!LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LED SMD Pb Lead-Free Parts LG-110VY/9UG-A-CT DATA SHEET DOC. NO : QW0905-LG-110VY/9UG-A-CT REV. : B DATE : 15 - Oct. - 2012 發行 立碁電子 DCC !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/12 PART NO. LG-110VY/9UG-A-CT Features: 1. Package in 8.0mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with reflow solder process. Descriptions: 1. The LG-110 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO LG-110VY/9UG-A-CT MATERIAL COLOR Emitted AlGaInP Yellow AlGaInP Green Lens Water Clear !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 2/12 PART NO. LG-110VY/9UG-A-CT Package Dimensions Cathode Mark 1.0 1.5 1 0.5 2 Resin 2 1 0.6 0.8 0.6 DIE13.2 2 DIE2 0.6 3 _ _ 4 0.2 Soldering Terminal 1 2 VY 9UG + 0.6 PCB 3,4 Note : 1.All dimension are in millimeter tolerance is ̈́0.1mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 1.0 0.9 1 5.0 2 1.5 1.0 1.5 3,4 1.0 Note : The tolerances unless mentioned is ̈́0.1mm,Anglë́0.5. Unit=mm. 4 3 !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/12 PART NO. LG-110VY/9UG-A-CT Absolute Maximum Ratings at Ta=25к Ratings Parameter Symbol UNIT VY 9UG Power Dissipation PD 78 78 mW Peak Forward Current Duty 1/10@10KHz IFP 60 60 mA Forward Current IF 30 30 mA Reverse Current @5V Ir 10 10 ȝA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ +85 к Storage Temperature Tstg -40 ~ +90 к Typical Electrical & Optical Characteristics (Ta=25к) Items Luminous Intensity Peak Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Symbol Min. Typ. Max. UNIT VY 32 50 ---- 9UG 12.5 30 ---- VY ---- 593 ---- 9UG ---- 575 ---- VY ---- 590 ---- 9UG ---- 574 ---- VY ---- 20 ---- 9UG ---- 20 ---- VY 1.7 ---- 2.6 9UG 1.7 ---- 2.6 VY ---- 120 ---- 9UG ---- 120 ---- Iv ȜP ȜD Ϧӳ VF 2ș 1/2 Note : 1.The forward voltage data did not including ̈́0.1V testing tolerance. 2. The luminous intensity data did not including ̈́15% testing tolerance. CONDITION mcd IF=20mA nm IF=20mA nm IF=20mA nm IF=20mA V IF=20mA deg IF=20mA !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/12 PART NO. LG-110VY/9UG-A-CT Luminous Intensity Classification BIN CODE VY N P Q R BIN CODE 9UG L M N P Iv(mcd) at 20mA Min. Max. 32 50 80 125 50 80 125 200 Iv(mcd) at 20mA Min. Max. 12.5 20 32 50 20 32 50 80 Dominant Wavelength Classification BIN CODE VY 15 16 17 18 19 BIN CODE 9UG 6 7 8 9 10 11 ȜD(nm) at 20mA Min. Max. 585 587 587 592 595 587 587 592 595 598 ȜD(nm) at 20mA Min. Max. 566 568 570 572 574 576 568 570 572 574 576 578 !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/12 PART NO. LG-110VY/9UG-A-CT Typical Electro-Optical Characteristics Curve VY CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) 1000 3.0 2.5 100 2.0 10 1.5 1.0 1.0 0.5 0.1 0.0 1.0 1.5 2.0 2.5 3.0 1.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25к Forward Voltage@20mA Normalize @25к 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 Ambient Temperature( к) Ambient Temperature( к) Relative Intensity@20mA 100 650 Fig.6 Directive Radiation 100 !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 6/12 PART NO. LG-110VY/9UG-A-CT Typical Electro-Optical Characteristics Curve 9UG CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0 2.0 1.0 3.0 4.0 5.0 1.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0 500 550 600 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0 -40 -20 0 20 40 60 80 Ambient Temperature( к) Ambient Temperature( к) Relative Intensity @20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity @20mA Normalize @25к Forward Voltage@20mA Normaliz @25к Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 650 Fig.6 Directive Radiation 100 !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/12 PART NO. LG-110VY/9UG-A-CT Carrier Type Dimensions 4.0±0.2 0.25 2.0 1.5 1.75 3.5±0.2 8.0±0.3 5.3 3.4 Polarity 1.25 4.0±0.2 1.87 Note : The tolerances unless mentioned is ̈́0.1mm,Angle ̈́ʳ0.5. Unit=mm. Θ Packing Specifications Label Aluminum Moist-Proof bag Label Part No. Description Quantity/Reel LG-110VY/9UG-A-CT 8.0mm tape,7"reel 3000 devices !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/12 PART NO. LG-110VY/9UG-A-CT Label Explanation LIGITEK ELECTRONICS CO., LTD. Pb BIN N : Yellow Chip Luminous Intensity !QBSU!; ! MH.221WZ0:VH.B.DU !MPU!; ! HT2.191279 BIN M : Green Chip Luminous Intensity HUE 19 : Yellow Chip Dominant Wavelength !RUZ)QDT*;! 5111 ! WG;2/8.3/7 ! WG;2/8.3/7 HUE 10 : Green Chip Dominant Wavelength !CJO0IVF!;! O02:.N021 VF : Forward Voltage Reel Dimensions 0.2 0.4 0.8 0.8 0.6 0.2 0.4 0.6 2.0̈́0.5 178̈́1.5 6.0̈́1.0 9.0̈́1.0 ӿ13.5̈́1.0 12.0̈́1.0 !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 9/12 PART NO. LG-110VY/9UG-A-CT Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/12 PART NO. LG-110VY/9UG-A-CT Recommended Soldering Conditions 1. Hand Solder Basic spec is Љ 280к 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 к 245̈́5кʳwithin 5 sec 120 ~ 150к Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5°C/sec Preheat 180~200°C 1~5°C/sec 260°C MaX. 10sec.Max 6°C/sec Above 220°C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 11/12 PART NO. LG-110VY/9UG-A-CT Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 к~35к,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 к ~ 35к,RH60%, they should be treated at 60 к±5 кfo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40% of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. !LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 12/12 PART NO. LG-110VY/9UG-A-CT Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) MIL-STD-750D: 1026 MIL-STD-883D: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 к²5к 2.t=1000 hrs (-24hrs, +72hrs) MIL-STD-883D:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 к²5к 2.t=1000 hrs (-24hrs, +72hrs) JIS C 7021: B-12 High Temperature High Humidity Storage Test 1.Ta=65 к²5к 2.RH=90%~95% 3.t=1000hrs¡Ó2hrs Endurance Test Thermal Shock Test Solderability Test Environmental Test Temperature Cycling IR Reflow 1.Ta=105 к̈́ˈк&-40к̈́5к (10min) (10min) 2.total 10 cycles 1.T.Sol=235 к̈́5к 2.Immersion time 2 ̈́0.5sec 3.Coverage Њ95% of the dipped surface 1.105 кʳ̑ʳ25кʳ̑ʳˀ55кʳ̑ʳ25к 30mins 5mins 30mins 5mins 2.10 Cyeles 1.T=260°C Max. 10sec.Max. 2. 6 Min MIL-STD-202F:103B JIS C 7021: B-11 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1011 MIL-STD-202F: 208D MIL-STD-750D: 2026 MIL-STD-883D: 2003 IEC 68 Part 2-20 JIS C 7021: A-2 MIL-STD-202F: 107D MIL-STD-750D: 1051 MIL-STD-883D: 1010 JIS C 7021: A-4 MIL-STD-750D:2031.2 J-STD-020