Infineon Chip Card and Security ICs Portfolio

Infineon Chip Card and Security ICs Portfolio
Proven security you can trust
[ www.infineon.com/security ]
Contactless memories
my-d TM light
my-dTM vicinity plain
Product name
SRF 55V01P
SRF 55V02P
SRF 55V02P HC
SRF 55V10P
SRF 55V10P HC
Product description
Plain memory,
576-bit EEPROM
Plain memory,
2.5kbit EEPROM
Plain memory,
2.5kbit EEPROM
Plain memory,
10kbit EEPROM
Plain memory,
10kbit EEPROM
Interface
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
Memory organization
1 fixed sector
1 fixed sector
1 fixed sector
1 fixed sector
1 fixed sector
Counter
–
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
Operating frequency
13.56MHz
13.56MHz
13.56MHz
13.56MHz
13.56MHz
EEPROM – user
52Byte
224Byte
224Byte
992Byte
992Byte
EEPROM –
administration
20Byte
64Byte
64Byte
256Byte
256Byte
Security features
Unique serial
number, individual
page locking
Unique serial
number, individual
page locking
Unique serial
number, individual
page locking
Unique serial
number, individual
page locking
Unique serial
number, individual
page locking
Distance (read/write)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Data rate
26.48kbit/s
26.48kbit/s
26.48kbit/s
26.48kbit/s
26.48kbit/s
Anti-collision
Yes
Yes
Yes
Yes
Yes
Ambient temperature
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
Read/write cycles
100,000
100,000
100,000
100,000
100,000
Retention time,
minimum
10 years
10 years
10 years
10 years
10 years
Delivery forms
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Tools
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Typical applications
Libraries, Supply
Chain Management
Libraries, Inventory
Control
Laundry, CD Inlays
Libraries, Inventory
Control
Factory Automation,
Inventory Control
1) Depending on reader system and tag antenna configuration
2) NFC compatible. This product is compliant with ISO/IEC and ECMA standards as stated in the respective product specifications,
allowing for building NFC devices as defined by the NFC Forum.
PJM StackTag® and PJM ItemTag® are registered trademarks of Magellan Technology Pty Ltd. Corp.
2
my-dTM vicinity secure
PJM ItemTag ® and PJM StackTag ®
SRF 55V02S
SRF 55V02S HC
SRF 55V10S
SRF 55V10S HC
SRF 66V10 IT
SRF 66V10 ST
Security memory
with authentication,
2.5kbit EEPROM
Security memory
with authentication,
2.5kbit EEPROM
Security memory
with authentication,
10kbit EEPROM
Security memory
with authentication,
10kbit EEPROM
Plain memory,
10kbit EEPROM
Plain memory,
zero separation
stackability,
10kbit EEPROM
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 1
ISO/IEC 18000-3
mode 2
ISO/IEC 18000-3
mode 2
Up to 15 sectors
fully configurable
(14 secure, 1 plain)
Up to 15 sectors
fully configurable
(14 secure, 1 plain)
Up to 15 sectors
fully configurable
(14 secure, 1 plain)
Up to 15 sectors
fully configurable
(14 secure, 1 plain)
1 fixed sector
1 fixed sector
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
Up to 65,536 units,
support of antitearing
–
–
13.56MHz
13.56MHz
13.56MHz
13.56MHz
13.56MHz
13.56MHz
224Byte
224Byte
992Byte
992Byte
1,016Byte
1,016Byte
64Byte
64Byte
256Byte
256Byte
14Byte
14Byte
Transport key,
unique serial
number, mutual
authentication with
64-bit keys,
hierarchical key
management
Transport key,
unique serial
number, mutual
authentication
with 64-bit keys,
hierarchical key
management
Transport key,
unique serial
number, mutual
authentication with
64-bit keys,
hierarchical key
management
Transport key,
unique serial
number, mutual
authentication
with 64-bit keys,
hierarchical key
management
Unique serial
number, lock
pointer, 48-bit write
password
Unique serial
number, lock
pointer, 48-bit write
password
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1.5m 1)
Typically up to
1m 1)
Typically up to
1m 1)
26.48kbit/s
26.48kbit/s
26.48kbit/s
26.48kbit/s
423.75kbit/s to
card, 105.94kbit/s
to reader @
8 channels
423.75kbit/s to
card, 105.94kbit/s
to reader @
8 channels
Yes
Yes
Yes
Yes
Yes
Yes
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
100,000
100,000
100,000
100,000
100,000
100,000
10 years
10 years
10 years
10 years
10 years
10 years
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump,
module MCC2,
MCC8
Wafer, NiAu-bump
Wafer, NiAu-bump
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit
my-dTM
Evaluation Kit PJM
Evaluation Kit PJM
Ticketing, Brand
Protection
Ticketing, Brand
Protection
Ticketing, Brand
Protection
Ticketing, Brand
Protection
Factory Automation,
Production Control
Pharmaceuticals,
Document Logistics
3
Contactless memories
PJM Light
my-dTM NFC
Product name
SRF 66V01 ST
SLE 66R04P
SLE 66R16P
SLE 66R32P
Product description
Plain memory, zero
separation stackability,
1kbit EEPROM
Plain memory,
770Byte EEPROM
Plain memory,
2,560Byte EEPROM
Plain memory,
5,120Byte EEPROM
Interface
ISO/IEC 18000-3 mode 2
ISO/IEC 14443-3 type A
ISO/IEC 14443-3 type A
NFC Forum type 2 tag
operation
ISO/IEC 14443-3 type A
NFC Forum type 2 tag
operation
Memory organization
1 fixed sector
1 fixed sector
1 fixed sector
TT2 sector
(up to 1Kbyte)
1 fixed sector
TT2 sector
(up to 2Kbyte)
Counter
–
Up to 65,536 units,
support of anti-tearing
Up to 65,536 units,
support of anti-tearing
Up to 65,536 units,
support of anti-tearing
Operating frequency
13.56MHz
13.56MHz
13.56MHz
13.56MHz
EEPROM – user
114Byte
592Byte
2,024Byte
4,072Byte
EEPROM –
administration
14Byte
178Byte
536Byte
1,048Byte
Security features
Unique serial number,
lock pointer, individual
locking 48-bit write
password, cover coding
Unique serial number,
individual page locking
Unique serial number,
individual page locking
Unique serial number,
individual page locking
Distance (read/write)
Typically up to 0.5m
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
Data rate
423.75kbit/s to card,
105.94kbit/s to reader @
8 channels, or
423.75kbit/s to reader @
1 channel
105.94kbit/s to card
up to 848kbit/s to reader
105.94kbit/s to card
up to 848kbit/s to reader
105.94kbit/s to card
up to 848kbit/s to reader
Anti-collision
Yes
Yes
Yes
Yes
Ambient temperature
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
Read/write cycles
100,000
100,000
100,000
100,000
Retention time,
minimum
10 years
10 years
10 years
10 years
Delivery forms
Wafer, NiAu-bump
Wafer, NiAu-bump,
module MCC8, MCC2
Wafer, NiAu-bump,
module MCC8, MCC2
Wafer, NiAu-bump,
module MCC8, MCC2
Tools
Evaluation Kit PJM
Evaluation Kit my-d
Evaluation Kit my-d
Evaluation Kit my-dTM
Typical applications
Document Logistics,
Healthcare Mangament
“Smart” Posters,
Consumer Goods
Information
“Smart” Posters,
Consumer Goods
Information
“Smart” Posters,
Consumer Goods
Information
1)
TM
TM
1) Depending on reader system and tag antenna configuration
2) NFC compatible. This product is compliant with ISO/IEC and ECMA standards as stated in the respective product specifications,
allowing for building NFC devices as defined by the NFC Forum.
Mifare™ is a trademark of NXP B.V.
4
my-dTM proximity 2 2)
my-dTM move
SLE 66R35
SLE 66R04S
SLE 66R16S
SLE 66R32S
SLE 66R01P
SLE 66R35
Security memory with
authentication,
770Byte EEPROM
Security memory with
authentication,
2,560Byte EEPROM
Security memory with
authentication,
5,120Byte EEPROM
Intelligent 1,216-bit
EEPROM
Intelligent 1kByte
EEPROM using Mifare™
technology
ISO/IEC 14443-3 type A
ISO/IEC 14443-3 type A
ISO/IEC 14443-3 type A
ISO/IEC 14443-3 type A
NFC Forum type 2 tag
operation
ISO/IEC 14443-3 type A
Up to 15 sectors fully
configurable
(14 secure, 1 plain)
Up to 15 sectors fully
configurable
(14 secure, 1 plain)
Up to 15 sectors fully
configurable
(14 secure, 1 plain)
1 fixed sector
16 fixed sectors
Up to 65,536 units,
support of anti-tearing
Up to 65,536 units,
support of anti-tearing
Up to 65,536 units,
support of anti-tearing
16-bit counter with antitearing support
–
13.56MHz
13.56MHz
13.56MHz
13.56MHz
13.56MHz
576Byte
2,008Byte
4,056Byte
128Byte
768Byte
194Byte
552Byte
1,064Byte
24Byte
256Byte
Transport key, unique
serial number, mutual
authentication with 64bit keys, hierarchical
key management
Transport key, unique
serial number, mutual
authentication with 64bit keys, hierarchical
key management
Transport key, unique
serial number, mutual
authentication with
64-bit keys, hierarchical
key management
Unique serial number,
individual page locking,
block locking, 32-bit
password protection
for read and/or write
access, password retry
counter
Transport code,
unique serial number,
mutual three pass
authentication with
48-bit keys
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
Typically up to 10cm and
above 1)
105.94kbit/s to card
up to 848kbit/s to reader
105.94kbit/s to card
up to848kbit/s to reader
105.94kbit/s to card
up to 848kbit/s to reader
105.94kbit/s to card
106kbit/s
Yes
Yes
Yes
Yes
Yes
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
100,000
100,000
100,000
10,000
100,000
10 years
10 years
10 years
5 years
10 years
Wafer, NiAu-bump,
module MCC8, MCC2
Wafer, NiAu-bump,
module MCC8, MCC2
Wafer, NiAu-bump,
module MCC8, MCC2
Wafer, NiAu-bump
Evaluation Kit my-d
Evaluation Kit my-d
Evaluation Kit my-d
Evaluation Kit my-d
Evaluation Kit
proximity light
Transport,
Event Ticketing
Transport,
Event Ticketing
Transport,
Event Ticketing
Transport,
Event Ticketing
Transport,
Access Control
TM
TM
TM
Wafer, NiAu-bump,
module MCC8, MCC2
TM
5
Dual-interface/contactless Controller
SLE 66CLxxxPE
Product name
SLE 66CL41PE 1)
SLE 66CL80PE (M/S) 1)
SLE 66CL81PE (M) 1)
Product description
Pure contactless security
controller
Dual-interface security
controller
Pure contactless security
controller
RF Interface
ISO/IEC 14443 type B & A
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
Mifare™ compatible interface
Baud rate (kbit/s)
Up to 848kbit/s
Up to 848kbit/s
Up to 848kbit/s
User-ROM
92kByte
92kByte (88kByte) 2)
92kByte (88kByte) 2)
EEPROM
4kByte
8kByte (+ 1kByte for M) 2)
8kByte (+ 1kByte for M) 2)
RAM
2kByte XRAM, 256Byte IRAM
2kByte XRAM, 256Byte IRAM
2kByte XRAM, 256Byte IRAM
CPU
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
–
–
–
Clock (int.)
1–30MHz
1–30MHz
1–30MHz
Clock (ext.)
–
1–7.5MHz
–
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. sleep mode current (typ.)
100µA
100µA
100µA
Ambient temperature
-25 to +70°C
-25 to +70°C
-25 to +70°C
EEPROM Programming Time @
contactless operation
< 2.3ms (typ.)
< 2.3ms (typ.)
< 2.3ms (typ.)
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 64Byte
Security features
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Peripherals
CRC, PLL
CRC, PLL, UART DF 8
CRC, PLL
Delivery forms
Contactless module MCC8, die,
bumped wafer
Module M8.4, die, bumped
wafer
Contactless module MCC8, die,
bumped wafer
Typical applications
Payment, PayPass Magstripe,
VISA MSD, EMV SDA, ePurse,
Loyalty, Access Control,
Driver’s License, Transport
Payment, EMV SDA, ePurse,
Loyalty, Access Control,
Driver’s License, Transport
Payment, EMV SDA, ePurse,
Loyalty, Access Control,
Driver’s License, Transport
Tools
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
1) For sub ID1 dedicated products
2) If Mifare™ compatible interface is used
6
SLE 66CL180PE (M/S) 1)
SLE 66CLX126PE (M/S) 1)
SLE 66CLX206PE (M/S) 1)
SLE 66CLX360PE (M/S)
Dual-interface and contactless
security controller
Dual-interface and contactless
security cryptocontroller
Dual-interface and contactless
security cryptocontroller
Dual-interface and contactless
security cryptocontroller
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
iSO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
Up to 848kbit/s
Up to 848kbit/s
Up to 848kbit/s
Up to 848kbit/s
92kByte (88kByte) 2)
156kByte (152kByte) 2)
196kByte (192kByte) 2)
240kByte (236kByte) 2)
18kByte
(16kByte + 1kByte for M) 2)
12kByte
(12kByte + 1kByte for M) 2)
20kByte
(18kByte + 1kByte for M) 2)
36kByte
(36kByte + 1kByte for M) 2)
2kByte XRAM, 256Byte IRAM
4kByte XRAM, 700Byte Crypto,
256Byte IRAM
6kByte XRAM, 700Byte Crypto,
256Byte IRAM
6kByte XRAM, 700Byte Crypto,
256Byte IRAM
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
3DES
3DES
3DES
3DES
–
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
1–30MHz
1–30MHz
1–30MHz
1–30MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
100µA
100µA
100µA
100µA
-25 to +70°C
-25 to +70°C
-25 to +70°C
-25 to +70°C
< 2.3ms (typ.)
< 2.3ms (typ.)
< 2.3ms (typ.)
< 2.3ms (typ.)
1 to 64Byte
1 to 64Byte
1 to 64Byte
1 to 64Byte
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
CRC, PLL, UART DF 8
CRC, PLL, UART DF 8
CRC, PLL, UART DF 8
CRC, PLL, UART DF 8
Module M8.4, contactless
module MCC8, die, bumped
wafer
Module M8.4, contactless
module MCC8, die, bumped
wafer
Module M8.4, contactless
module MCC8, die, bumped
wafer
Module M8.4, contactless
module MCC8, die, bumped
wafer
Payment, EMV SDA, ePurse,
Loyalty, Access Control,
Driver’s License, Transport
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Digital Signature, Open
Platform, Transport
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Digital Signature,
Open Platform, Transport
Payment, EMV DDA, ePurse,
Loyalty, Access Control, Digital
Signature, ePassport, Open
Platform, Transport, Dual SIM
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
7
Dual-interface/contactless Controller
SLE 66CLxxxPE
Product name
SLE 66CLX800PE (M/S)
SLE 66CLX1280PE (M/S)
SLE 66CLX1440PE (M/S)
Product description
Dual-interface and contactless
security cryptocontroller
Dual-interface and contactless
security cryptocontroller
Dual-interface and contactless
security cryptocontroller
RF Interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
Baud rate (kbit/s)
Up to 848kbit/s
Up to 848kbit/s
Up to 848kbit/s
User-ROM
240kByte (236kByte) 2)
240kByte (236kByte) 2)
240kByte (236kByte) 2)
EEPROM
80kByte
(78kByte + 1kByte for M) 2)
128kByte
(128kByte + 1kByte for M) 2)
144kByte
(144kByte + 1kByte for M) 2)
RAM
6kByte XRAM, 700Byte Crypto,
256Byte IRAM
6kByte XRAM, 700Byte Crypto,
256Byte IRAM
6kByte XRAM, 700Byte Crypto,
256Byte IRAM
CPU
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–30MHz
1–30MHz
1–30MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. sleep mode current (typ.)
100µA
100µA
100µA
Ambient temperature
-25 to +70°C
-25 to +70°C
-25 to +70°C
EEPROM Programming Time @
contactless operation
< 2.3ms (typ.)
< 2.3ms (typ.)
< 2.3ms (typ.)
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 64Byte
Security features
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f,
Light, Temperature, Glitch, Chip
ID, True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f,
Light, Temperature, Glitch, Chip
ID, True RNG (AIS31, FIPS-140)
Peripherals
CRC, PLL, UART DF 8
CRC, PLL, UART DF 8
CRC, PLL, UART DF 8
Delivery forms
Module M8.4, contactless
module MCC8, die, bumped
wafer
Module M8.4, contactless
module MCC8, die, bumped
wafer
Module M8.4, contactless
module MCC8, die, bumped
wafer
Typical applications
Payment, EMV DDA, ePurse,
Loyalty, Access Control, Digital
Signature, ePassport, Open
Platform, Transport, Dual SIM
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Digital Signature, ePassport,
Open Platform, Dual SIM
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Digital Signature, ePassport,
Open Platform, Dual SIM
Tools
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
1) For sub ID1 dedicated products
2) If Mifare™ compatible interface is used
8
SLE 78CLXxxxP
SLE 78CLX360P1)
SLE 78CLX480P1)
SLE 78CLX800P1)
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
Up to 848kbit/s
Up to 848kbit/s
Up to 848kbit/s
224kByte
224kByte
288kByte
36kByte
48kByte
80kByte
8kByte
8kByte
8kByte
Dual 16-bit
Dual 16-bit
Dual 16-bit
3DES, AES up to 256-bit
3DES, AES up to 256-bit
3DES, AES up to 256-bit
RSA up to 4,096-bit, ECC up to 521-bit
RSA up to 4,096-bit, ECC up to 521-bit
RSA up to 4,096-bit, ECC up to 521-bit
1–33MHz
1–33MHz
1–33MHz
1–10MHz
1–10MHz
1–10MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
< 2.3ms
< 2.3ms
< 2.3ms
1 to 128Byte
1 to 128Byte
1 to 128Byte
Integrity Guard Security System: Digital Full
Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog
with Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog
with Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog
with Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
Module M8.4, contactless module MCC8, die,
bumped wafer
Module M8.4, contactless module MCC8, die,
bumped wafer
Module M8.4, contactless module MCC8, die,
bumped wafer
Payment, EMV DDA, ePurse, Loyalty, Access
Control, Digital Signature, ePassport, Open
Platform, Transport, Dual SIM
Payment, EMV DDA, ePurse, Loyalty, Access
Control, Digital Signature, ePassport, Open
Platform, Transport, Dual SIM
Payment, EMV DDA, ePurse, Loyalty, Access
Control, Digital Signature, ePassport, Open
Platform, Transport, Dual SIM
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
9
Dual-interface/contactless Controller
SLE 78CLXxxxP
Product name
SLE 78CLX802P1)
SLE 78CLX1280P1)
Product description
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
RF Interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
Baud rate (kbit/s)
Up to 848kbit/s
Up to 848kbit/s
User-ROM
224kByte
288kByte
EEPROM
80kByte
128kByte
RAM
8kByte
8kByte
CPU
Dual 16-bit
Dual 16-bit
Crypto coprocessor symmetrical
3DES, AES up to 256-bit
3DES, AES up to 256-bit
Crypto coprocessor asymmetrical
RSA up to 4,096-bit, ECC up to 521-bit
RSA up to 4,096-bit, ECC up to 521-bit
Clock (int.)
1–33MHz
1–33MHz
Clock (ext.)
1–10MHz
1–10MHz
Operating voltage
1.62–5.5V
1.62–5.5V
Max. sleep mode current (typ.)
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
EEPROM Programming Time @
contactless operation
< 2.3ms
< 2.3ms
EEPROM page programming
1 to 128Byte
1 to 128Byte
Security features
Integrity Guard Security System: Digital Full Error/
Fault/DFA Detection; Full CPU-, Memory-, Bus- and
Cache-Encryption; Dual encrypted-calculation CPU;
Active I²-Shield; MMU with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog with
Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System: Digital Full Error/
Fault/DFA Detection; Full CPU-, Memory-, Bus- and
Cache-Encryption; Dual encrypted-calculation CPU;
Active I²-Shield; MMU with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog with
Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Peripherals
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
Delivery forms
Module M8.4, contactless module MCC8, die, bumped
wafer
Module M8.4, contactless module MCC8, die,
bumped wafer
Typical applications
Payment, EMV DDA, ePurse, Loyalty, Access Control,
Digital Signature, ePassport, Open Platform,
Transport, Dual SIM
Payment, EMV DDA, ePurse, Loyalty, Access Control,
Digital Signature, ePassport, Open Platform,
Dual SIM
Tools
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
1) For sub ID1 dedicated products
10
Components for contactless terminals
EasySAM
SLE 78CLX1440P1)
Product name
SLF 9620
Dual-interface and contactless security
cryptocontroller designed for high-security
applications
Product description
Security access module for
MifareTM compatible interface,
my-dTM algorithm, 3DES and
AES128
Interface
ISO/IEC 7816 and fast
contactless interface
Memory organization
Enables security authentication
between the reader and my-dTM
chip cards or cards using
MifareTM technology, 3DES or
AES128 authentication schemes.
It features a dedicated key
management system including key
derivation and key upload.
Operating frequency
–
Security features
Mifare™ compatible encryption,
my-d™ encryption schemes,
3DES and AES128,
Asymmetric cryptographic
algorithms (e.g. RSA, ECC),
online and offline modes,
secure key loading
Data rate
115kbit/s
up to 848kbit/s in contactless
mode
Anti-collision
–
Ambient temperature
-25 to +75°C
Delivery forms
ID-000/ID1, M5.3
Typical applications
Security applications with
key-based authentication,
Transport, Access Control,
Electronic Ticketing
ISO/IEC 14443 type B & A
ISO/IEC 18092 passive mode
Mifare™ compatible interface
Up to 848kbit/s
288kByte
144kByte
8kByte
Dual 16-bit
3DES, AES up to 256-bit
RSA up to 4,096-bit, ECC up to 521-bit
1–33MHz
1–10MHz
1.62–5.5V
100µA
-25 to +85°C
< 2.3ms
1 to 128Byte
Integrity Guard Security System: Digital Full Error/
Fault/DFA Detection; Full CPU-, Memory-, Bus- and
Cache-Encryption; Dual encrypted-calculation CPU;
Active I²-Shield; MMU with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog with
Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
ICU/PEC, CRC, PLL, UART DF 8
Module M8.4, contactless module MCC8, die,
bumped wafer
Payment, EMV DDA, ePurse, Loyalty, Access Control,
Digital Signature, ePassport, Open Platform,
Dual SIM
EKP (Evaluation Kit Proximity)
ROK (Reader Optimization Kit)
CC EAL5+ high, EMVCo
11
Contact-based security memories
Classic
Eurochip 66
DataCarrier
Product name
SLE 4406SP
SLE 6636
SLE 5532
SLE 5542
Product description
Intelligent 128-bit
EEPROM counter with
security logic
Intelligent 237-bit
EEPROM counter with
security logic and highsecurity authentication
Intelligent 256Byte
EEPROM with Write
Protection Function
Intelligent 256Byte
EEPROM with Write
Protection Function and
Programmable Security
Code
Counter
> 20,000 count units
> 20,000 count units,
support of anti-tearing
–
–
ROM
24-bit
24-bit
–
–
PROM
72-bit
177-bit
32-bit
32-bit
EEPROM
32-bit
36-bit
256Byte
256Byte
Security features
Security logic, irrever­
sible chip coding,
transport code,
advanced CMOS
technology
Authentication for
basic security with 1 or
2 keys, optional cipher
block chaining, security
logic, irreversible chip
coding, transport code,
dedicated advanced
CMOS technology
EEPROM-cells protected
by shield, shielding of
deeper layers via metal,
sensory- and logical
security functions, Byte
protection, irreversible
chip coding, advanced
CMOS technology
EEPROM-cells protected
by shield, shielding
of deeper layers via
metal, sensory- and
logical security functions, Programmable
Security Code, Byte
protection, irreversible
chip coding, transport
code; advanced CMOS
technology
Min. write/erase time
3ms/3ms
3ms /3ms
2.5ms /2.5ms
2.5ms /2.5ms
Operating voltage
5V
5V
5V
5V
Max. supply current
1mA
1mA (typ. 400µA)
3mA
3mA
Ambient temperature
-40 to +80°C
-40 to +80°C
-40 to +80°C
-40 to +80°C
Read/write cycles
100,000
100,000
100,000
100,000
Retention time,
minimum
30 years
30 years
10 years
10 years
Delivery forms
Module M3, MFC 3.1
(FCOSTM), die
Module M3, MFC 3.1
(FCOSTM), die
Module M3, MFC 3.1
(FCOSTM), die
Module M3, MFC 3.1
(FCOSTM), die
Tools
EVA-kit
EVA-kit
EVA-kit
EVA-kit
Typical applications
Prepaid Phone Card,
Vending
Prepaid Phone Card,
Vending, Brand
Protection, Metering
Healthcare and Health
Insurance Card, Member
Card, Electronic
Ticketing, Loyalty Card,
Access Control
Healthcare and Health
Insurance Card, Member
Card, Electronic
Ticketing, Loyalty Card,
Access Control
12
SLE 5552
SLE 5518
SLE 5528
SLE 5538
Intelligent 256Byte EEPROM
with Write and Read-Out
Protection Function and
Programmable Security Code
Intelligent 1,024Byte EEPROM
with Write Protection Function
Intelligent 1,024Byte EEPROM
with Write Protection Function
and Programmable Security
Code
Intelligent 1,024Byte EEPROM
with Write and Read-Out
Protection Function and
Programmable Security Code
–
–
–
–
–
–
–
–
32-bit
1,024-bit
1,024-bit
1,024-bit
256Byte
1,024Byte
1,024Byte
1,024Byte
EEPROM-cells protected by
shield, shielding of deeper
layers via metal, sensoryand logical security functions,
Programmable Security Code,
Byte protection, irreversible
chip coding, transport code;
advanced CMOS technology
EEPROM-cells protected by
shield, shielding of deeper
layers via metal, sensoryand logical security functions,
Byte protection, irreversible
chip coding, advanced CMOS
technology
EEPROM-cells protected by
shield, shielding of deeper
layers via metal, sensoryand logical security functions,
Programmable Security Code,
Byte protection, irreversible
chip coding, transport code;
advanced CMOS technology
EEPROM-cells protected by
shield, shielding of deeper
layers via metal, sensoryand logical security functions,
Programmable Security Code,
Byte protection, irreversible
chip coding, transport code;
advanced CMOS technology
2.5ms /2.5ms
5ms/5ms
5ms /5ms
5 ms /5 ms
5V
5V
5V
5V
3mA
1mA
1mA
1mA
-40 to +80°C
-40 to +100°C
-40 to +100°C
-40 to +100°C
100,000
100,000
100,000
100,000
10 years
10 years
10 years
10 years
Module M3, MFC 3.1 (FCOS ),
die
Module M3, MFC 3.1 (FCOS ),
die
Module M3, MFC 3.1 (FCOS ),
die
Module M3, MFC 3.1 (FCOSTM),
die
EVA-kit
EVA-kit
EVA-kit
EVA-kit
Healthcare and Health
Insurance Card, Member Card,
Electronic Ticketing, Loyalty
Card, Access Control
Healthcare and Health
Insurance Card, Member Card,
Electronic Ticketing, Loyalty
Card, Access Control
Healthcare and Health
Insurance Card, Member Card,
Electronic Ticketing, Loyalty
Card, Access Control
Healthcare and Health
Insurance Card, Member Card,
Electronic Ticketing, Loyalty
Card, Access Control
TM
TM
TM
13
Security controller overview by EEPROM sizes
EEPROM
2KB
4KB
8KB
Product name
SLE 66C24PE
Secure µSlim EEPROM
SLE 66C44PE/
SLE 66C46PE
Secure µSlim EEPROM
SLE 66C84PE/
SLE 66C86PE
Secure µSlim EEPROM
Product description
Security controller
Security controller
Security controller
User-ROM
68kByte
68kByte
68kByte
EEPROM
2kByte
4kByte
8kByte
RAM
2kByte
2kByte
2kByte
CPU
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
–
–
–
Clock (int.)
1–33MHz
1–33MHz
1–33MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
2ms (typ.)
2ms (typ.)
2ms (typ.)
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 64Byte
Security features
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Peripherals
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
Delivery forms
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Typical applications
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
14
≥ 16KB
SLE 66CX80PE
Secure µSlim EEPROM
SLE 66C161PE
Secure µSlim EEPROM
SLE 66C166PE
Secure µSlim EEPROM
SLE 66C168PE
Secure µSlim EEPROM
Security controller
Security controller
Security controller
Security controller
96kByte
48kByte
96kByte
68kByte
8kByte
16kByte
16kByte
16kByte
4kByte + 700Byte Crypto
2kByte
2kByte
2kByte
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
3DES
3DES
3DES
3DES
RSA up to 2,048-bit,
ECC up to 521-bit
–
–
–
1–33MHz
1–33MHz
1–33MHz
1–33MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10mA
10mA
100µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
2ms (typ.)
2ms (typ.)
2ms (typ.)
2ms (typ.)
1 to 64Byte
1 to 64Byte
1 to 64Byte
1 to 64Byte
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M4.8, MFC5.x, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
GSM
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
CC EAL5+ high, EMVCo
–
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
15
Security controller overview by EEPROM sizes
EEPROM
≥ 16KB
Product name
SLE 66CX162PE
Secure µSlim EEPROM
SLE 66CX182PE
Secure µSlim EEPROM
SLE 66CX186PE
Secure µSlim EEPROM
Product description
Security cryptocontroller
Security cryptocontroller
Security cryptocontroller
User-ROM
96kByte
136kByte
150kByte
EEPROM
16kByte
18kByte
18kByte
RAM
4kByte + 700Byte Crypto
4kByte + 700Byte Crypto
4kByte + 700Byte Crypto
CPU
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–33MHz
1–33MHz
1–33MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
2ms (typ.)
2ms (typ.)
2ms (typ.)
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 64Byte
Security features
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Peripherals
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
Delivery forms
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Typical applications
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
16
≥ 32KB
SLE 66CX206PE
Secure µSlim EEPROM
SLE 50C363PE
Secure µSlim EEPROM
SLE 66C327PE
Secure µSlim EEPROM
SLE 66C360PE
Secure µSlim EEPROM
Security cryptocontroller
Security controller
Security controller
Security controller
196kByte
96kByte
136kByte
196kByte
20kByte
36kByte
32kByte
36kByte
6kByte + 700Byte Crypto
4kByte
4kByte
4kByte
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
3DES
–
3DES
3DES
RSA up to 2,048-bit,
ECC up to 521-bit
–
–
–
1–33MHz
1–33MHz
1–33MHz
1–33MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1.62–5.5V
1.62–5.5V
2.7–5.5V
1.62–5.5V
10mA
10mA
10mA
10mA
100µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
2ms (typ.)
2ms (typ.)
2ms (typ.)
2ms (typ.)
1 to 64Byte
1 to 64Byte
1 to 64Byte
1 to 64Byte
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Memory- and Bus-Encryption,
MMU, Basic Countermeasures
against DPA/SPA, Threshold
Sensors, Chip ID, RNG
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M4.8, MFC5.x, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
GSM
Payment, EMV SDA, Loyalty,
Access Control,
Health/Social Security
GSM, UICC
CC EAL5+ high, EMVCo
–
EMVCo
–
17
Security controller overview by EEPROM sizes
EEPROM
≥ 32KB
Product name
SLE 66C367PE
Secure µSlim EEPROM
SLE 66CX360PE/
SLE 66CX366PE
Secure µSlim EEPROM
SLE 66CX482PE
Secure µSlim EEPROM
Product description
Security controller
Security cryptocontroller
Security cryptocontroller
User-ROM
196kByte
196kByte
196kByte
EEPROM
36kByte
36kByte
48kByte
RAM
4kByte
6kByte + 700Byte Crypto
6kByte + 700Byte Crypto
CPU
8-bit/16-bit
8-bit/16-bit
8-bit/16-bit
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
–
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–33MHz
1–33MHz
1–33 MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5 MHz
Operating voltage
2.7–5.5V
1.62–5.5V
1.62–5.5 V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10 mA
Max. sleep mode current (typical)
100 µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
2ms (typ.)
2ms (typ.)
2ms (typ.)
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 64Byte
Security features
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Peripherals
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
Delivery forms
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Typical applications
Payment, EMV SDA, Loyalty,
Access Control, Health/Social
Security
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, Pay-TV
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature,ID-Card, Pay-TV
Certifications
EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
18
SLE 66CX480PE
Secure µSlim EEPROM
SLE 78CX360P
Secure µSlim
EEPROM
SLE 78CX480P
Secure µSlim
EEPROM
Security cryptocontroller
Security cryptocontroller designed for highsecurity applications
Security cryptocontroller designed for highsecurity applications
240kByte
224kByte
224kByte
48kByte
36kByte
48kByte
6kByte + 700Byte Crypto
8kByte + 844Byte Crypto
8kByte + 844Byte Crypto
8-bit/16-bit
Dual 16-bit
Dual 16-bit
3DES
3DES, AES up to 256-bit
3DES, AES up to 256-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 4,096-bit,
ECC up to 521-bit
RSA up to 4,096-bit,
ECC up to 521-bit
1–33MHz
1–33MHz
1–33MHz
1–7.5MHz
1–10MHz
1–10MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10mA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
2ms (typ.)
< 2.3ms
< 2.3ms
1 to 64Byte
1 to 128Byte
1 to 128Byte
EEPROM Error Detection, Memory-, Busand SFR-Encryption, Active Shield, MMU,
DPA/SPA, DEMA/SEMA Countermeasures,
Security Sensors: V, f, Light, Temperature,
Glitch, Chip ID, True RNG (AIS31, FIPS-140)
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog
with Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temperature; Intelligent Watchdog
with Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
CRC, PLL, UART DF 16
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
Module M5.1, MFC5.x, DSO-8, VQFN-8, die
Module M5.1, MFC5.x, DSO-8, VQFN-8, die
Module M5.1, MFC5.x, DSO-8, VQFN-8, die
Payment, EMV DDA, ePurse, Loyalty,
Access Control, Health/Social Security,
Digital Signature, ID-Card, Pay-TV
Payment, EMV DDA, ePurse, Loyalty, Access
Control, Health/Social Security, Digital
Signature, ID-Card
Payment, EMV DDA, ePurse, Loyalty, Access
Control, Health/Social Security, Digital
Signature, ID-Card
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
19
Security controller overview by EEPROM sizes
EEPROM
≥ 64KB
Product name
SLE 50C683PE
Secure µSlim EEPROM
SLE 66C682PE
Secure µSlim EEPROM
SLE 76CF2561P
Secure μSlim Flash/EEPROM
Product description
Security controller
Security controller
Security controller
User-ROM
136kByte
196kByte
–
EEPROM
68Byte
68kByte
256kByte
RAM
4kByte
4kByte
8kByte
CPU
8-bit/16-bit
8-bit/16-bit
16-bit
Crypto coprocessor symmetrical
–
3DES
3DES, AES up to 256-bit
Crypto coprocessor asymmetrical
–
–
–
Clock (int.)
1–33MHz
1–33MHz
1–33MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
3ms (typ.)
2ms (typ.)
< 2.3ms
EEPROM page programming
1 to 64Byte
1 to 64Byte
1 to 128Byte
Security features
Memory- and Bus-Encryption,
MMU, Basic Countermeasures
against DPA/SPA, Threshold
Sensors, Chip ID, RNG
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against DPA/
SPA and Fault Attacks, Threshold
Sensors, Intelligent Watchdog
with Program Flow Check, Chip
ID, Pseudo RNG
Peripherals
CRC, PLL, UART DF 16
CRC, PLL, UART DF 16
ICU/PEC, CRC, PLL, UART DF 8
Delivery forms
Module M4.8, MFC5.x, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M4.8, M5.1, MFC5.x, die
Typical applications
GSM
GSM, UICC
GSM, UICC
Certifications
–
–
–
20
SLE 76CF2562P
Secure µSlim Flash/EEPROM
SLE 76CF3201P
Secure μSlim Flash/EEPROM
SLE 76CF3601P
Secure μSlim Flash/EEPROM
SLE 66CX680PE
Secure µSlim EEPROM
Security controller
Security controller
Security controller
Security cryptocontroller
–
–
–
244kByte
256kByte
320kByte
360kByte
68kByte
8kByte
8kByte
8kByte
6kByte + 700Byte Crypto
16-bit
16-bit
16-bit
8-bit/16-bit
–
3DES, AES up to 256-bit
3DES, AES up to 256-bit
3DES
–
–
–
RSA up to 2,048-bit,
ECC up to 521-bit
1–33MHz
1–33MHz
1–33MHz
1–33MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1–7.5MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10mA
10mA
100µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
< 2.3ms
< 2.3ms
< 2.3ms
2ms (typ.)
1 to 128Byte
1 to 128Byte
1 to 128Byte
1 to 64Byte
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against DPA/
SPA and Fault Attacks, Threshold
Sensors, Intelligent Watchdog
with Program Flow Check, Chip
ID, Pseudo RNG
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/
SEMA Countermeasures,
Security Sensors: V, f, Light,
Temperature, Glitch, Chip ID,
True RNG (AIS31, FIPS-140)
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
CRC, PLL, UART DF 16
Module M4.8, M5.1, MFC5.x, die
Module M4.8, M5.1, MFC5.x,
die
Module M4.8, M5.1, MFC5.x,
die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
GSM, UICC
GSM, UICC
GSM, UICC
Payment, EMV DDA, ePurse,
Loyalty, Access Control, Health/
Social Security,
Digital Signature,ID-Card,
Pay-TV, GSM, UICC
–
–
–
CC EAL5+ high, EMVCo
21
Security controller overview by EEPROM sizes
EEPROM
≥ 64KB
Product name
SLE 78CX802P
Secure µSlim
EEPROM
SLE 78CX800P
Secure µSlim
EEPROM
SLE 88CFX2920P
Secure μSlim Flash/EEPROM
Product description
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
User-ROM
224kByte
288kByte
–
EEPROM
80kByte
80kByte
292kByte
RAM
8kByte + 844Byte Crypto
8kByte + 844Byte Crypto
16kByte + 880Byte Crypto
CPU
Dual 16-bit
Dual 16-bit
32-bit RISC
Crypto coprocessor symmetrical
3DES, AES up to 256-bit
3DES, AES up to 256-bit
3DES
Crypto coprocessor asymmetrical
RSA up to 4,096-bit,
ECC up to 521-bit
RSA up to 4,096-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–33MHz
1–33MHz
1–66MHz
Clock (ext.)
1–10MHz
1–10MHz
1–10MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
< 2.3ms
< 2.3ms
< 2.3ms
EEPROM page programming
1 to 128Byte
1 to 128Byte
1 to 128Byte
Security features
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temperature; Intelligent
Watchdog with Program Flow
Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temperature; Intelligent
Watchdog with Program Flow
Check; Chip ID; True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Peripherals
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Delivery forms
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Typical applications
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, GSM, UICC
GSM, UICC, Digital Signature
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high
22
≥ 128KB
SLE 88CFX2921P
Secure μSlim Flash/EEPROM
SLE 88CFX3520P
Secure μSlim Flash/EEPROM
SLE 88CFX3521P
Secure μSlim Flash/EEPROM
SLE 76CF4000P
Secure μSlim Flash/EEPROM
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
Security cryptocontroller
designed for high-security
applications
Security controller
–
–
–
–
292kByte
352kByte
352kByte
400kByte
16kByte + 880Byte Crypto
16kByte + 880Byte Crypto
16kByte + 880Byte Crypto
12kByte
32-bit RISC
32-bit RISC
32-bit RISC
16-bit
3DES
3DES
3DES
3DES, AES up to 256-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
–
1–66MHz
1–66MHz
1–66MHz
1–33MHz
1–10MHz
1–10MHz
1–10MHz
1–10MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10 mA
10mA
100 µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
< 2.3ms
< 2.3ms
< 2.3ms
< 2.3ms
1 to 128Byte
1 to 128Byte
1 to 128Byte
1 to 128Byte
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
ICU/PEC, CRC, PLL, UART DF 8
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M4.8, M5.1, MFC5.x,
die
High Secure Applications,
Pay-TV, Access Control, Digital
Signature
GSM, UICC, Digital Signature
High Secure Applications,
Pay-TV, Access Control, Digital
Signature
GSM, UICC
CC EAL5+ high
CC EAL5+ high
CC EAL5+ high
–
23
Security controller overview by EEPROM sizes
EEPROM
≥ 128KB
Product name
SLE 76CF4480P
Secure μSlim Flash/EEPROM
SLE 88CF4000P
Secure μSlim Flash/EEPROM
SLE 66CX1280PE
Secure µSlim EEPROM
Product description
Security controller
Security controller
Security cryptocontroller
User-ROM
–
–
240kByte
EEPROM
448kByte
400kByte
128kByte
RAM
12kByte
16kByte
6kByte + 700Byte Crypto
CPU
16-bit
32-bit RISC
8-bit/16-bit
Crypto coprocessor symmetrical
3DES, AES up to 256-bit
3DES
3DES
Crypto coprocessor asymmetrical
–
–
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–33MHz
1–66MHz
1–33MHz
Clock (ext.)
1–10MHz
1–10MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
< 2.3ms
< 2.3ms
2ms (typ.)
EEPROM page programming
1 to 128Byte
1 to 128Byte
1 to 64Byte
Security features
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/SEMA
Countermeasures, Security
Sensors: V, f, Light, Temperature,
Glitch, Chip ID, True RNG
(AIS31, FIPS-140)
Peripherals
ICU/PEC, CRC, PLL, UART DF 8
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
ICU/PEC, CRC, PLL, UART DF 8
Delivery forms
Module M4.8, M5.1,
MFC5.x, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Typical applications
GSM, UICC
GSM, UICC, R-UIM
Payment, EMV DDA, ePurse,
Loyalty, Access Control, Health/
Social Security, Digital Signature,
ID-Card, Pay-TV, GSM, UICC
Certifications
–
CC EAL5+ high
CC EAL5+ high, EMVCo
24
SLE 66CX1440PE
Secure µSlim EEPROM
SLE 78CX1280P
Secure µSlim
EEPROM
SLE 78CX1440P
Secure µSlim
EEPROM
SLE 88CFX4000P
Secure μSlim Flash/EEPROM
Security cryptocontroller
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
240kByte
288kByte
288kByte
–
144kByte
128kByte
144kByte
400kByte
6kByte + 700Byte Crypto
8kByte + 844Byte Crypto
8kByte + 844Byte Crypto
16kByte + 880Byte Crypto
8-bit/16-bit
Dual 16-bit
Dual 16-bit
32-bit RISC
3DES
3DES, AES up to 256-bit
3DES, AES up to 256-bit
3DES
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 4,096-bit,
ECC up to 521-bit
RSA up to 4,096-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
1–33MHz
1–33MHz
1–33MHz
1–66MHz
1–7.5MHz
1–10MHz
1–10MHz
1–10MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10mA
10mA
100µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
2ms (typ.)
< 2.3ms
< 2.3ms
< 2.3ms
1 to 64Byte
1 to 128Byte
1 to 128Byte
1 to 128Byte
EEPROM Error Detection,
Memory-, Bus- and SFREncryption, Active Shield,
MMU, DPA/SPA, DEMA/SEMA
Countermeasures, Security
Sensors: V, f, Light, Temperature,
Glitch, Chip ID, True RNG
(AIS31, FIPS-140)
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temperature; Intelligent
Watchdog with Program Flow
Check; Chip ID; True RNG
(AIS31, FIPS-140)
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temperature; Intelligent
Watchdog with Program Flow
Check; Chip ID; True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, DSO-8,
VQFN-8, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Payment, EMV DDA, ePurse,
Loyalty, Access Control, Health/
Social Security, Digital Signature,
ID-Card, Pay-TV, GSM, UICC
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, GSM, UICC
Payment, EMV DDA, ePurse,
Loyalty, Access Control,
Health/Social Security, Digital
Signature, ID-Card, GSM, UICC
GSM, UICC, Digital Signature
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high
25
Security controller overview by EEPROM sizes
EEPROM
≥ 128KB
≥ 256KB
Product name
SLE 88CFX4001P
Secure μSlim Flash/EEPROM
SLE 76CF5120P
Secure μSlim Flash/EEPROM
SLE 88CF4002P
Secure μSlim Flash/EEPROM
Product description
Security cryptocontroller
designed for high-security
applications
Security controller
Security controller
User-ROM
–
–
160kByte
EEPROM
400kByte
504kByte
400kByte
RAM
16kByte + 880Byte Crypto
12kByte
16kByte
CPU
32-bit RISC
16-bit
32-bit RISC
Crypto coprocessor symmetrical
3DES
3DES, AES up to 256-bit
3DES
Crypto coprocessor asymmetrical
RSA up to 2,048-bit,
ECC up to 521-bit
–
–
Clock (int.)
1–66MHz
1–33MHz
1–66MHz
Clock (ext.)
1–10MHz
1–10MHz
1–10MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
< 2.3ms
< 2.3ms
< 2.3ms
EEPROM page programming
1 to 128Byte
1 to 128Byte
1 to 128Byte
Security features
Memory and CPU Error
Detection, Memory-,
Bus- and SFR-Encryption,
MMU with Level Concept,
DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True
RNG (AIS31, FIPS-140)
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch, Active
Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Peripherals
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
ICU/PEC, CRC, PLL, UART DF 8
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Delivery forms
Module M5.1, MFC5.x, VQFN10, SSOP-20, DSO-20, die
Module M4.8, M5.1, MFC5.x,
VQFN-8, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Typical applications
High Secure Applications,
Pay-TV, Access Control,
Digital Signature
GSM, UICC
GSM, UICC, R-UIM
Certifications
CC EAL5+ high
–
CC EAL5+ high
26
SLE 88CFX4002P
Secure μSlim Flash/EEPROM
SLE 88CFX4003P
Secure μSlim Flash/EEPROM
SLE 88CFX5400P
Secure μSlim Flash/EEPROM
SLE 88CNFX5400PM
Secure μSlim Flash/EEPROM
Security cryptocontroller
Security cryptocontroller
designed for high-security
applications
Security cryptocontroller
Security cryptocontroller
designed for SWP applications
160kByte
Up to 168kByte
–
–
400kByte
400kByte
540kByte
540kByte
16kByte + 880Byte Crypto
16kByte + 880Byte Crypto
32kByte + 880Byte Crypto
32kByte + 880Byte Crypto
32-bit RISC
32-bit RISC
32-bit RISC
32-bit RISC
3DES
3DES
3DES
3DES
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
1–66MHz
1–66MHz
1–33MHz
1–33MHz
1–10MHz
1–10MHz
1–10MHz
1–10MHz
1.62–5.5V
1.62–5.5V
1.62–5.5V
1.62–5.5V
10mA
10mA
10mA
10mA
100µA
100µA
100µA
100µA
-25 to +85°C
-25 to +85°C
-25 to +85°C
-25 to +85°C
< 2.3ms
< 2.3ms
< 2.3ms
< 2.3ms
1 to 128Byte
1 to 128Byte
1 to 128Byte
1 to 128Byte
Memory and CPU Error Detection,
Memory-, Bus- and SFREncryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch, Active
Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
UART DF 16, RNG, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
UART DF 16, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
UART DF 8, CRC, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
SWP, Mifare™ compatible
interface (multiple footprint),
CRC, UART DF8, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M5.1, MFC5.x, VQFN-10,
SSOP-20, DSO-20, die
Module M5.3, MFC5.3, die
Module M5.3, MFC5.3, die
GSM, UICC, Digital Signature
High Secure Applications, PayTV, Access Control,
Digital Signature
GSM, UICC, Digital Signature
Mobile NFC (Payment, Transport,
Loyalty, Access Control), GSM,
UICC, Digital Signature
CC EAL5+ high
CC EAL5+ high
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
27
Security controller overview by EEPROM sizes
EEPROM
≥ 256KB
Product name
SLE 88CFX6600P
Secure μSlim Flash/EEPROM
SLE 88CNFX6600PM
Secure μSlim Flash/EEPROM
SLE 88CFX6602P
Secure μSlim Flash/EEPROM
Product description
Security cryptocontroller
Security cryptocontroller
designed for SWP applications
Security cryptocontroller
User-ROM
–
–
Up to 160kByte
EEPROM
660kByte
660kByte
660kByte
RAM
32kByte + 880Byte Crypto
32kByte + 880Byte Crypto
32kByte + 880Byte Crypto
CPU
32-bit RISC
32-bit RISC
32-bit RISC
Crypto coprocessor symmetrical
3DES
3DES
3DES
Crypto coprocessor asymmetrical
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–33MHz
1–33MHz
1–33MHz
Clock (ext.)
1–10MHz
1–10MHz
1–10MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
(at 5MHz, 5V)
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-25 to +85°C
-25 to +85°C
-25 to +85°C
Write/erase time
< 2.3ms
< 2.3ms
< 2.3ms
EEPROM page programming
1 to 128Byte
1 to 128Byte
1 to 128Byte
Security features
Memory and CPU Error
Detection, Memory-,
Bus- and SFR-Encryption,
MMU with Level Concept,
DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True
RNG (AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual
Rail Logic, Security Sensors: V,
f, Light, Temperature, Glitch,
Active Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch, Active
Shield, Chip ID, True RNG
(AIS31, FIPS-140)
Peripherals
UART DF8, CRC, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
SWP, Mifare™ compatible
interface (multiple footprint),
CRC, UART DF8, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
UART DF8, CRC, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Delivery forms
Module M5.3, MFC5.3, die
Module M5.3, MFC5.3, die
Module M5.3, MFC5.3, die
Typical applications
GSM, UICC, Digital Signature
Mobile NFC (Payment, Transport,
Loyalty, Access Control), GSM,
UICC, Digital Signature
GSM, UICC, Digital Signature
Certifications
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
CC EAL5+ high, EMVCo
28
≥ 384KB
SLE 88CNFX6602PM
Secure μSlim Flash/EEPROM
Security cryptocontroller
designed for SWP applications
Up to 160kByte
660kByte
32kByte + 880Byte Crypto
32-bit RISC
3DES
RSA up to 2,048-bit,
ECC up to 521-bit
1–33MHz
1–10MHz
1.62–5.5V
10mA
100µA
-25 to +85°C
< 2.3ms
1 to 128Byte
Memory and CPU Error
Detection, Memory-, Bus- and
SFR-Encryption, MMU with Level
Concept, DPA/SPA, DEMA/SEMA
Countermeasures incl. Dual Rail
Logic, Security Sensors: V, f,
Light, Temperature, Glitch, Active
Shield, Chip ID, True RNG
(AIS31, FIPS-140)
SWP, Mifare™ compatible
interface (multiple footprint),
CRC, UART DF8, 3 x 16-bit
autoreload timers, Interrupt,
Trap System, Intelligent Power
Manager for Classes A,B,C
Module M5.3, MFC5.3, die
Mobile NFC (Payment, Transport,
Loyalty, Access Control), GSM,
UICC, Digital Signature
CC EAL5+ high, EMVCo
29
Embedded Security Controller
Basic Authentication
Authentication
Product name
SLE 95050
ORIGATM
SLB 78CIX800P
Secure µSlim
EEPROM
SLB 78CIFX800P
Secure µSlim
Flash/EEPROM
Product description
Original Product Authentication
and Brand Protection Solution
Security cryptocontroller for
embedded applications
Security cryptocontroller for
embedded applications
User-ROM
Up to 192bit protected
288kByte
–
EEPROM
512bit unprotected
80kByte
80kByte
RAM
–
8kByte
8kByte
CPU
Statemachine
Dual 16-bit
Dual 16-bit
Crypto coprocessors
–
–
–
Symmetrical Cryptography
–
3DES, AES up to 256-bit
3DES, AES up to 256-bit
Asymmetrical Cryptography
–
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
Clock (int.)
1–16MHz
1–33MHz
1–33MHz
Clock (ext.)
1–4MHz
1–10MHz
1–10MHz
Operating voltage
2.0–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
0.8–1.3mA (at 2V)
10mA (at 5MHz, 5V)
10mA (at 5MHz, 5V)
Max. sleep mode current (typical)
M 1µA
100µA
100µA
Ambient temperature
-40 to +110°C
0 to +70°C
0 to +70°C
Write/erase time
4ms
< 2.3ms
< 2.3ms
EEPROM page programming
64-bit
1 to 128Byte
1 to 128Byte
MMU
–
Yes
Yes
Security features
Elliptic Curve Cryptography
(ECC); External temperature
sensing -25 to 85°C; Decreaseonly Counter/Lifespan indicator
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temp; Intelligent Watchdog with
Program Flow Check; Chip ID;
True RNG (AIS31, FIPS-140)
Integrity Guard Security System:
Digital Full Error/Fault/DFA
Detection; Full CPU-, Memory-,
Bus- and Cache-Encryption;
Dual encrypted-calculation
CPU; Active I²-Shield; MMU
with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures;
Threshold Sensors: V, f, Light,
Temp; Intelligent Watchdog with
Program Flow Check; Chip ID;
True RNG (AIS31, FIPS-140)
Peripherals
Single-Wire Interface (SWI)
protocol supports: Uni-cast,
Multi-cast and Broadcast
communication; 12-bit ADC
I²C, ICU/PEC, CRC, PLL
I²C, ICU/PEC, CRC, PLL
Delivery forms
WQFN-6
VQFN-8, die
VQFN-8, die
Typical applications
Batteries, Printer Cartridges,
Network Security, Consumer
Accessories, Original
(Printer, Gaming), Specialized
Replacement Parts, Medical
Electronic Equipment
Equipment & Diagnostic
Supplies, Authentication of
System Services, Functionalities
and Parts in Networked Systems
Network Security, Consumer
(Printer, Gaming), Specialized
Electronic Equipment
Certifications
–
CC EAL5+ high
30
CC EAL5+ high
TPM
SLB 78CIFX1280P
Secure µSlim
Flash/EEPROM
SLB 78CIFX1600P
Secure µSlim
Flash/EEPROM
SLB 9635 TT 1.2
TPM
Security cryptocontroller for embedded
applications
Security cryptocontroller for embedded
applications
Security cryptocontroller for Trusted Platform
Modules
–
–
–
128kByte
160kByte
–
8kByte
8kByte
–
Dual 16-bit
Dual 16-bit
16-bit
–
–
–
3DES, AES up to 256-bit
3DES, AES up to 256-bit
acc. to TCG standard
RSA up to 2,048-bit,
ECC up to 521-bit
RSA up to 2,048-bit,
ECC up to 521-bit
acc. to TCG standard
1–33MHz
1–33MHz
1–33MHz
1–10MHz
1–10MHz
1–33MHz
1.62–5.5V
1.62–5.5V
3.0–3.3V
10mA (at 5MHz, 5V)
10mA (at 5MHz, 5V)
25mA
100µA
100µA
0.5mA
0 to +70°C
0 to +70°C
0 to +70°C
< 2.3ms
< 2.3ms
–
1 to 128Byte
1 to 128Byte
–
Yes
Yes
–
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA,
DEMA/SEMA Countermeasures; Threshold
Sensors: V, f, Light, Temp; Intelligent
Watchdog with Program Flow Check; Chip
ID; True RNG (AIS31, FIPS-140)
Integrity Guard Security System: Digital
Full Error/Fault/DFA Detection; Full CPU-,
Memory-, Bus- and Cache-Encryption; Dual
encrypted-calculation CPU; Active I²-Shield;
MMU with Level Concept; DPA/SPA, DEMA/
SEMA Countermeasures; Threshold Sensors:
V, f, Light, Temp; Intelligent Watchdog with
Program Flow Check; Chip ID; True RNG
(AIS31, FIPS-140)
Platform Integrity Measurement, Secure
Key and Certificate Storage, Integrated PKI
Infrastructure,
Hardware:
PC Chipset Interoperability, full
implementation of the TCG standard Security:
Physical Protection: Active Shield, Active
Attack Detection, Cock Interruption
Detection, SPA and DPA Protection
I²C, ICU/PEC, CRC, PLL
I²C, ICU/PEC, CRC, PLL
LPC Bus
VQFN-8, die
VQFN-8, die
TSSOP-28
Network Security, Consumer (Printer,
Gaming), Specialized Electronic Equipment
Network Security, Consumer (Printer,
Gaming), Specialized Electronic Equipment
Trusted Platform Module (TPM)
CC EAL5+ high
CC EAL5+ high
CC EAL4+ moderate, TCG certified
31
Embedded Security Controller
M2M
Product name
SLM 76CF2561P
Secure μSlim Flash/EEPROM
SLM 76CF2562P
Secure μSlim Flash/EEPROM
SLM 76CF3201P
Secure μSlim Flash/EEPROM
Product description
Security controller with
extended specification for
M2M applications
Security controller with
extended specification for
M2M applications
Security controller with
extended specification for
M2M applications
User-ROM
–
–
–
EEPROM
256kByte
256kByte
320kByte
RAM
8kByte
8kByte
8kByte
CPU
16-bit
16-bit
16-bit
Crypto coprocessors
–
–
–
Symmetrical Cryptography
3DES, AES up to 256-bit
3DES, AES up to 256-bit
3DES, AES up to 256-bit
Asymmetrical Cryptography
–
–
–
Clock (int.)
1–33MHz
1–33MHz
1–33MHz
Clock (ext.)
1–7.5MHz
1–7.5MHz
1–7.5MHz
Operating voltage
1.62–5.5V
1.62–5.5V
1.62–5.5V
Max. supply current
10mA
10mA
10mA
Max. sleep mode current (typical)
100µA
100µA
100µA
Ambient temperature
-40 to +105°C
-40 to +105°C
-40 to +105°C
Write/erase time
< 2.3ms
< 2.3ms
< 2.3ms
EEPROM page programming
1 to 128Byte
1 to 128Byte
1 to 128Byte
MMU
Yes
Yes
Yes
Security features
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against DPA/
SPA and Fault Attacks, Threshold
Sensors, Intelligent Watchdog
with Program Flow Check, Chip
ID, Pseudo RNG
Peripherals
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
Delivery forms
VQFN-8, die
VQFN-8, die
VQFN-8, die
Typical applications
Industrial and Consumer
Machine-to-Machine
Applications
Industrial and Consumer
Machine-to-Machine
Applications
Industrial and Consumer
Machine-to-Machine
Applications
Certifications
–
–
–
32
SLM 76CF3601P
Secure μSlim Flash/EEPROM
SLM 76CF5120P
Secure μSlim Flash/EEPROM
Security controller with
extended specification for
M2M applications
Security controller with
extended specification for
M2M applications
–
–
360kByte
504kByte
8kByte
12kByte
16-bit
–
16-bit
–
3DES, AES up to 256-bit
–
3DES, AES up to 256-bit
–
1–33MHz
1–33MHz
1–7.5MHz
1–7.5MHz
1.62–5.5V
1.62–5.5V
10mA
10mA
100µA
100µA
-40 to +105°C
-40 to +105°C
< 2.3 ms
< 2.3ms
1 to 128Byte
1 to 128Byte
Yes
Yes
Memory- and Bus-Encryption,
MMU with Level Concept,
Basic Countermeasures
against DPA/SPA and Fault
Attacks, Threshold Sensors,
Intelligent Watchdog with
Program Flow Check, Chip ID,
Pseudo RNG
Memory- and Bus-Encryption,
MMU with Level Concept, Basic
Countermeasures against
DPA/SPA and Fault Attacks,
Threshold Sensors, Intelligent
Watchdog with Program Flow
Check, Chip ID, Pseudo RNG
ICU/PEC, CRC, PLL, UART DF 8
ICU/PEC, CRC, PLL, UART DF 8
VQFN-8, die
VQFN-8, die
Industrial and Consumer
Machine-to-Machine
Applications
Industrial and Consumer
Machine-to-Machine
Applications
–
–
33
Modules and Preassembly
Contact-based Controller Modules
Product name
S-MFC5.8
S-MFC5.6
P-M5.1
T-M5.1
Product description
Contact-based module
8 Contacts
FCOS™ technology
PET Tape
Flip Chip
Contact-based module
6 Contacts
FCOS™ technology
PET Tape
Flip Chip
Contact-based module
8 Contacts
Epoxy Tape
Wire Bond
Mold
Contact-based module
8 Contacts
Epoxy Tape
Wire Bond
Glob Top
Typical applications
Payment, GSM
Payment, GSM
Payment, Government
Identification
Payment, Government
Identification, GSM
Pitch
14.25mm
9.5mm
14.25mm
14.25mm
Dimensions
13 x 11.8mm
11 x 8.3mm
13 x 11.8mm
13 x 11.8mm
Thickness
max. 538µm
max. 538µm
max. 600µm
max. 580µm
Contact surface
NiAu
NiAu
CIN+
CIN+
Delivery form
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
ISO-reference
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
Derivatives
S-MFC5.8-8-1, Au surface
S-MFC5.8-8-3, Pd surface
S-MFC5.6-6-1, Au surface
S-MFC5.6-6-3, Pd surface
S-MFC1.6-6-1, Ni coating
–
T-M5.1-8-1, Au surface
T-M5.1-8-2, Pd surface
Picture
34
Contact-based Memory Modules
T-M5.3
T-M4.9
T-M4.8
S-MFC3.1
T-M3.2
Contact-based module
8 Contacts
Epoxy Tape
Wire Bond
Glob Top
Contact-based module
8 Contacts
Epoxy Tape
Wire Bond
Glob Top
Contact-based module
8 Contacts
Epoxy Tape
Chip Cavity
Wire Bond
Glob Top
Contact-based module
6 Contacts
FCOS ™ technology
PET Tape
Flip Chip
Contact-based module
6 Contacts
Epoxy Tape
Chip Cavity
Wire Bond
Glob Top
Pay TV
Payment, Government
Identification
GSM
Healthcare/Social
Security Card, Ticketing,
Loyalty, Access Control
Healthcare/Social
Security Card, Ticketing,
Loyalty, Access Control
14.25mm
14.25mm
14.25mm
9.5mm
9.5mm
13 x 11.8mm
13 x 11.8mm
13 x 11.8mm
11 x 8.3mm
11 x 8.3mm
max. 580µm
max. 580µm
max. 580µm
max. 538µm
max. 580µm
CIN+
CIN
CIN
NiAu
CIN
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
–
T-M4.9-8-1, Au surface
T-M4.9-8-2, Pd surface
–
S-MFC3.1-6-1, Au surface
S-MFC1.6-6-1, Ni coating
–
35
Modules and Preassembly
Contactless Controller & Memory Modules
Product name
Dual Interface Modules
P-MCC8-2-3
P-MCC2-2-1
P-FTM8-2-1
T-M8.4
P-M8.4
Product description
2 Antenna Contacts
Wire Bond
+ Mold
+ Leadframe
2 Antenna Contacts
Wire Bond
+ Mold
+ Leadframe
2 Antenna Contacts
Wire Bond
+ Mold
+ Epoxy Tape
Controller only
Dual Interface
Module
8 Contacts CB
2 Antenna Contacts
Epoxy Tape
Wire Bond
Glob Top
Dual Interface
Module
8 Contacts CB
2 Antenna Contacts
Epoxy Tape
Wire Bond
Mold
Typical applications
Payment, Access
Control, e-Passport,
Driver’s License,
Transport, Identification, Ticketing
Transport,
Access Control
e-Passport,
Driver’s License
Payment, EMV
SDA/DDA, ePurse,
Loyalty, Access
Control, Driver’s
License, Transport,
Ticketing
Payment, e-Passport
Pitch
9.5mm
4.75mm
9.5mm
14.25mm
14.25mm
Dimensions
8.1 x 5.15mm
10.3 x 2.9mm
8.2 x 5.7mm
13 x 11.8mm
13 x 11.8mm
Thickness
max. 340µm
max. 340µm
max. 260µm
max. 580µm
max. 620µm
Contact surface
Ag
Ag
NiAu
NiAu/NiAuPd
NiAu
Delivery form
Tape on Reel
Reel diameter
330mm
Tape on Reel
Reel diameter
330mm
Tape on Reel
Reel diameter
330mm
Tape on Reel
Reel diameter
330mm
Tape on Reel
Reel diameter
330mm
ISO-reference
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
ISO/IEC 7810
ISO/IEC 7816-1
ISO/IEC 10373-1/-3
Derivatives
–
–
–
T-M8.4-8-1,
Au surface
T-M8.4-8-2,
Pd surface
T-M8.4-8-8,
La/Lb to C4/C8
Picture
36
–
SMD Packages
DSO-20
TSSOP-28
VQFN-8
VQFN-10
WQFN-6
Surface Mount Device
Lead
Surface Mount Device
Lead
Surface Mount Device
Small Outline No-Lead
Exposed pad
Surface Mount Device
Small Outline No-Lead
Exposed pad
Surface Mount Device
Small Outline No-Lead
Exposed pad
Embedded Security
Authentication
Ingetrity
Embedded Security
Trusted Platform Module
Embedded Security
Authentication
Ingetrity
Embedded Security
Authentication
Ingetrity
Embedded Security
Authentication
1.27mm
0.65 mm
1.27mm
1.27 mm
0.65 mm
12.8 x 7.6mm
9.7 x 4.4 mm
5 x 6 mm
6 x 5 mm
2.5 x 2.5 mm
max. 2.64mm
max. 1.1mm
max. 900µm
max. 900µm
max. 800µm
Sn
Sn
NiPdAuAg
NiPdAuAg
Sn
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
Tape on Reel
Reel diameter 330mm
–
–
–
–
–
–
–
–
–
–
37
Modules and Preassembly
Preassembly
Product name
Bumping NiAu
Stud Bump
Wafer Thinning
Wafer Dicing
Product description
NiAu bump on the pad
height:
– 20µm
– 30µm
Gold bump on the pad
height:
– 30µm
Standard thinning
and etching or
DBG (Dicing Before
Grinding) - necessary for
thicknesses less than
150µm
Chip separation
Delivery form
Wafer unsawn or sawn:
– < 150µm thickness
only sawn on Frame
– any thickness sawn
only on wafer frame
Wafer unsawn or sawn:
– < 150µm thickness
only sawn on Frame
– any thickness sawn
only on wafer frame
Wafer unsawn or sawn:
– < 150µm thickness
only sawn on Frame
– any thickness sawn
only on wafer frame
Wafer Frame
Thicknesses
55µm (on request),
150µm, 185µm, 330µm
55µm (on request),
150µm, 185µm, 330µm
55µm (on request),
150µm, 185µm, 330µm
55µm (on request),
150µm, 185µm, 330µm
Inking
Available
Available
Available
Available
Mapping
Available/preferred
Available/preferred
Available/preferred
Available/preferred
Documents
– Chip Delivery
Specification for
6""/8"" Wafer
– General Issue
– NiAu-BumpingSpecification
– Product Specific Issue
– Chip Delivery
Specification for
6””/8”” Wafer
– General Issue
– Stud-BumpingSpecification
– Product Specific Issue
– Chip Delivery
Specification for
6””/8”” Wafer
– General Issue
– Product Specific Issue
– Chip Delivery
Specification for
6””/8”” Wafer
– General Issue
– Product Specific Issue
Picture
38
Infineon Technologies – innovative semiconductor solutions
for energy efficieny, communication and security.
[ www.infineon.com ]
Order No.
B180-H9325-G1-X-7600
Date: 11/09