187 = 1.87ns / 533MHz / 1066Mbs
15 = 1.5ns / 667MHz / 1333Mbs
125 = 1.25ns / 800MHz / 1600Mbs
107 = 1.07ns / 933MHz / 1866Mbs
093 = 0.938ns /1066MHz / 2133Mbs
Temperature
C = Commercial (0oC to 70oC) I = Industrial (-40oC to 85oC)
E = Extended (-40oC to 105oC) M = Military (-55oC to 125oC)
^ZDEÊÛđ½ƒãçٛ
Logic Devices Incorporated
Product Type
7C = SRAM
108 = single chip enable, 1 Mb
109 = dual chip enable, 1 Mb
1049 = 4 Mb
Package Code
L XXXXX X
X
X XX X
D = ceramic DIP
Y = ceramic SOJ K = ceramic Dual LCC
KA = ceramic Quad LCC
Low Power Designator (Oponal)
L = Low Voltage
Speed Grade (ns)
Military Class
B = Military Class B
Temperature
E = Extended (-40oC to 105oC) I = Industrial (-40oC to 85oC) M = Military (-55oC to 125oC)
^^EÊÛđ½ƒãçٛ
Logic Devices Incorporated
SSD Product
Interface
A = 1.5 Gbps
B = 3.0 Gbps
C = 6.0 Gbps
Density
L
8S X XXXX X
X XX XX
0025 = 25 GB
0050 = 50 GB
0100 = 100GB
0200 = 200GB
0400 = 400GB
Producon Status
Blank = Producon
ES = Engineering Sample MS = Mechancial Sample
Temperature
IT = Industrial (-40oC to 85oC)
Reserved
(Reliability Tesng)
FLASH TYPE
M = MLC
S = SLC
Blank = Commercial (0oC to 70oC)
INTEGRATED MEMORY MODULE PRODUCT MATRIX
Part Number
Total Bits
x32
DDR2
L9D232M64SBG5
L9D232M72SBG5
L9D232M80SBG5
L9D264M64SBG5
L9D264M72SBG5
L9D264M80SBG5
Wordwidth
x64
x72
Package
x80
x
2.0Gb
2.3Gb
2.56Gb
4.0Gb
4.6Gb
5.0Gb
x
25 x 25mm
25 x 25mm
25 x 25mm
25 x 25mm
25 x 25mm
25 x 25mm
x
11 x 14mm
11 x 14mm
16 x 22mm
16 x 22mm
16 x 22mm
x
x
x
x
DDR3
L9D3256M32SBG1
L9D3512M32SBG1
L9D364M64SBG2
L9D3256M72SBG2
L9D3512M80SBG2
8.0Gb
16.0Gb
4.0Gb
18.0Gb
20.0Gb
x
x
16.0Gb
32.0Gb
x
x
x
x
DDR3 Dual Channel
L9D3256M32DBG2
L9D3512M32DBG2
16 x 22mm
16 x 22mm
DDR2
L9D232M64SBG5, L9D232M72SBG5, L9D232M80SBG5,
L9D264M64SBG5, L9D264M72SBG5, L9D264M80SBG5
2.0-5.0 Gb, DDR2, 32 M [64 M] x 64/72/80 Integrated Memory Module
&ĂƐƚ͕ůŽǁƉŽǁĞƌ͕ŚŝŐŚĚĞŶƐŝƚLJ͕ǁŝĚĞǁŽƌĚǁŝĚƚŚƐ
ZϮ͕ϱ͘Ϭ'ďŝDK
32 M [64 M] x 64/72/80, 25mm x 25mm, 255 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϱϯϯ͕ϲϲϳ͕ΘϴϬϬDďƉƐ/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
ZϮϮϱŵŵϮ Module
΀ŝDK΁͗
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! džϴϬ͕džϳϮ͕džϲϬǁŽƌĚǁŝĚƚŚƐ
ŚŝŐŚƉĞƌĨŽƌŵĂŶĐĞ͗
! ϱϯϯ͕ϲϲϳ͕ĂŶĚϴϬϬDďƉƐ
! ƚĞŵƉĞƌĂƚƵƌĞ͗
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D;ͲϱϱОƚŽнϭϮϱОC )
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! Ϯ͘ϰtĂƩƐŵĂdž
ƐƉĂĐĞƐĂǀŝŶŐĨŽŽƚƉƌŝŶƚ
! ϮϱŵŵdžϮϱŵŵ͕ϭϲdžϭϲ
ŵĂƚƌŝdžǁͬϮϱϱďĂůůƐ͕ϭ͘Ϯϳŵŵ
pitch
! ϭ͘ϳŵŵůŽǁƉƌŽĮůĞŚĞŝŐŚƚ
ƚŚĞƌŵĂůůLJĞŶŚĂŶĐĞĚ͕ŝŵƉĞĚĂŶĐĞ
ŵĂƚĐŚĞĚ͕ŝŶƚĞŐƌĂƚĞĚƉĂĐŬĂŐŝŶŐ
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
ĚŝīĞƌĞŶƟĂůĚĂƚĂƐƚƌŽďĞ
ϰŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϰ;ϯϮ'ďͿΘϴ;ϲϰ'ďͿŝŶƚĞƌŶĂů
ďĂŶŬƐ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
ƐƚƌŽďĞ͕ĂŶĚŵĂƐŬƐŝŐŶĂůƐ
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϯ͕ϰ͕ϱ͕ĂŶĚϲ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
! ϲϰŵƐϴϭϵϮͲĐLJĐůĞZ&Z^,
! ϯϮŵƐϴϭϵϮͲĐLJĐůĞZ&Z^,
ĂďŽǀĞϴϱОC
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
ĂĚũƵƐƚĂďůĞĚƌŝǀĞƐƚƌĞŶŐƚŚ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
ĞŶƐŝƚLJ͗
>ϵϮϯϮDϲϰ^'ϱ Ϯ͘Ϭ'ď
>ϵϮϯϮDϳϮ^'ϱ Ϯ͘Ϯ'ď
>ϵϮϯϮDϴϬ^'ϱϮ͘ϱ'ď
>ϵϮϲϰDϲϰ^'ϱ ϰ͘Ϭ'ď
>ϵϮϲϰDϳϮ^'ϱϰ͘ϱ'ď
>ϵϮϲϰDϴϬ^'ϱ ϱ͘Ϭ'ď
ĞƉƚŚ͗
ϯϮD
ϯϮD
ϯϮD
ϲϰD
ϲϰD
ϲϰD
tŽƌĚtŝĚƚŚƐ͗
džϲϰ
džϳϮ
džϴϬ
džϲϰ
džϳϮ
džϴϬ
ǀĂŝůĂďůĞdŝŵŝŶŐƐ͗
ŽŶĮŐƵƌĂƟŽŶ͗
ZϮͲϱϯϯ ZϮͲϲϲϳ
ZϮͲϴϬϬ ůŽĐŬ͗
ϮϲϳD,nj
ϯϯϯD,nj
ϰϬϬD,nj
LJĐůĞdŝŵĞ͗ĂƚĂZĂƚĞ͗
ϯ͘ϳϱŶƐ
ϱϯϯDďƉƐ ϯ͘ϬŶƐ
ϲϲϳDďƉƐ Ϯ͘ϱŶƐ
ϴϬϬDďƉƐ ϲ
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
‡
ƌĞĚƵĐĞĚ/ͬK;ϰϲйͿĐŽŶŶĞĐƟŽŶƐ
reduced trace lengths due to the
ŚŝŐŚůLJŝŶƚĞŐƌĂƚĞĚ͕ŝŵƉĞĚĂŶĐĞŵĂƚĐŚĞĚ
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
ZŽ,^ͲĐŽŵƉůŝĂŶƚ
DDR3
L9D3256M32SBG1, L9D3512M32SBG1
8.0-16.0 Gb, DDR3, 256 M [512 M] x 32 Integrated Memory Module
Zϯ͕ϴ͘ϬͲϭϲ͘Ϭ'ďŝDK
512 M - 1G x 16, 11mm x 14mm, 136 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϯϱs
ͲϬ͘ϬϲϳϱsͬнϬ͘ϭs
! ϭ͘ϯϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ƉƵƐŚͬƉƵůů/ͬK
! WĂĐŬĂŐĞ͗ϭϭŵŵdžϭϰŵŵdž
ϭ͘ϱŵŵ͕ϭϯϲďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗Ϭ͘ϴϬŵŵ
ƐƉĂĐĞƐĂǀŝŶŐĨŽŽƚƉƌŝŶƚ
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
ƐƚƌŽďĞ
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
ƐƚƌŽďĞ͕ĂŶĚŵĂƐŬƐŝŐŶĂůƐ
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϳ͕ϵ͕ĂŶĚϭϭ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϳ͕
ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
‡
‡
‡
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
;ĂŵďŝĞŶƚƚĞŵƉсdͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
! ŵŝůͲƚĞŵƉ͗ͲϱϱОƚŽнϭϮϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϲϲϳ͕
ϴϬϬD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϯϯϯ͕ϭϲϬϬ
DďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
‡
ϰϬйƐƉĂĐĞƐĂǀŝŶŐƐǁŚŝůĞƉƌŽǀŝĚŝŶŐĂ
ƐƵƌĨĂĐĞŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;Ϭ͘ϴϬŵŵͿ
ƌĞĚƵĐĞĚ/ͬKƌŽƵƟŶŐ;ϯϰйͿ
ϯϬйŝŵƉƌŽǀĞŵĞŶƚŝŶƌŽƵƟŶŐĨŽƌLJŽƵƌ
memory array
reduced trace lengths due to the
ŚŝŐŚůLJŝŶƚĞŐƌĂƚĞĚ͕ŝŵƉĞĚĂŶĐĞŵĂƚĐŚĞĚ
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϮϱϲDϯϮ^'ϭdžϭϮϱZϯͲϭϲϬϬ >ϵϯϮϱϲDϯϮ^'ϭdžϭϱZϯͲϭϯϯϯ ϭϭŵŵdžϭϰŵŵ ϵϲ
>ϵϯϱϭϮDϯϮ^'ϭdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϱϭϮDϯϮ^'ϭdžϭϱZϯͲϭϯϯϯ ϳ
ĂůůWŝƚĐŚ͗ W<'EŽ͗͘
Ϭ͘ϴϬŵŵ'ϭ
DDR3
L9D364M64SBG2
4.0 Gb, DDR3, 64 M x 64 Integrated Memory Module
Zϯ͕ϰ͘Ϭ'ďŝDK
64M x 64, 16mm x 22mm, 271 - I/O Thermally Enhanced PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϲϬϬ͕ϭϯϯϯ͕ΘϭϬϲϲDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDD сsDDQ = ϭ͘ϱs±Ϭ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
ϭ͘Ϯŵŵ͕ϭϯdžϮϭŵĂƚƌŝdžǁͬ
ϮϳϭďĂůůƐ
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
ƐƉĂĐĞƐĂǀŝŶŐĨŽŽƚƉƌŝŶƚ
ƚŚĞƌŵĂůůLJĞŶŚĂŶĐĞĚ͕ŝŵƉĞĚĂŶĐĞ
ŵĂƚĐŚĞĚ͕ŝŶƚĞŐƌĂƚĞĚƉĂĐŬĂŐŝŶŐ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
ƐƚƌŽďĞ
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
ƐƚƌŽďĞ͕ĂŶĚŵĂƐŬƐŝŐŶĂůƐ
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭĂŶĚ
ϭϯ
‡
‡
‡
‡
‡
ĞŶĞĮƚƐ͗
‡
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕ϳ͕
ϴ͕ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
;ĂŵďŝĞŶƚƚĞŵƉсdͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
‡
‡
‡
‡
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
‡
‡
‡
‡
‡
‡
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞZ&Z^,
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϱϯϯ͕
ϲϲϳ͕ϴϬϬD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϬϲϲ͕ϭϯϯϯ͕
ĂŶĚϭϲϬϬDďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
ϰϬйƐƉĂĐĞƐĂǀŝŶŐƐǁŚŝůĞƉƌŽǀŝĚŝŶŐĂ
ƐƵƌĨĂĐĞŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ZĞĚƵĐĞĚ/ͬKƌŽƵƟŶŐ;ϯϰйͿ
ϯϬйŝŵƉƌŽǀĞŵĞŶƚŝŶƌŽƵƟŶŐƐĨŽƌLJŽƵƌ
memory array
reduced trace lengths due to the
ŚŝŐŚůLJŝŶƚĞŐƌĂƚĞĚ͕ŝŵƉĞĚĂŶĐĞŵĂƚĐŚĞĚ
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗
W<'&ŽŽƚƉƌŝŶƚ͗
>ϵϯϲϰDϲϰ^'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϲϰDϲϰ^'ϮdžϭϱZϯͲϭϯϯϯ ϭϲŵŵdžϮϮŵŵ
>ϵϯϲϰDϲϰ^'ϮdžϭϴϳZϯͲϭϬϲϲ
ϴ
/ͬK͗
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
Ϯϳϭ
'Ϯ
ϭ͘ϬϬŵŵ
DDR3
L9D3256M32DBG2, L9D3512M32DBG2
4GByte, x 64 BGA DDR3 SDRAM
Zϯ͕ϭϲ͘ϬͲϯϮ͘Ϭ'ďŝDK
256 -512 M, x 32, Dual Channel Or x 64 Single Channel, 16mm x 22mm, 271 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϱsцϬ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
Ϯŵŵ͕ϮϳϭďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
ƐƉĂĐĞƐĂǀŝŶŐĨŽŽƚƉƌŝŶƚ
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
ƐƚƌŽďĞ
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
ƐƚƌŽďĞ͕ĂŶĚŵĂƐŬƐŝŐŶĂůƐ
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭ͕ĂŶĚϭϯ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕
ϳ͕ϴ͕ϵ͕ĂŶĚϭϭ
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ĞŶĞĮƚƐ͗
‡
‡
‡
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
;ĂŵďŝĞŶƚƚĞŵƉсdͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
‡
‡
‡
‡
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
! ŵŝůͲƚĞŵƉ͗ͲϱϱОƚŽнϭϮϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϲϲϳ͕
ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϯϯϯ͕ϭϲϬϬ͕
ĂŶĚϭϴϲϲDďƉƐ
ǁƌŝƚĞͲůĞǀĞůŝŶŐ
ŵƵůƟƉƵƌƉŽƐĞƌĞŐŝƐƚĞƌ
ŽƵƚƉƵƚĚƌŝǀĞƌĐĂůŝďƌĂƟŽŶ
‡
‡
ůĂƌŐĞďŽĂƌĚĂƌĞĂƐĂǀŝŶŐƐǁŝƚŚƐƵƌĨĂĐĞ
ŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ƐŝŐŶŝĮĐĂŶƚůLJƌĞĚƵĐĞĚŝŶƚĞƌĐŽŶŶĞĐƚ
ƌŽƵƟŶŐ
reduced trace lengths due to the
ŚŝŐŚůLJŝŶƚĞŐƌĂƚĞĚ͕ŝŵƉĞĚĂŶĐĞŵĂƚĐŚĞĚ
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϮϱϲDϯϮ'ϮdžϭϬϳZϯͲϭϴϲϲ >ϵϯϮϱϲDϯϮ'ϮdžϭϮϱZϯͲϭϲϬϬ >ϵϯϮϱϲDϯϮ'ϮdžϭϱZϯͲϭϯϯϯ ϭϲŵŵdžϮϮŵŵ Ϯϳϭ
>ϵϯϱϭϮDϯϮ'ϮdžϭϬϳZϯͲϭϴϲϲ
>ϵϯϱϭϮDϯϮ'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϱϭϮDϯϮ'ϮdžϭϱZϯͲϭϯϯϯ
ϵ
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
ϭ͘ϬϬŵŵ'Ϯ
DDR3
L9D3256M72SBG2, L9D3256M80SBG2
2.5GByte, x 80 DDR3 SDRAM BGA
Zϯ͕ϭϴ͘ϬͲϮϬ͘Ϭ'ďŝDK
256 M, x 72 [80], 16mm x 22mm, 271 PBGA
WĞƌĨŽƌŵĂŶĐĞ͗ϭϴϲϲ͕ϭϲϬϬ͕ϭϯϯϯDďƉƐKDDZ/>͕/Eh^dZ/>͕ydE͕ED/>ͲdDW
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
Zϯ/ŶƚĞŐƌĂƚĞĚDŽĚƵůĞ
΀ŝDK΁͗
! sDDсsDDQ = ϭ͘ϱsцϬ͘Ϭϳϱs
! ϭ͘ϱsĐĞŶƚĞƌͲƚĞƌŵŝŶĂƚĞĚ͕
ĚŝīĞƌĞŶƟĂů/ͬK
! WĂĐŬĂŐĞ͗ϭϲŵŵdžϮϮŵŵdž
Ϯŵŵ͕ϮϳϭďĂůůW'
! DĂƚƌŝdžďĂůůƉŝƚĐŚ͗ϭ͘ϬϬŵŵ
ƐƉĂĐĞƐĂǀŝŶŐĨŽŽƚƉƌŝŶƚ
ĚŝīĞƌĞŶƟĂůĐůŽĐŬŝŶƉƵƚƐ;<͕<ηͿ
ĚŝīĞƌĞŶƟĂů͕ďŝͲĚŝƌĞĐƟŽŶĂůĚĂƚĂ
ƐƚƌŽďĞ
ϴŶͲďŝƚƉƌĞĨĞƚĐŚĂƌĐŚŝƚĞĐƚƵƌĞ
ϴŝŶƚĞƌŶĂůďĂŶŬƐ;ƉĞƌǁŽƌĚ͕ϰ
ǁŽƌĚƐŝŶƚĞŐƌĂƚĞĚŝŶƉĂĐŬĂŐĞͿ
ŶŽŵŝŶĂůĂŶĚĚLJŶĂŵŝĐŽŶͲĚŝĞ
ƚĞƌŵŝŶĂƟŽŶ;KdͿĨŽƌĚĂƚĂ͕
ƐƚƌŽďĞ͕ĂŶĚŵĂƐŬƐŝŐŶĂůƐ
ƉƌŽŐƌĂŵŵĂďůĞ^;ZͿ
ůĂƚĞŶĐLJ;>Ϳ͗ϲ͕ϴ͕ϭϬ͕ϭϭ͕ĂŶĚϭϯ
ƉŽƐƚĞĚ^ĂĚĚŝƟǀĞůĂƚĞŶĐLJ;>Ϳ
^;tZ/dͿůĂƚĞŶĐLJ;t>Ϳ͗ϲ͕
ϳ͕ϴ͕ϵ͕ĂŶĚϭϭ
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
ĮdžĞĚďƵƌƐƚůĞŶŐƚŚ;>ͿŽĨϴĂŶĚ
ďƵƌƐƚĐŚŽƉ;ͿŽĨϰ
ƐĞůĞĐƚĂďůĞϰŽƌ>ϴKŶͲdŚĞͲ&ůLJ
;Kd&Ϳ
^>&ͬhdKZ&Z^,ŵŽĚĞƐ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞ
;ĂŵďŝĞŶƚƚĞŵƉсdͿ͗
! ĐŽŵŵĞƌĐŝĂů͗ϬОƚŽнϳϬОC
! industrial ͗ͲϰϬОƚŽнϴϱОC
‡
‡
‡
‡
ƐƵƉƉŽƌƟŶŐ^>&ΘhdK
Z&Z^,
! ĞdžƚĞŶĚĞĚ͗ͲϰϬОƚŽнϭϬϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
! ŵŝůͲƚĞŵƉ͗ͲϱϱОƚŽнϭϮϱОC
ŵĂŶƵĂůZ&Z^,ŽŶůLJ
‡
‡
‡
dĐŽĨϬОƚŽнϵϱОC
! ϲϰŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚĂƚ
ϬОƚŽнϴϱОC
! ϯϮŵƐ͕ϴϭϵϮĐLJĐůĞƌĞĨƌĞƐŚ
ĂďŽǀĞϴϱОC
KZĐůŽĐŬŝŶŐĨƌĞƋƵĞŶĐŝĞƐ͗ϲϲϳ͕
ϴϬϬ͕ϵϯϯD,nj
ĚĂƚĂƚƌĂŶƐĨĞƌƌĂƚĞƐ͗ϭϯϯϯ͕ϭϲϬϬ͕
ĂŶĚϭϴϲϲDďƉƐ
‡
ůĂƌŐĞďŽĂƌĚĂƌĞĂƐĂǀŝŶŐƐǁŝƚŚƐƵƌĨĂĐĞ
ŵŽƵŶƚĨƌŝĞŶĚůLJƉŝƚĐŚ;ϭ͘ϬϬŵŵͿ
ƐŝŐŶŝĮĐĂŶƚůLJƌĞĚƵĐĞĚŝŶƚĞƌĐŽŶŶĞĐƚ
ƌŽƵƟŶŐ
reduced trace lengths due to the
ŚŝŐŚůLJŝŶƚĞŐƌĂƚĞĚ͕ŝŵƉĞĚĂŶĐĞŵĂƚĐŚĞĚ
packaging
thermally enhanced packaging
ƚĞĐŚŶŽůŽŐLJĂůůŽǁƐŝůŝĐŽŶŝŶƚĞŐƌĂƟŽŶ
ǁŝƚŚŽƵƚƉĞƌĨŽƌŵĂŶĐĞĚĞŐƌĂĚĂƟŽŶĚƵĞ
ƚŽƉŽǁĞƌĚŝƐƐŝƉĂƟŽŶ;ŚĞĂƚͿ
ŚŝŐŚdŽƌŐĂŶŝĐůĂŵŝŶĂƚĞŝŶƚĞƌƉŽƐĞƌ
ĨŽƌŝŵƉƌŽǀĞĚŐůĂƐƐƐƚĂďŝůŝƚLJŽǀĞƌĂǁŝĚĞ
ŽƉĞƌĂƟŶŐƚĞŵƉĞƌĂƚƵƌĞ
ƐƵŝƚĂďŝůŝƚLJŽĨƵƐĞŝŶ,ŝŐŚZĞůŝĂďŝůŝƚLJ
ĂƉƉůŝĐĂƟŽŶƐƌĞƋƵŝƌŝŶŐDŝůͲdĞŵƉ͕ŶŽŶͲ
ŚĞƌŵĞƟĐĚĞǀŝĐĞŽƉĞƌĂƟŽŶ
WƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
WĂƌƚEƵŵďĞƌ͗
^ƉĞĞĚ'ƌĂĚĞ͗W<'&ŽŽƚƉƌŝŶƚ͗ /ͬK͗
>ϵϯϮϱϲDϳϮ^'ϮdžϭϬϳ ZϯͲϭϴϲϲ >ϵϯϮϱϲDϳϮ^'ϮdžϭϮϱZϯͲϭϲϬϬ >ϵϯϮϱϲDϳϮ^'ϮdžϭϱZϯͲϭϯϯϯ
ϭϲŵŵdžϮϮŵŵ Ϯϳϭ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϬϳZϯͲϭϴϲϲ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϮϱZϯͲϭϲϬϬ
>ϵϯϮϱϲDϴϬ^'ϮdžϭϱZϯͲϭϯϯϯ
ϭϬ
ĂůůWŝƚĐŚ͗
W<'EŽ͗͘
ϭ͘ϬϬŵŵ'Ϯ
SRAM
L7C108Y, L7C108D, L7C109Y, L7C109D, L7C109K, L7C109KA, L7C1049Y
1 Mb, 4Mb, x8, Asynchronous Random Access Memory
ϭDď^ZD͕ϰDď^ZD
128K x 8, 512K x 8 Asynchronous Random Access Memory
ĞŶƐŝƟĞƐ͗ϭ͕ϰDď/Eh^dZ/>͕ydE͕D/>/dZzΘ>^^
‡
‡
‡
‡
‡
DK^džϴ^ƚĂƟĐZD
ƐŝŶŐůĞΘĚƵĂůĐŚŝƉĞŶĂďůĞ;Ϳ
(1M)
ƐĞƉĂƌĂƚĞtZ/dĂŶĚKhdWhd
ĞŶĂďůĞƐ
ŚŝŐŚƐƉĞĞĚ͕ϭϬŶƐƚŽнϭϮϱОC
ŽƉĞƌĂƟŶŐĐƵƌƌĞŶƚ͕Ͳ>ǀĞƌƐŝŽŶ͗
! ĂĐƟǀĞ͗ϴϬŵŵĂdž
! DK^ƐƚĂŶĚďLJ͗Ϯŵ
! ϮsĚĂƚĂƌĞƚĞŶƟŽŶ͗ϳϱϬʅ
;ϭDďͿ
! ϮsĚĂƚĂƌĞƚĞŶƟŽŶ͗Ϯŵ;ϰDďͿ
‡
‡
‡
ŚĞƌŵĞƟĐƉĂĐŬĂŐĞŽƉƟŽŶƐ͗
! ϯϮ>Ϭ͘ϰϬϬ͟^K:
! ϯϮ>Ϭ͘ϰϬϬ͟/W
! ϯϮ>YƵĂĚ>
! ϯϮ>ƵĂů>
! ϯϲ>Ϭ͘ϰϬϬ͟^K:
ϭDď
! ĐŽŶǀĞŶƟŽŶĂůƉŝŶŽƵƚ
ϰDď
! ƌĞǀŽůƵƟŽŶĂƌLJƉŝŶŽƵƚ
WĂĐŬĂŐĞƌŽƐƐZĞĨĞƌĞŶĐĞ͗
WĂĐŬĂŐĞ͗
>/WŬŐ͗^Ͳ^D͗ >/WĂƌƚEƵŵďĞƌ͗
ϯϮ>͕^K:
z
z͕ϳ
>ϳϭϬϴz͕>ϳϭϬϵzΎ
ϯϮ>͕/W 
>ϳϭϬϴ͕>ϳϭϬϵΎ
ϯϮ>͕YƵĂĚ>< D
>ϳϭϬϵ<Ύ
ϯϮ>͕ƵĂů>
< h
>ϳϭϬϵ<Ύ
ϯϲ>͕^K:
z
z͕ϳ
>ϳϭϬϰϵz
ΎƵĂůĐŚŝƉĞŶĂďůĞ͕ůŽǁƉŽǁĞƌŽīĞƌĞĚ;Ͳ>Ϳ
A0
1
36
NC
A1
2
35
A18
A2
3
34
A17
A3
4
33
A16
A4
5
32
A15
CE
6
I/O0
7
I/O1
8
VCC
9
VSS
10
I/O2
11
I/O3
12
WE
13
A5
14
A6
15
A7
L7C1049Y
&ĞĂƚƵƌĞƐΘĞŶĞĮƚƐ͗
31
OE
30
I/O7
29
I/O6
28
VSS
27
VCC
26
I/O5
25
I/O4
24
A14
23
A13
22
A12
16
21
A11
A8
17
20
A10
A9
18
19
NC
^DWƌŽĚƵĐƚKīĞƌŝŶŐƐ͗
SRAM ΂ϭϮϴ<džϴ^ƚĂƟĐZD͕ŽƌŶĞƌWŽǁĞƌ͕ǁŝƚŚ>ŽǁWŽǁĞƌŽƉƟŽŶ΃
^ŝŶŐůĞĂŶĚƵĂůŚŝƉŶĂďůĞĚ^K:ƐĂŶĚ/WƐ ƵĂůŚŝƉŶĂďůĞĚ^K:Ɛ͕/WƐ͕>Ɛ͕ĂŶĚƵĂů>Ɛ
^DĂƐĞ͗
^DĂƐĞ͗
ϱϵϲϮͲϴϵϱϵϴϬϵ ϱϵϲϮͲϴϵϱϵϴϮϵ ϱϵϲϮͲϴϵϱϵϴϭϳ ϱϵϲϮͲϴϵϱϵϴϭϬ ϱϵϲϮͲϴϵϱϵϴϯϵ ϱϵϲϮͲϴϵϱϵϴϭϴ ϱϵϲϮͲϴϵϱϵϴϭϭ ϱϵϲϮͲϴϵϱϵϴϰϰ ϱϵϲϮͲϴϵϱϵϴϭϵ ϱϵϲϮͲϴϵϱϵϴϭϮ ϱϵϲϮͲϴϵϱϵϴϯϰ ϱϵϲϮͲϴϵϱϵϴϮϬ ϱϵϲϮͲϴϵϱϵϴϰϬ ϱϵϲϮͲϴϵϱϵϴϯϱ ϱϵϲϮͲϴϵϱϵϴϮϭ ϱϵϲϮͲϴϵϱϵϴϰϴ ϱϵϲϮͲϴϵϱϵϴϯϲ ϱϵϲϮͲϴϵϱϵϴϯϰ ϱϵϲϮͲϴϵϱϵϴϮϲ ϱϵϲϮͲϴϵϱϵϴϯϳ ϱϵϲϮͲϴϵϱϵϴϯϱ ϱϵϲϮͲϴϵϱϵϴϮϳ ϱϵϲϮͲϴϵϱϵϴϯϴ ϱϵϲϮͲϴϵϱϵϴϯϲ ϱϵϲϮͲϴϵϱϵϴϮϴ ϱϵϲϮͲϴϵϱϵϴϰϭ ϱϵϲϮͲϴϵϱϵϴϯϳ &ŽƌĂĐŽŵƉƌĞŚĞŶƐŝǀĞ^ZD^DůŝƐƟŶŐ͕ƉůĞĂƐĞǀŝƐŝƚǁǁǁ͘ůŽŐŝĐĚĞǀŝĐĞƐ͘ĐŽŵͬƉƐͬ^ZDƐͬ
11
SSD
L8SCxxxxxxxx
^^Ž^d
Serial ATA Solid State Drive-on-Chip
ĞŶƐŝƟĞƐ͗Ϯϱ͕ϱϬ͕ϭϬϬ͕ϮϬϬ͕ĂŶĚϰϬϬ'
&ĞĂƚƵƌĞƐ͗
‡
‡
‡
‡
‡
‡
‡
ĞŶĞĮƚƐ͗
‡
‡
‡
‡
‡
‡
‡
‡
‡
‡
^dϲ'ďƉƐͬϯ'ďƉƐͬϭ͘ϱ'ďƉƐ
ǀĂŝůĂďůĞƚĞŵƉĞƌĂƚƵƌĞƌĂŶŐĞƐ͗
! KDDZ/>;ϬОƚŽнϳϬОC)
! /Eh^dZ/>;ͲϰϬОƚŽнϴϱОC)
ϯϱŵŵdžϯϱŵŵ'ĨŽŽƚƉƌŝŶƚ
ĞdžƚƌĞŵĞŽǀĞƌƉƌŽǀŝƐŝŽŶŝŶŐĨŽƌĞdžĐĞƉƟŽŶĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ
ĐŽŶĮŐƵƌĂďůĞĂƐƐŝŶŐůĞͲůĞǀĞůŇĂƐŚ;^>ͿĨŽƌŵĂdžŝƵŵƵŵ
ĞŶĚƵƌĂŶĐĞŽƌŵƵůƟͲůĞůǀĞůŇĂƐŚ;D>ͿĨŽƌĐŽƐƚĞīĞĐƟǀĞ
storage
ƵƉƚŽϳ͘ϯWĞƚĂďLJƚĞƚŽƚĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ;ďĂƐĞĚŽŶĚĞŶƐŝƚLJͿ
ĂĚǀĂŶĐĞĚǁĞĂƌͲůĞǀĞůŝŶŐĂůŐŽƌŝƚŚŵ
ŝŵĞŶƐŝŽŶƐ͗
ĞĸĐŝĞŶƚĞƌƌŽƌƌĞĐŽǀĞƌLJ;,Ϳ
ĞŶŚĂŶĐĞĚ^ĞĐƵƌŝƚLJƌĂƐĞhŶŝƚĐŽŵŵĂŶĚ;DŝůŝƚĂƌLJƌĂƐĞͿ
ŚĂƌĚǁĂƌĞďĂƐĞĚ^ĞĐƵƌŝƚLJƌĂƐĞdƌŝŐŐĞƌ
^ͲϮϱϲ͕^ͲϭϮϴ͕ĂŶĚd'KƉĂůĂƚĂŶĐƌLJƉƟŽŶ
EĂƟǀĞŽŵŵĂŶĚYƵĞƵŝŶŐƐƵƉƉŽƌƚ
^͘D͘͘Z͘dĐŽŵŵĂŶĚƚƌĂŶƐƉŽƌƚ;^dͿƚĞĐŚŶŽůŽŐLJ
ůŽǁͲƉŽǁĞƌƐƚĂŶĚďLJ͕ƐůĞĞƉΘŚŝďĞƌŶĂƟŽŶŶĞĞĚƐ
KƉƟŽŶĂůWŽǁĞƌdŚƌŽƩůŝŶŐ
Internal temperature sensor
ZŽ,^ŽŵƉůŝĂŶƚĂŶĚ,ĂůŽŐĞŶͲ&ƌĞĞ
WĞƌĨŽƌŵĂŶĐĞ;^ƵƐƚĂŝŶĞĚͿ͗
ĂĐĐĞƐƐƚLJƉĞ͗
ƐĞƋƵĞŶƟĂůZ
ƐĞƋƵĞŶƟĂůtZ/d
ĨŽŽƚƉƌŝŶƚ͗
DͬƐĞĐ΀ΛϭϮϴ<ďůŽĐŬƐ΁͗
ƵƉƚŽϱϬϬDͬƐ
ƵƉƚŽϱϬϬDͬƐ
DĂdžŝŵƵŵ/ŶƉƵƚͬKƵƚƉƵƚKƉĞƌĂƟŽŶƐ͗
ĂĐĐĞƐƐƚLJƉĞ͗
ϯϱŵŵ
>ϴ^dždždždždždždždž
ƌĂŶĚŽŵZ
ƌĂŶĚŽŵtZ/d
/KWƐ΀Λϰ<ďůŽĐŬƐ΁͗
ƵƉƚŽϲϬ<
ƵƉƚŽϲϬ<
ǀĂŝůĂďůĞĞŶƐŝƟĞƐ͗
ϯϱŵŵ
^>EE&>^,Ͳх
Ϯϱ'͕ϱϬ'͕ϭϬϬ'͕ϮϬϬ'
D>EE&>^,Ͳх
ϱϬ'͕ϭϬϬ'͕ϮϬϬ'͕ϰϬϬ'
ŚĞŝŐŚƚƉƌŽĮůĞ͗
tƌŝƚĞŶĚƵƌĂŶĐĞ͗
ϳŵŵ
/ŶĚƵƐƚƌLJ^ƚĂŶĚĂƌĚϭϬĨƵůůĚƌŝǀĞǁƌŝƚĞƐͬĚĂLJĨŽƌϱLJĞĂƌƐ
ϭϮ
hƉƚŽϳ͘ϯWĞƚĂďLJƚĞƐƚŽƚĂůǁƌŝƚĞĞŶĚƵƌĂŶĐĞ
Assembly Flows
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗WůĂƐƟĐWƌŽĚƵĐƚƐ
(C) Commerical
(I) Industrial
;ͿdžƚĞŶĚĞĚ
(M) Military
нϳϬОC
ͲϰϬО͕нϴϱОC
ͲϰϬО͕нϭϬϱОC
ͲϱϱО͕нϭϮϱОC
E͘͘
.
;ϭϬϬйͿϰϴŚƌƐ
;ϭϬϬйͿϰϴŚƌƐ
;ϭϬϬйͿϭϲϬŚƌƐ
dĞƐƚͲĮŶĂů
ƵƌŶͲŝŶ
W'WƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
Wafer/Die
Substrate
Cure
Electrical
Test
Substrate
Saw
Marking
Ball
Attach
Final
QA
Solder
Reflow
Bake & Pack
Die Bond
Die Stack
Plasma
Clean
Wire Bond
Clean
QA
Visual
Electrical
Test
Plasma
Clean
Burn-in
Encapsulation
ϭϯ
Ship
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
(I)
Industrial
(M)
Military
;^DͿ
D/>ͲWZ&Ͳϯϴϱϯϱ
ŝĞsŝƐƵĂů/ŶƐƉĞĐƟŽŶ
EŽ
zĞƐ
zĞƐ
Temp Cycle
zĞƐ
zĞƐ
zĞƐ
ĞŶƚƌŝĨƵŐĞ
zĞƐ
zĞƐ
zĞƐ
zĞƐ
zĞƐ
ϰϴŚƌƐ
ϭϲϬŚƌƐ
ϭϲϬŚƌƐ
ͲϰϬО͕нϴϱОC
ͲϱϱО͕нϭϮϱОC
ͲϱϱО͕нϭϮϱОC
W
EŽ
zĞƐ
zĞƐ
&ŝŶĞ>ĞĂŬ
EŽ
zĞƐ
zĞƐ
Gross Leak
ƵďďůĞdĞƐƚKŶůLJ
zĞƐ
zĞƐ
WƌĞͲďƵƌŶͲŝŶƚĞƐƚΛнϮϱОC
ƵƌŶͲŝŶ
dĞƐƚͲĮŶĂů
D/>ͲWZ&ͲϯϴϱϯϱŽŵƉůŝĂŶƚWƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
<ŝƫŶŐ
,ĞƌŵĞƟĐ^ĞĂů
&ŝŶĞ>ĞĂŬ
<ŝƚ/ŶƐƉĞĐƟŽŶ
DĂƌŬ
'ƌŽƐƐ>ĞĂŬ
ŝĞƩĂĐŚ
džƉŽdžLJͬ^ŝůǀĞƌ'ůĂƐƐ
dĞŵƉĞƌĂƚƵƌĞLJĐůĞ
&ŝŶĂůY͘͘
Cure
ŽŶƐƚĂŶƚĐĐĞůĞƌĂƟŽŶ
Y͘͘ĂƚĂZĞǀŝĞǁΘ
>ŽƚĐĐĞƉƚĂŶĐĞ
tŝƌĞŽŶĚYƵĂůͬĞƐƚƌƵĐƚ
tŝƌĞWƵůů
>ĞĂĚdƌŝŵ;/ĨƉƉůŝĐĂďůĞͿ
tŝƌĞŽŶĚ
WƌĞͲďƵƌŶͲŝŶůĞĐƚƌŝĐĂů
tŝƌĞŽŶĚ
EŽŶͲĞƐƚƌƵĐƚWƵůů
ƵƌŶͲŝŶ
WƌĞͲĐĂƉsŝƐƵĂů/ŶƐƉĞĐƟŽŶ
WŽƐƚͲďƵƌŶͲŝŶůĞĐƚƌŝĐĂů
Y͘͘sŝƐƵĂů;WƌĞͲĐĂƉͿ
WsĞƌŝĮĐĂƟŽŶ
ƵƐƚŽŵĞƌ^ŽƵƌĐĞ
/ŶƐƉĞĐƟŽŶ;/ĨƉƉůŝĐĂďůĞͿ
/ŶͲůŝŶĞ'ƌŽƵƉ
Y͘͘sĞƌŝĮĐĂƟŽŶ
ϭϰ
WĂĐŬĂŶĚ^ŚŝƉ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗^^WƌŽĚƵĐƚƐ
(C) Commerical
(I) Industrial
нϳϬОC
ͲϰϬО͕нϴϱОC
ƵƌŶͲŝŶ
E͘͘
;ϭϬϬйͿϰϴŚƌƐ
Temp Cycle
E͘͘
.
ϱϬĐLJĐůĞƐ
dĞƐƚͲĮŶĂů
>ϴ^dždždždždždždždž
^^WƌŽĚƵĐƚƐDĂŶƵĨĂĐƚƵƌŝŶŐ&ůŽǁ
BOM
Burn In
Individual Module Assembly
- Memory
- Controller
Thermal
dĞƐƟŶŐ
Module
/ŶƚĞŐƌĂƟŽŶ
YdĞƐƟŶŐ
Secure
Erase
DC Level
dĞƐƟŶŐ
Firmware
Download
Final QA
&ƵŶĐƟŽŶĂů
dĞƐƟŶŐ
Pack/Ship
ϭϱ
YƵĂůŝĮĐĂƟŽŶĂƚĂ͗
/ŶƚĞŐƌĂƚĞĚDĞŵŽƌLJDŽĚƵůĞYƵĂůŝĮĐĂƟŽŶĂƚĂ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
D/>Ͳ^dͲϴϴϯŽƌ:
dLJƉĞŽĨdĞƐƚ
WƌĞĐŽŶĚŝƟŽŶŝŶŐ
>ŝĨĞdĞƐƚ
:^ϮϮͲϭϬϴ
Temperature Cycling
:^ϮϮͲϭϬϰ
,^d
:^Ͳϭϭϴ
^:^ϮϮͲϭϭϴ
D/>Ͳ^dϯϬϭϱ͘ϳ
DĞƚŚŽĚͬŽŶĚŝƟŽŶ
^ĂŵƉůĞ^ŝnjĞ
:^ϮϮͲϭϬ
ϭ͘ϮdžsĐĐ
ϭϮϱΣ
ϭϬϬϬĐLJĐ
ͲϱϱΣƚŽнϭϮϱΣ
ϭϯϬΣ
ϴϱйZ,
ϭϬϬƉĨ͕ϭϱϬϬё
ϮϬ
ϮϱƵŶŝƚƐ
ϯůŽƚƐ
ϮϱƵŶŝƚƐ
ϯůŽƚƐ
ϮϱƵŶŝƚƐ
ϯůŽƚƐ
ϯƵŶŝƚƐ
ƵƌĂƟŽŶ
&ĂŝůͬhŶŝƚƐ
Eͬ
ϭϬϬϬŚƌƐ
ϬͬϮϬ
Ϭͬϳϱ
ϭϬϬϬĐLJĐ
Ϭͬϳϱ
ϵϲŚƌƐ
Ϭͬϳϱ
ϮϬϬϬs,D
Ϭͬϯ
^ZDYƵĂůŝĮĐĂƟŽŶĂƚĂ
^ƚĂŶĚĂƌĚDĂŶƵĨĂĐƚƵƌŝŶŐWƌŽĐĞƐƐ͗ĞƌĂŵŝĐWƌŽĚƵĐƚƐ
D/>Ͳ^dͲϴϴϯ
DĞƚŚŽĚͬŽŶĚŝƟŽŶ
^ĂŵƉůĞ^ŝnjĞ
&ĂŝůͬhŶŝƚƐ
ůĞĐƚƌŝĐĂůdĞƐƚͬ'ƌŽƵƉ
ϭϬϬй&ĂƵůƚ͕ΘĐŽǀĞƌĂŐĞĂƚϮϱΣ͕ϭϮϱΣ͕ͲϱϱΣĂƐƉĞƌ
ƉƉĞŶĚŝdž͕ƐĞĐƟŽŶϭϬŽĨ^DϱϵϲϮͲϴϵϱϵϴ
ϭϭϲ
Ϭͬϭϭϲ
ZĞƐŝƐƚĂŶĐĞƚŽ^ŽůǀĞŶƚƐ
D/>Ͳ^dͲϴϴϯdDϮϬϭϱ
ϯ
Ϭͬϯ
D/>Ͳ^dͲϴϴϯdDϮϬϬϯ͕ƐŽůĚĞƌŝŶŐƚĞŵƉĞƌĂƚƵƌĞŽĨϮϰϱΣ
ϮϮ
ϬͬϮϮůĚ;ϯĚĞǀͿ
D/>Ͳ^dͲϴϴϯdDϮϬϭϭ͕ĐŽŶĚŝƟŽŶŽƌ
ϭϱ
ϬͬϭϱďĚƐ;ϰĚĞǀͿ
D/>Ͳ^dͲϴϴϯdDϮϬϭϲ
ϭϱ
Ϭͬϭϱ
Lead Integrity
D/>Ͳ^dͲϴϴϯdDϮϬϬϰ͕ĐŽŶĚŝƟŽŶϮ>ĞĂĚ&ĂƟŐƵĞ
ϯ
Ϭͬϯ
dŚĞƌŵĂů^ŚŽĐŬ
D/>Ͳ^dͲϴϴϯdDϭϬϭϭ͕ĐŽŶĚŝƟŽŶϭϮϱΣƚŽͲϱϱΣ͕ϭϱĐLJĐůĞƐ
ϭϱ
Ϭͬϭϱ
Temperature Cycle
D/>Ͳ^dͲϴϴϯdDϭϬϭϬ͕ĐŽŶĚŝƟŽŶϭϱϬΣƚŽͲϲϱΣ͕ϭϬϬĐLJĐůĞƐ
ϭϱ
Ϭͬϭϱ
DŽŝƐƚƵƌĞZĞƐŝƐƚĂŶĐĞ
D/>Ͳ^dͲϴϴϯdDϭϬϬϰ͘ϳ
ϭϱ
Ϭͬϭϱ
&ŝŶĞ>ĞĂŬ
D/>Ͳ^dͲϴϴϯdDϭϬϭϰ
ϭϱ
Ϭͬϭϱ
Gross Leak
D/>Ͳ^dͲϴϴϯdDϭϬϭϰ
ϭϱ
Ϭͬϭϱ
ϮϱΣ&Ƶůů^ƵďŐƌŽƵƉƐ
ϭϱ
Ϭͬϭϱ
DĞĐŚĂŶŝĐĂů^ŚŽĐŬ
D/>Ͳ^dͲϴϴϯdDϮϬϬϮ͕ĐŽŶĚŝƟŽŶϭϱϬϬŐ
ϭϱ
Ϭͬϭϱ
^ĂůƚƚŵŽƐƉŚĞƌĞ
D/>Ͳ^dͲϴϴϯdDϭϬϬϵ͕ĐŽŶĚŝƟŽŶϮϰŚƌƐ
ϭϱ
Ϭͬϭϱ
D/>Ͳ^dͲϴϴϯdDϭϬϭϴ͕ϱϬϬϬƉƉŵǀ
ϯ
Ϭͬϯ
D/>Ͳ^dͲϴϴϯdDϮϬϮϱ
ϯ
Ϭͬϯ
dLJƉĞŽĨdĞƐƚ
^ŽůĚĞƌĂďŝůŝƚLJ
ŽŶĚ^ƚƌĞŶŐƚŚ
WŚLJƐŝĐĂůŝŵĞŶƐŝŽŶ
ůĞĐƚƌŝĐĂůŶĚƉŽŝŶƚdĞƐƚƐ
/ŶƚĞƌŶĂů'ĂƐŶĂůLJƐŝƐ
ĚŚĞƐŝŽŶŽĨ>ĞĂĚ&ŝŶŝƐŚ
&ŽƌƚŚĞůĂƚĞƐƚƌĞƐƵůƚƐŽĨŽŶͲŐŽŝŶŐŝŶůŝŶĞƉƌŽĐĞƐƐƋƵĂůŝĮĐĂƟŽŶĚĂƚĂ͕
ƉůĞĂƐĞǀŝƐŝƚŽƵƌǁĞďƐŝƚĞǁǁǁ͘ůŽŐŝĐĚĞǀŝĐĞƐ͘ĐŽŵ.
ϭϲ
solutions powered by
0 010
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