HD74LS242 Quadruple Bus Transceivers (with three-state outputs) REJ03D0461–0300 Rev.3.00 Jul.15.2005 Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation Taping Abbreviation (Quantity) HD74LS242P DILP-14 pin PRDP0014AB-B (DP-14AV) P — HD74LS242FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP EL (2,000 pcs/reel) Note: Please consult the sales office for the above package availability. Pin Arrangement GAB 1 14 VCC NC 2 13 GBA 1A 3 12 NC 2A 4 11 1B 3A 5 10 2B 4A 6 9 3B GND 7 8 4B (Top view) Function Table Control input Data port status GAB GBA A B H H Inverting output Input L H * H L Isolated Isolated L L Input Inverting output Notes: 1. H; high level, L; low level 2. *; Possibly destructive oscillation may occur if the transceivers are enabled in both directions at once. Rev.3.00, Jul.15.2005, page 1 of 6 HD74LS242 Block Diagram GAB Transceiver (1/4) A B GBA Absolute Maximum Ratings Item Symbol Ratings Unit VCC 7 V GAB, GBA VIN 7 V A, B VIN 5.5 V PT 400 mW Tstg –65 to +150 °C Supply voltage Input voltage Power dissipation Storage temperature Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Rev.3.00, Jul.15.2005, page 2 of 6 Symbol Min Typ Max Unit VCC 4.75 5.00 5.25 V IOH — — –15 mA IOL — — 24 mA Topr –20 25 75 °C HD74LS242 Electrical Characteristics (Ta = –20 to +75 °C) Item Input voltage Hysteresis Symbol VIH VIL VT+ – VT– min. 2.0 — 0.2 2.4 2 — — — — — typ.* — — 0.4 — — — — — — — max. — 0.8 — — — 0.4 0.5 40 –200 20 — — –0.2 — — –0.2 — — — — — — –0.2 0.1 0.1 IOS –40 — –225 ICCH ICCL — — — — 22 29 29 — 38 50 50 –1.5 VOH Output voltage VOL Off-state output current IOZH IOZL IIH A Input Input current B Input GAB or GBA A or B GAB or GBA Short-circuit output current Supply current** IIL II Unit V V V V V µA µA Condition VCC = 4.75 V VIL = 0.8 V, IOH = – 3 mA VCC = 4.75 V, V IH = 2 V VIL = 0.5 V, IOH = – 15 mA IOL = 12 mA VCC = 4.75 V, VIH = 2 V, V IL = 0.8 V IOL = 24 mA VO = 2.7 V VCC = 5.25 V, VIH = 2 V, VIL = 0.8 V VO = 0.4 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V, GAB or GBA at GND mA mA VCC = 5.25 V, VI = 0.4 V, GAB or GBA at 4.5 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 5.5 V VCC = 5.25 V, VI = 7 V mA VCC = 5.25 V mA VCC = 5.25 V ICCZ Input clamp voltage VIK V VCC = 4.75 V, IIN = –18 mA Notes: * VCC = 5 V, Ta = 25°C ** With all outputs open, ICC is measured with transceivers enabled in one direction only, or with all transceivers disabled. Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Propagation delay time Symbol tPLH tPHL Output enable time tZL tZH Output disable time tLZ tHZ Rev.3.00, Jul.15.2005, page 3 of 6 min. — — — — — — typ. 9 12 20 15 15 10 max. 14 18 30 23 25 18 Unit Condition CL = 45 pF, RL = 667 Ω ns CL = 5 pF, RL = 667 Ω HD74LS242 Testing Method Test Circuit 4.5 V VCC GAB RL Input P.G. Zout = 50 Ω See function table Output 1B S1 S3 1A 5 kΩ CL S2 GBA Notes: 1. 2. 3. 4. 2A-2B, 3A-3B, 4A-4B are identical to abobe load circuit. CL includes probe and jig capacitance. S3 is a input-output switch. All diodes are 1S2074(H). Waveforms 1 tTLH Input A (or B) 10 % tTHL 90 % 1.3 V 90 % 1.3 V 3V 10 % 0V tPHL tPLH Output B (or A) 1.3 V VOH 1.3 V VOL Note: Input pulse: tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50% Rev.3.00, Jul.15.2005, page 4 of 6 HD74LS242 Waveforms 2 tTHL GAB 90 % 1.3 V tTLH 3V 10 % 0V 3V 90 % 10 % 1.3 V 0V 3V GBA 1.3 V 1.3 V 0V tZL Waveform-a S1 close S2 open ~ 4.5 V ~ Notes: S1 open S2 close 0V tLZ 1.3 V S1, S2 close ~ ~ 1.5 V 0.5 V VOL tZH Waveform-b 3V VOH 1.3 V ~0V ~ tHZ VOL VOH 0.5 V ~ ~ 1.5 V S1, S2 close 1. Input pulse: tTLH ≤ 15 ns, tTHL ≤ 6 ns, PRR = 1 MHz, duty cycle 50% 2. Waveform a is an output by internal conditions like "L" except for the case where an output is disabled by output control. 3. Waveform b is an output by internal conditions like "H" except for the case where an output is disabled by output control. Rev.3.00, Jul.15.2005, page 5 of 6 HD74LS242 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B MASS[Typ.] 0.97g Previous Code DP-14AV D 8 E 14 1 7 b3 Z A1 A Reference Symbol Nom e1 7.62 D 19.2 E 6.3 L A θ bp e Dimension in Millimeters Min e1 A1 0.51 bp 0.40 0.48 JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B *1 Previous Code FP-14DAV D 0.56 c 0.19 θ 0° e 2.29 0.25 0.31 2.54 2.79 15° 2.39 L 2.54 MASS[Typ.] 0.23g NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 7.4 1.30 Z ( Ni/Pd/Au plating ) 20.32 5.06 b3 c Max 8 c HE *2 E bp Index mark Reference Symbol Terminal cross section ( Ni/Pd/Au plating ) 1 Z *3 Nom Max D 10.06 10.5 E 5.50 A2 7 e A1 bp Dimension in Millimeters Min x M 0.00 0.10 0.34 0.40 0.46 0.15 0.20 0.25 7.80 8.00 A L1 0.20 2.20 bp b1 c A c A1 θ y L Detail F 1 θ 0° HE 7.50 e 1.27 x 0.12 y 0.15 1.42 Z L L Rev.3.00, Jul.15.2005, page 6 of 6 8° 0.50 1 0.70 1.15 0.90 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. http://www.renesas.com RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 © 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0