DATA SHEET Pb - Ligitek Electronics Co. Ltd.

!LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-197GBR-CT-3C2
DATA SHEET
DOC. NO : QW0905-LG-197GBR-CT-3C2
REV.
:
B
DATE
:
01 - Dec. - 2014
發行
立碁電子
DCC
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Page 1/14
PART NO. LG-197GBR-CT-3C2
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-197 SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
LG-197GBR-CT-3C2
MATERIAL
COLOR
Emitted
AlGaInP
Red
lnGaN
Green
lnGaN
Blue
Lens
Water Clear
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PART NO. LG-197GBR-CT-3C2
Package Dimensions
1.5
0.55
2
Soldering
Terminal
0.25
3
0.18
0.4
1.1
1.6
Die3
0.8
Die2
Die1
0.4
RESIN
1
4
0.6
PCB
0.6
3
+
-
-
-
4 2 1
R B G
Note : 1.All dimension are in millimeter tolerance is ̈́0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
˅ˁ˅
˃ˁˌ
Note : The tolerances unless mentioned is ̈́0.1mm,Angle ̈́0.5. Unit=mm.
-
˃ˁˈ
+
˄ˁˈ
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Page 3/14
PART NO. LG-197GBR-CT-3C2
Absolute Maximum Ratings at Ta=25к
Ratings
Parameter
Symbol
UNIT
DGM
DBK
HRF
Power Dissipation
PD
108
108
72
mW
Peak Forward Current
Duty [email protected]
IFP
100
100
90
mA
Forward Current
IF
30
30
30
mA
Reverse Current @5V
Ir
50
50
10
ȝA
Electrostatic Discharge
ESD
500
500
2000
V
Operating Temperature
Topr
-20 ~ +80
к
Storage Temperature
Tstg
-30 ~ +100
к
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PART NO. LG-197GBR-CT-3C2
Page 4/14
Typical Electrical & Optical Characteristics (Ta=25к)
Items
Luminous Intensity
Dominant Wavelength
Spectral Line Half-Width
Forward Voltage
Viewing Angle
Symbol
Iv
ȜD
Ϧӳ
VF
2ș 1/2
Min.
Typ. Max. UNIT
DGM 200
500
----
DBK
50
125
----
HRF
32
80
----
DGM
----
525
----
DBK
465
----
477
HRF
----
630
----
DGM
----
36
----
DBK
----
30
----
HRF
----
20
----
DGM
2.8
----
3.6
DBK
2.8
----
3.6
HRF
1.5
----
2.4
DGM
----
140
----
DBK
----
140
----
HRF
----
140
----
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
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PART NO. LG-197GBR-CT-3C2
Page 5/14
Luminous Intensity Classification
BIN CODE
DGM
Min.
Max.
S
200
320
T
320
500
U
500
800
BIN CODE
DBK
Iv(mcd) at 20mA
Min.
Max.
P
50
80
Q
80
125
R
125
200
S
200
320
BIN CODE
HRF
Iv(mcd) at 20mA
Iv(mcd) at 20mA
Min.
Max.
N
32
50
P
50
80
Q
80
125
R
125
200
Dominant Wavelength Classification
BIN CODE
DBK
ȜD(nm) at 20mA
Min.
Max.
0D
465
468
0C
468
471
0B
471
474
0A
474
477
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PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
1.0
2.0
4.0
3.0
5.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative [email protected]
Normalize @25к
Forward [email protected]
Normalize @25к
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
1.0
0.5
0.0
500
550
Wavelength (nm)
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
Fig.6 Directive Radiation
Fig.5 Relative Intensity vs. Wavelength
450
2.5
80
Ambient Temperature( к)
Ambient Temperature( к)
Relative [email protected]
100
600
100
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PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
DBK CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative [email protected]
Normalize @25к
Forward [email protected]
Normalize @25к
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
Relative [email protected]
1.0
0.5
0.0
450
500
Wavelength (nm)
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( к)
Ambient Temperature( к)
400
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
550
Fig.6 Directive Radiation
100
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Page 8/14
PART NO. LG-197GBR-CT-3C2
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.5
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
3.0
2.5
2.0
1.5
1.0
0.5
0
1.0
1.5
2.5
2.0
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative [email protected]
[email protected]
1.2
Forward [email protected]
Normalize @25к
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
-0
20
40
60
80
Ambient Temperature( к)
Fig.5 Relative Intensity vs. Wavelength
Relative [email protected]
100
1.0
0.5
0
550
600
650
Wavelength (nm)
700
100
2.5
2.0
1.5
1.0
0.5
0
-40
-20
0
20
40
60
80
Ambient Temperature( к)
Fig.6 Directive Radiation
100
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Page 9/14
PART NO. LG-197GBR-CT-3C2
Carrier Tape Dimensions
4.0̈́0.2
0.23
2.0
1.75
-
3.5̈́0.2
8.0̈́0.3
1.75
5.3
0.7
+
1.65
4.0̈́0.2
Note : The tolerances unless mentioned is ̈́0.1mm,Angle ̈́ʳ0.5. Unit=mm.
Θ Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-197GBR-CT-3C2
8.0mm tape,7"reel
4000 devices
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PART NO. LG-197GBR-CT-3C2
Page 10/14
Label Explanation
LIGITEK ELECTRONICS CO., LTD.
Pb
!QBSU!;
!
MH.2:8HCS.DU.4D3
!MPU!;
!
HT22481279
BIN : Luminous Intensity
!
WG;3/9.4/7
!RUZ)QDT*;!
5111
!
WG;3/9.4/7
!CJO0IVF!;!
V.R01C.R
!
WG;2/6.3/5
VF : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.4
0.2
0.6
2.0̈́0.5
178̈́1.5
60̈́1.0
9.0̈́1.0
ӿ13.5̈́1.0
12.0̈́1.0
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Page 11/14
PART NO. LG-197GBR-CT-3C2
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm
L
W
H
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PART NO. LG-197GBR-CT-3C2
Page 12/14
Recommended Soldering Conditions
1. Hand Solder
Basic spec is Љ 280к 3 sec one time only.
3 PB-Free Reflow Solder
1~5°C/sec
Preheat
180~200°C
1~5°C/sec
260°C MaX. 10sec.Max
6°C/sec
Above 220°C
60 sec.Max.
120 sec.Max.
Note:
1.Reflow soldering should not be done more than two times.
2.When soldering,do not put stress on the LEDs during heating.
3.After soldering,do not warp the circuit board.
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PART NO. LG-197GBR-CT-3C2
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 к~35к,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year at І30к and І90% relative humidity(RH) (from production date).
3.If opened more than one week in an atmosphere 5 к ~ 35к,RH60%,
they should be treated at 60 к±5 кfo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40% of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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PART NO. LG-197GBR-CT-3C2
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 к²5к
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 к²5к
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65 к²5к
2.RH=90%~95%
3.t=1000hrs¡Ó2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 к̈́ˈк&-40к̈́5к
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 к̈́5к
2.Immersion time 2 ̈́0.5sec
3.Coverage Њ95% of the dipped surface
1.105кʳ̑ʳ25кʳ̑ʳˀ55кʳ̑ʳ25к
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260°C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020