DATA SHEET Pb - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
SURFACE MOUNT LED TAPE AND REEL
Pb
Lead-Free Parts
L3HRF5050S/TR1
DATA SHEET
DOC. NO : QW0905-L3HRF5050S/TR1
REV.
: A
DATE
: 28 - Dec. - 2010
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L3HRF5050S/TR1
Page 1/10
Features:
1. Top view white LED.
2. white SMT package.
3. Leadframe package with individual 6 pin.
4.Wide viewing angle.
5.Soldering methods:IR reflow soldering.
6.Feature of the device:more light due to higher optical efficiency;extremely
wide viewing angle;ideal for backlighting and coupling in light guide.
Descriptions:
The L3HRF5050S SMD has wide viewing angle and optimized light coupling
by inter reflector,The low current requirement makes this device ideal for
portable equipment or any other application where power is at a premium.
Applications:
1. LCD back light.
2. Mobile phones.
3. Indicators.
4. Switch lights.
5. Lighting.
Device Selection Guide:
PART NO
L3HRF5050S/TR1
COLOR
MATERIAL
AlGaInP
Emitted
Lens
Red
Water Clear
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L3HRF5050S/TR1
Page 2/10
Package Dimensions
5.4
1.0
1
6
2
5
3
4
5.0
1.0
0.9
0.9
0.9
0.9
0.9
0.9
Soldering Terminal
Cathode Mark
5.0
1.6
1.0
4.1
1
6
2
5
3
4
1.0
Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
6.8
2.0
2.0
1.2
0.4
0.4
Note : The tolerances unless mentioned is ±0.1mm Unit=mm.
1.2
1.2
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Page 3/10
PART NO. L3HRF5050S/TR1
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
UNIT
HRFS
Forward Current
IF
90
mA
Peak Forward Current
Duty [email protected]
IFP
180
mA
Power Dissipation
PD
234
mW
Reverse Current @5V
Ir
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
- 40 ~ + 85
℃
Storage Temperature
Tstg
- 40 ~ + 100
℃
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Symbol
Min.
Typ.
Iv
500
1000
----
mcd
IF=20mA X 3
λD
----
625
----
nm
IF=20mA X 3
△λ
----
20
----
nm
IF=20mA X 3
VF
1.7
----
2.6
V
IF=20mA X 3
2θ 1/2
----
120
----
deg
IF=20mA X 3
Max. UNIT
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2.The luminous intensity data did not including ±15% testing tolerance.
CONDITION
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PART NO. L3HRF5050S/TR1
Page 4/10
Typical Electro-Optical Characteristics Curve
HRFS CHIP
Fig.2 Luminous Intensity vs. Forward Current
6.0
150
Luminous Intensity
Normalize @20mA
Forward Current(mA)
Fig.1 Forward current vs. Forward Voltage
100
50
0
0
0.5
1.0
1.5
2.0
2.5
5.0
4.0
3.0
2.0
1.0
0.0
0
3.0
50
1.06
1.04
1.02
1.00
0.98
0.96
0.94
0
20
40
60
80
100
Fig.4 Luminous Intensity vs. Temperature
Luminous [email protected]
Normalize @25 ℃
Forward [email protected]
Normalize @25 ℃
Fig.3 Forward Voltage vs. Temperature
-20
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature(℃)
Fig.5 Relative Intensity vs. Wavelength
Relative [email protected]
150
Forward Current(mA)
Forward Voltage(V)
-40
100
Fig.6 Directive Radiation
0°
1.0
-30°
30°
-60°
0.5
100% 75% 50%
0
550
600
650
Wavelength (nm)
700
60°
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. L3HRF5050S/TR1
Page 5/10
Carrier Type Dimensions
4.0
2.0
ψ1.5
8.0
1.95
1.75
5.5
12.0
9.3 ±0.3
5.4
Polarity
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
0.2
0.8
0.6
Aluminum Moist-Proof bag
Label
0.8
0.6
0.2
0.4
0.4
Label
Part No.
Description
Quantity/Reel
L3HRF5050S/TR1
12.0mm tape,7"reel
1000 PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 7/10
PART NO. L3HRF5050S/TR1
Box Explanation
1. 4 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L3HRF5050S/TR1
Page 8/10
Recommended Soldering Conditions
1. Hand Solder
Basic spec is ≦ 320℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245±5℃ within 5 sec
120 ~ 150℃
Preheat
120 ~ 180 sec
3 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200 ° C
1~5° C/sec
260° C MaX.
10sec.Max
6° C/sec
Above 220 ° C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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Page 9/10
PART NO. L3HRF5050S/TR1
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. L3HRF5050S/TR1
Page 10/10
Reliability Test:
(1)Test items and results
Classification
Test Item
Test Condition
Sample
Size
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If= 60mA
3.t=1000 hrs
22
High Temperature
Storage Test
1.Ta=105 ℃± 5℃
2.t=500 hrs
22
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs
22
High Temperature
High Humidity
Storage Test
1.IR-Reflow In-Board, 2 Times
2.Ta=85 ℃± 5 ℃
3.RH=90 %~95 %
4.t=500hrs ±2hrs
22
1.IR-Reflow In-Board,2 times
2.Ta=105 ℃ ±5℃ &
-40 ℃± 5℃
( 30 min) ( 30 min)
3.total 100 cycles
22
1.T.Sol=260 ℃±5 ℃
2.Dwell Time= 10 Max .
22
1.105 ℃ ~ 25 ℃ ~ - 40 ℃
30mins 15mins 30mins
2.100 Cyeles
22
Endurance
Test
Thermal Shock Test
Environmental
Test
Reflow Soldering Test
Temperature
Cycling
(2)Criteria for judging the damage
Criteria for Judgement
Item
Symbol Test Conditions
Min.
Max.
Forward Voltage
Vf
If=60mA
-
U.S.L x1.2
Reverse Current
Ir
Vr=5V
-
U.S.L x2.0
Luminous Intensity
Iv
If=60mA
L.S.L x 0.5
-
Note:
1.U.S.L.:Upper Standard Level.
2.L.S.L.:Lower Standard Level.