DATA SHEET Pb - Ligitek Electronics Co. Ltd.

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
LED SMD
Pb
Lead-Free Parts
LG-150SRF/VY-CT
DATA SHEET
DOC. NO :
QW0905-LG-150SRF/VY-CT
REV.
:
A
DATE
:
07 - Jan - 2010
發行
立碁電子
DCC
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/11
PART NO. LG-150SRF/VY-CT
Features:
1. Package in 8.0mm carrier tape on 7" diameter reel.
2. Compatible with automatic placement equipment.
3. Compatible with infrared and vapor phase reflow solder process.
Descriptions:
1. The LG-150SRF/VY SMD Taping is much smaller than
lead frame type components, thus enable smaller
board size, higher packing density, reduced storage
space and finally smaller equipment to be obtained.
2. Besides, lightweight makes them ideal for miniature
applications. etc.
Applications:
1. Automotive : backlighting in dashboard and switch.
2. Telecommunication : indicator and backlighting in telephone and fax.
3. Flat backlight for LCD, switch and symbol
4. General use.
Device Selection Guide:
PART NO
COLOR
MATERIAL
Emitted
LG-150SRF/VY-CT
AlGaInP
Red
AlGaInP
Yellow
Lens
Water Clear
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/VY-CT
Page 2/11
Package Dimensions
Cathode Mark
1.1
0.5
2
1
Resin
3.2
0.6
2.0
DIE2
Soldering
Terminal
DIE1
0.6
4
3
PCB
0.4
0.6
1.6
2
1
VY
SRF
4
3
Note : 1.All dimension are in millimeter tolerance is ±0.1mm unless otherwise noted.
2.Specifications are subject to change without notice.
Recommended Soldering Pad Dimensions
0.7
0.4
0.7
0.8
1.8
0.8
Note : The tolerances unless mentioned is ±0.1mm,Angle ±0.5. Unit=mm.
0.6
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/11
PART NO. LG-150SRF/VY-CT
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Parameter
Symbol
SRF
VY
UNIT
Power Dissipation
PD
72
78
mW
Peak Forward Current
Duty [email protected]
IFP
90
60
mA
Forward Current
IF
30
30
mA
Reverse Current @5V
Ir
10
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +90
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Items
Luminous Intensity
Peak Wavelength
Symbol
SRF
20
40
----
VY
32
60
----
λP
SRF ----
642
----
----
593
----
λD
SRF ----
630
----
----
590
----
SRF ----
20
----
----
20
----
SRF 1.5
----
2.4
1.7
----
2.6
SRF ----
140
----
----
140
----
VY
Spectral Line Half-Width
△λ
VY
Forward Voltage
VF
VY
2θ 1/2
Viewing Angle
Max. UNIT
Iv
VY
Dominant Wavelength
Min. Typ.
VY
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
CONDITION
mcd
IF=20mA
nm
IF=20mA
nm
IF=20mA
nm
IF=20mA
V
IF=20mA
deg
IF=20mA
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/VY-CT
Page 4/11
Typical Electro-Optical Characteristics Curve
SRF CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
2.0
3.0
4.0
5.0
1.0
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
3.0
Relative [email protected]
Normalize @25 ℃
1.2
Forward [email protected]
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
100
80
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
550
600
650
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Relative [email protected]
100
10
700
Fig.6 Directive Radiation
100
LIGITEK ELECTRONICS CO.,LTD.
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PART NO. LG-150SRF/VY-CT
Page 5/11
Typical Electro-Optical Characteristics Curve
VY CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
1.5
2.5
2.0
3.0
1.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative [email protected]
Normalize @25℃
Forward [email protected]
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
Fig.5 Relative Intensity vs. Wavelength
1.0
0.5
0.0
500
550
600
Wavelength (nm)
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
Ambient Temperature(℃)
Ambient Temperature( ℃)
Relative [email protected]
100
650
Fig.6 Directive Radiation
100
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/VY-CT
Page 6/11
Carrier Tape Dimensions
4.0±0.2
2.0
0.23
1.5
1.75
3.5±0.2
8.0±0.3
5.3
3.38
Polarity
4.0±0.2
1.36
1.76
Note : The tolerances unless mentioned is ±0.1mm,Angle ± 0.5. Unit=mm.
• Packing Specifications
Label
Aluminum Moist-Proof bag
Label
Part No.
Description
Quantity/Reel
LG-150SRF/VY-CT
8.0mm tape,7"reel
3000 devices
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/VY-CT
Page 7/11
Label Explanation
立碁電子工業股份有限公司
LIGITEK LED
LIGITEK ELECTRONICS CO., LTD.
BIN Q : Red Chip Luminous Intensity
Pb
BIN P : Yellow Chip Luminous Intensity
PART NO. : LG-150SRF/VY-CT
HUE 29 : Red Chip Dominant Wavelength
LOT NO. : GSI-670107
Q'TY(PCS) : 3000 PCS
HUE 16 : Yellow Chip Dominant Wavelength
VF:1.6 - 2.4
BIN/HUE : Q/29-P/16
VF:1.8 - 2.6
1.8 - 2.6 : Forward Voltage
Reel Dimensions
0.2
0.4
0.8
0.8
0.6
0.4
0.2
0.6
2.0 ±0.5
178 ±1.5
6.0 ±1.0
9.0 ±1.0
ψ13.5 ±1.0
12.0 ±1.0
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 8/11
PART NO. LG-150SRF/VY-CT
Box Explanation
1. 5 BAG / INNER BOX
2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm
H
W
L
3. 10 INNER BOXES / CARTON
4. CARTON SIZE : L X W X H 49cm X 46cm x 29cm
L
W
H
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 9/11
PART NO. LG-150SRF/VY-CT
Recommended Soldering Conditions
1.
Hand Solder
Basic spec is ≦ 280 ℃ 3 sec one time only.
2. Wave Solder
Soldering heat Max. 260 ℃
245 ±5℃ within 5 sec
Preheat
120 ~ 150 ℃
120 ~ 180 sec
3-1. LEAD Reflow Solder
Temp.
( ℃)
240
Cooling
-5℃/sec
Rising
+5℃ /sec
Preheat
150
120
60 ~ 120 sec
Time
5sec
3-2 PB-Free Reflow Solder
1~5° C/sec
Preheat
180~200° C
1~5° C/sec
260° C MaX.
10sec.Max
Above 220 ° C
60 sec.Max.
120 sec.Max.
Reflow Soldering should not be done more than two times.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LG-150SRF/VY-CT
Page 10/11
Precautions For Use:
Storage time:
1.The operation of Temperatures and RH are : 5 ℃~35 ℃,RH60%.
2.Once the package is opened, the products should be used within a week.
Otherwise, they should be kept in a damp proof box with descanting agent.
Considering the tape life, we suggest our customers to use our products within
a year(from production date).
3.If opened more than one week in an atmosphere 5 ℃ ~ 35 ℃,RH60%,
they should be treated at 60 ℃± 5 ℃fo r 15hrs.
Drive Method:
LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into
the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series
with the LED.
Consider worst case voltage variations than could occur across the current limiting resistor. The forward
current should not be allowed to change by more than 40 % of its desired value.
Circuit model A
Circuit model B
LED
LED
(A) Recommended circuit.
(B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED.
Cleaning:
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED.
ESD(Electrostatic Discharge):
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
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Page 11/11
PART NO. LG-150SRF/VY-CT
Reliability Test:
Classification
Test Item
Test Condition
Reference
Standard
Operating Life Test
1.Ta=Under Room Temperature As Per Data Sheet
Maximum Rating.
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-750D: 1026
MIL-STD-883D: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883D:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃± 5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
High Temperature
High Humidity
Storage Test
1.Ta=65℃± 5℃
2.RH=90%~95%
3.t=1000hrs ±2hrs
Endurance
Test
Thermal Shock Test
Solderability Test
Environmental
Test
Temperature
Cycling
IR Reflow
1.Ta=105 ℃±5℃ &-40 ℃±5℃
(10min)
(10min)
2.total 10 cycles
1.T.Sol=235 ℃±5℃
2.Immersion time 2 ±0.5sec
3.Coverage ≧ 95% of the dipped surface
1.105 ℃ ~ 25 ℃ ~ - 55℃ ~ 25℃
30mins 5mins 30mins 5mins
2.10 Cyeles
1.T=260° C Max. 10sec.Max.
2. 6 Min
MIL-STD-202F:103B
JIS C 7021: B-11
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1011
MIL-STD-202F: 208D
MIL-STD-750D: 2026
MIL-STD-883D: 2003
IEC 68 Part 2-20
JIS C 7021: A-2
MIL-STD-202F: 107D
MIL-STD-750D: 1051
MIL-STD-883D: 1010
JIS C 7021: A-4
MIL-STD-750D:2031.2
J-STD-020