Datasheet - Kingbright

2.5X2.0mm SURFACE MOUNT LED LAMP
Part Number: AT2520SE9ZS-350MA
ATTENTION
Reddish-Orange
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Application Note
Static electricity and surge damage the LEDS.
Features
z Dimension: 2.5mmx 2.0mm x 0.8mm.
It is recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
z Low thermal resistance.
z Ceramic package with silicone resin.
z Small package with high efficiency.
z Surface mount technology.
All devices, equipment and machinery must be electrically
grounded.
Typical Applications
z ESD protection.
PDAs
z Package : 2000pcs / reel.
Room lighting
z Moisture sensitivity level : level 2a.
z Soldering methods: IR reflow soldering.
z RoHS compliant.
Architectural lighting
Decorative/pathway lighting
Front panel backlight
Exterior automotive lighting:
(brake lights, turn lights, backlighting)
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4. The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 1 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver plating of
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 2 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
Selection Guide
luminous Intensity [2]
Iv(mcd)@ 350mA
Dice
Part No.
AT2520SE9ZS-350MA
Reddish-Orange (AlGaInP)
Φv (lm) [2]
@ 350mA
Viewing
Angle [1]
Min.
Typ.
Typ.
2 θ 1/2
8000
10500
23
130 °
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
Absolute Maximum Ratings at TA=25°C
Parameter
Symbol
Value
Unit
IF
350
mA
Peak Forward Current [2]
IFM
500
mA
Power dissipation
PD
1.05
W
Reverse Voltage
VR
5
V
Operating Temperature
Top
-40 To +100
°C
Storage Temperature
Tstg
-40 To +120
°C
TJ
120
°C
Rth j-a
95
°C/W
Rth j-s
30
°C/W
8000
V
DC Forward Current [1]
Junction temperature[1]
Thermal resistance [1]
(Junction/ambient)
Thermal resistance [1] (Junction/solder point)
Electrostatic Discharge Threshold (HBM)
Notes:
1. Results from mounting on metal core PCB,mounted on pc board-metal core PCB is recommend.for lowest thermal resistance.
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
Electrical / Optical Characteristics at TA = 25°C
Parameter
Symbol
Forward Voltage IF = 350mA [Min.]
Value
Unit
2.0
VF [2]
Forward Voltage IF = 350mA [Typ.]
Forward Voltage IF = 350mA [Max.]
2.5
V
3.0
Allowable Reverse Current [Max.]
IR
85
mA
λ peak
635
nm
λ dom [1]
623
nm
Δλ
22
nm
Temperature coefficient of λ peak
IF = 350mA, - 10 ° C ≤ T ≤ 100 ° C [Typ.]
TC λ peak
0.1
nm/°C
Temperature coefficient of λ dom
IF = 350mA, - 10 ° C ≤ T ≤ 100 ° C [Typ.]
TC λ dom
0.08
nm/°C
Temperature coefficient of VF
IF = 350mA, - 10 ° C ≤ T≤ 100 ° C [Typ.]
TCV
-3.0
mV/°C
Wavelength at peak emission IF = 350mA
Dominant Wavelength IF = 350mA
Spectral bandwidth at 50% Φ
REL MAX
[Typ.]
[Typ.]
IF = 350mA [Typ.]
Notes:
1.Wavelength : + / -1nm.
2. Forward Voltage : + / - 0.1V.
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 3 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
AT2520SE9ZS-350MA
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 4 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 5 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
AT2520SE9ZS-350MA
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Reel Dimension
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications
(Units : mm)
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 6 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004
PACKING & LABEL SPECIFICATIONS
AT2520SE9ZS-350MA
SPEC NO: DSAJ0363
REV NO: V.7
DATE: ARP/12/2011
PAGE: 7 OF 7
APPROVED: WYNEC
CHECKED: Allen Liu
DRAWN: J.Yu
ERP: 1212000004