LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SURFACE MOUNT LED TAPE AND REEL Pb Lead-Free Parts L3DBK5050/TR1 DATA SHEET DOC. NO : QW0905-L3DBK5050/TR1 REV. : A DATE : 28 - Dec. - 2010 發行 立碁電子 DCC LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L3DBK5050/TR1 Page 1/10 Features: 1. Top view white LED. 2. white SMT package. 3. Leadframe package with individual 6 pin. 4.Wide viewing angle. 5.Soldering methods:IR reflow soldering. 6.Feature of the device:more light due to higher optical efficiency;extremely wide viewing angle;ideal for backlighting and coupling in light guide. Descriptions: The L3DBK5050 SMD has wide viewing angle and optimized light coupling by inter reflector,The low current requirement makes this device ideal for portable equipment or any other application where power is at a premium. Applications: 1. LCD back light. 2. Mobile phones. 3. Indicators. 4. Switch lights. 5. Lighting. Device Selection Guide: PART NO L3DBK5050/TR1 COLOR MATERIAL InGaN/GaN Emitted Lens Blue Water Clear LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L3DBK5050/TR1 Page 2/10 Package Dimensions 5.4 1.0 1 6 2 5 3 4 5.0 1.0 0.9 0.9 0.9 0.9 0.9 0.9 Soldering Terminal Cathode Mark 5.0 1.6 1.0 4.1 1 6 2 5 3 4 1.0 Note : 1.All dimension are in millimeter tolerance is ±0.2mm unless otherwise noted. 2.Specifications are subject to change without notice. Recommended Soldering Pad Dimensions 6.8 2.0 2.0 1.2 0.4 0.4 Note : The tolerances unless mentioned is ±0.1mm Unit=mm. 1.2 1.2 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/10 PART NO. L3DBK5050/TR1 Absolute Maximum Ratings at Ta=25 ℃ Ratings Parameter Symbol UNIT DBK Forward Current IF 90 mA Peak Forward Current Duty 1/10@10KHz IFP 300 mA Power Dissipation PD 360 mW Reverse Current @5V Ir 50 μA Electrostatic Discharge ESD 500 V Operating Temperature Topr - 20 ~ + 80 ℃ Storage Temperature Tstg - 30 ~ + 100 ℃ Typical Electrical & Optical Characteristics (Ta=25 ℃) Items Luminous Intensity Dominant Wavelength Spectral Line Half-Width Forward Voltage Viewing Angle Symbol Min. Typ. Iv 500 800 λD ---- △λ Max. UNIT CONDITION ---- mcd IF=20mA X 3 470 ---- nm IF=20mA X 3 ---- 30 ---- nm IF=20mA X 3 VF ---- 3.5 4.0 V IF=20mA X 3 2θ 1/2 ---- 120 ---- deg IF=20mA X 3 Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/10 PART NO. L3DBK5050/TR1 Typical Electro-Optical Characteristics Curve DBK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1 01 2.5 2.0 1.5 1.0 0.5 0.0 1.0 2.0 3.0 4.0 5.0 1 10 1.2 Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25 ℃ Fig.3 Forward Voltage vs. Temperature 1.1 1.0 0.9 0.8 -20 0 20 40 60 80 100 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100 Ambient Temperature(℃) Ambient Temperature( ℃) Fig.5 Relative Intensity vs. Wavelength Relative Intensity@20mA 1000 Forward Current(mA) Forward Voltage(V) -40 100 Fig.6 Directive Radiation 1.0 0° -30° 0.5 30° -60° 0.0 400 450 500 Wavelength (nm) 550 100% 75% 50% 60° 25% 0 25% 50% 75% 100% LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/10 PART NO. L3DBK5050/TR1 Carrier Type Dimensions 4.0 2.0 ψ1.5 8.0 1.95 1.75 5.5 12.0 9.3 ±0.3 5.4 Polarity Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm. • Packing Specifications 0.2 0.8 0.6 Aluminum Moist-Proof bag Label 0.8 0.6 0.2 0.4 0.4 Label Part No. Description Quantity/Reel L3DBK5050/TR1 12.0mm tape,7"reel 1000 PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 7/10 PART NO. L3DBK5050/TR1 Box Explanation 1. 4 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 10 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/10 PART NO. L3DBK5050/TR1 Recommended Soldering Conditions 1. Hand Solder Basic spec is ≦ 320 ℃ 3 sec one time only. 2. Wave Solder Soldering heat Max. 260 ℃ 245± 5℃ within 5 sec 120 ~ 150℃ Preheat 120 ~ 180 sec 3 PB-Free Reflow Solder 1~5° C/sec Preheat 180~200 ° C 1~5° C/sec 260° C MaX. 10sec.Max 6° C/sec Above 220 ° C 60 sec.Max. 120 sec.Max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. L3DBK5050/TR1 Page 9/10 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ℃~35℃,RH60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ℃ ~ 35℃,RH60%, they should be treated at 60 ℃± 5 ℃fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A Circuit model B LED LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 10/10 PART NO. L3DBK5050/TR1 Reliability Test: (1)Test items and results Test Item Classification Test Condition Sample Size Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=60mA 3.t=1000 hrs 22 High Temperature Storage Test 1.Ta=105 ℃± 5℃ 2.t= 500 hrs 22 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs 22 High Temperature High Humidity Storage Test 1.IR-Reflow In-Board, 2 Times 2.Ta= 85℃± 5℃ 3.RH=90 %~95 % 4.t= 500 hrs ±2hrs 22 1.IR-Reflow In-Board,2 times 2.Ta=105 ℃±5℃& -40 ℃± 5℃ (30min) ( 30min) 3.total 100 cycles 22 1.T.Sol=260 ℃±5℃ 2.Dwell Time= 10 Max . 22 1.105 ℃ ~ 25 ℃ ~ - 40 ℃ 30mins 15mins 30mins 2.10 0 Cyeles 22 Endurance Test Thermal Shock Test Environmental Test Reflow Soldering Test Temperature Cycling (2)Criteria for judging the damage Criteria for Judgement Item Symbol Test Conditions Min. Max. Forward Voltage Vf If=60mA - U.S.L x1.2 Reverse Current Ir Vr=5V - U.S.L x2.0 Luminous Intensity Iv If=60mA L.S.L x 0.5 - Note: 1.U.S.L.:Upper Standard Level. 2.L.S.L.:Lower Standard Level.