LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED ARRAY Pb Lead-Free Parts LA92B/HRFDGM.X-1-PF DATA SHEET DOC. NO : QW0905- LA92B/HRFDGM.X-1-PF REV. : A DATE : 29 - Nov. - 2011 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA92B/HRFDGM.X-1-PF Page 1/6 Package Dimensions 11.72±0.5 7.0 9.02 2.9 9.65 5.08 □0.5 TYP 1 2 3 3.3±0.3 24.1 1 2.54TYP HRF DGM 2.3 2 3 2.54TYP 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.9 3.1 LHRFDGM2692/R1-PF 3.3 4.3 6.45 ±0.5 1.5 MAX DGM HRF □0.5 18.0MIN TYP 1 2 2 3 3 1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE RED 2.0MIN 2.0MIN 2.54TYP 1 2.54TYP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/6 PART NO. LA92B/HRFDGM.X-1-PF Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT HRF DGM Forward Current IF 30 30 mA Peak Forward Current Duty 1/10@10KHz IFP 90 100 mA Power Dissipation PD 75 120 mW Reverse Current @5V Ir 10 50 μA Electrostatic Discharge ESD 2000 500 V Operating Temperature Topr -20 ~ +80 ℃ Storage Temperature Tstg -30 ~ +100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) COLOR PART NO MATERIAL Emitted AlGaInP Luminous intensity Viewing angle @20mA(mcd) 2θ 1/2 (deg) Min. Typ. Max. Min. Lens Red LA92B/HRFDGM.X-1-PF Forward voltage @20mA(V) Peak Dominant Spectral wave wave halfwidth length △λ nm length λPnm λDnm ---- 630 20 1.5 --- 518 525 36 --- 2.4 26 Typ. 35 36 Water Clear InGaN/GaN Green Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance. 3.5 4.0 1100 1200 36 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA92B/HRFDGM.X-1-PF Page3/6 Typical Electro-Optical Characteristics Curve HRF CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.5 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 3.0 2.5 2.0 1.5 1.0 0.5 0 0.1 1.0 2.0 1.5 2.5 3.0 1.0 10 Fig.4 Relative Intensity vs. Temperature Fig.3 Forward Voltage vs. Temperature 3.0 Relative Intensity@20mA Normalize@25 ℃ 1.2 1.1 1.0 0.9 0.8 -40 -20 -0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 550 600 650 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) Forward Voltage@20mA Normalize @25℃ 100 700 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA92B/HRFDGM.X-1-PF Page4/6 Typical Electro-Optical Characteristics Curve DGM CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 2.0 1.0 3.0 4.0 1.0 5.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 450 500 550 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA 100 600 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA92B/HRFDGM.X-1-PF Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120°C Max Preheat time: 120seconds Max Ramp-up 2° C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 120 Seconds Max 100 200 Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. 250 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LA92B/HRFDGM.X-1-PF Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11