3.0mm x 1.5mm SMD CHIP LED LAMP APL3015SECK SUPER BRIGHT ORANGE Features Description !3.0mmx1.5mm SMT LED, 1.4mm THICKNESS. The Super Bright Orange source color devices are !LOW made with DH InGaAlP on GaAs substrate Light POWER CONSUMPTION. ! WIDE VIEWING ANGLE. ! IDEAL FOR BACKLIGHT AND INDICATOR. ! VARIOUS !INNER Emitting Diode. COLORS AND LENS TYPES AVAILABLE. LENS TYPE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAA8948 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/18/2003 DRAWN: X.T.HU PAGE: 1 OF 4 Selection Guide Par t No . Dic e APL3015SECK Iv (m c d ) @ 20 m A L en s Ty p e SUPER BRIGHT ORANGE (InGaAlP) WATER CLEAR V i ew i n g An g l e Min . Ty p . 2θ1/2 70 30 0 70 ° Un it s Tes t Co n d it io n s Note: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25°°C Sy m b o l Par am et er λpeak Peak Wavelength Super Bright Orange 6 10 nm I F =20mA λD Dominate Wavelength Super Bright Orange 601 nm I F =20mA 29 nm I F =20mA pF VF=0V;f=1MHz 2.5 V I F =20mA 10 uA V R = 5V ∆λ1/2 D ev i c e Ty p . Spectral Line Half-width Super Bright Orange C Capacitance Super Bright Orange 15 VF Forward Voltage Super Bright Orange 2.1 IR Reverse Current Super Bright Orange Max . Absolute Maximum Ratings at T)=25°°C P ar am e t e r Su p er B r ig h t Or an g e Un it s Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 195 mA Reverse Voltage 5 V Operating/Storage Temperature -40°C To +85°C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAA8948 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/18/2003 DRAWN: X.T.HU PAGE: 2 OF 4 Super Bright Orange SPEC NO: DSAA8948 APPROVED : J. Lu APL3015SECK REV NO: V.3 CHECKED :Allen Liu DATE:MAR/18/2003 DRAWN: X.T.HU PAGE: 3 OF 4 APL3015SECK SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAA8948 APPROVED : J. Lu REV NO: V.3 CHECKED :Allen Liu DATE:MAR/18/2003 DRAWN: X.T.HU PAGE: 4 OF 4