LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only SINGLE DIGIT LED DISPLAY (0.8 Inch) Pb Lead-Free Parts LSD8A5/65-XX-PF DATA SHEET DOC. NO REV. DATE : : QW0905- LSD8A5/65-XX-PF A : 26 - May.- 2006 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 1/8 Package Dimensions LSD8A5/65-XX-PF LIGITEK 20(0.787") 8.3(0.327") PIN NO.1 20.2 (0.8") 27.7 (1.091") ψ1.5(0.059") Ø 0.51 TYP 6.1±0.5 15.2 (0.598") Note : 1.All dimension are in millimeters and (lnch) tolerance is ±0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. 2.54X7 =17.78 (0.7") LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 2/8 Internal Circuit Diagram LSD8A55-XX-PF 4,6,12,17 L.DP 7 A B C D E 2 15 13 11 5 F G R.DP 3 14 10 LSD8A65-XX-PF 4,6,12,17 L.DP 7 A B C D E 2 15 13 11 5 F G R.DP 3 14 10 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 3/8 Electrical Connection PIN NO. LSD8A55-XX-PF 1 No Pin 2 Anode 3 Anode LSD8A65-XX-PF 1 No Pin A 2 Cathode A F 3 Cathode F 4 Common Cathode 4 Common Anode 5 Anode E 5 Cathode 6 Common Cathode 6 Common Anode 7 Anode 7 Cathode 8 No Pin 8 No Pin 9 No Pin 9 No Pin 10 Anode R.DP 10 Cathode R.DP 11 Anode D 11 Cathode D 12 Common Cathode 12 Common Anode 13 Anode C 13 Cathode C 14 Anode G 14 Cathode G 15 Anode B 15 Cathode B 16 No Pin 16 No Pin 17 Common Cathode 17 Common Anode 18 No Pin 18 No Pin L.DP E L.DP LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 4/8 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT SR Forward Current Per Chip IF 30 mA Peak Forward Current Per Chip (Duty 1/10,0.1ms Pulse Width) IFP 100 mA Power Dissipation Per Chip PD 100 mW Ir 10 μA Reverse Current Per Any Chip Operating Temperature Topr -25 ~ +85 ℃ Storage Temperature Tstg -25 ~ +85 ℃ Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 ℃ Part Selection And Application Information(Ratings at 25℃) common cathode or anode Material Emitted CHIP PART NO λP (nm) △λ Vf(v) (nm) Iv(mcd) IV-M Min. Typ. Max. Min. Typ. Common Cathode LSD8A55-XX-PF GaAlAs LSD8A65-XX-PF Electrical 660 Red 20 1.5 1.8 Common Anode Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. 2.4 6.1 10.5 2:1 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 5/8 Test Condition For Each Parameter Symbol Unit Test Condition Forward Voltage Per Chip Vf volt If=20mA Luminous Intensity Per Chip Iv mcd If=10mA Peak Wavelength λP nm If=20mA △λ nm If=20mA Ir μA Vr=5V Parameter Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio IV-M LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 6/8 Typical Electro-Optical Characteristics Curve SR CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 2.5 2.0 1.5 1.0 0.5 0.0 0.1 1.0 2.0 3.0 4.0 1.0 5.0 10 1.2 1.1 1.0 0.9 0.8 0 20 40 60 80 100 Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 650 700 Wavelength (nm) 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 Ambient Temperature( ℃) Ambient Temperature( ℃) Relative Intensity@20mA Fig.4 Relative Intensity vs. Temperature Relative Intensity@20mA Normalize @25℃ Forward Voltage@20mA Normalize @25℃ Fig.3 Forward Voltage vs. Temperature -20 1000 Forward Current(mA) Forward Voltage(V) -40 100 750 80 100 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LSD8A5/65-XX-PF Page 7/8 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350° C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260°C 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° C/sec(max) Solder Bath:260°C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260° C Temp(° C) 260° C3sec Max 260° 5° /sec max 120° 25° 0° 0 2° /sec max Preheat 60 Seconds Max 50 100 150 Time(sec) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 8/8 PART NO. LSD8A5/65-XX-PF Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95 % 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. 1.Ta=105 ℃±5 ℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11