Prototype ＩＣ内蔵基板 ＳＥＳＵＢ Semiconductor Embedded in SUBstrate（SESUB） The World smallest BLE Module Bluetooth® V4.1 Smart (Low Energy) Single Mode module Features Space saving Ultra small package 3.5mm x 3.5mm x 1.0mm Ultra Low Power consumption Tx : 5mA, Rx : 5mA、 0.9μA(sleep) More freedom for design with antenna separate-layout Best combination with Ultra Small Wireless Charging Coil ※Features of SESUB-PAN-D14580 Major Applications Wearable device, Appcessory Health care, Sports & Fitness devices Home Entertainment, etc. Summary 特性 仕様 実施例 SESUB is TDK’s the state of the art substrate solution for SiP IC wafer is grinded to 50~100um thickness and embedded into resin substrate, and this realize total substrate thickness of 300um Cross sectional view of SESUB SMD can be mounted on SESUB, same as laminate PCB. 300um IC Embedded IＣ SESUB enables the micro-modularization of functional circuitry. SESUB-PAN-T2541 Conventional Bluetooth Module Area Saving : 65% 5.6mm 8.5mm Area Saving : 83% 4.6mm SESUB-PAN-D14580 8.5mm 3.5mm CEATEC2014-08 3.5mm [email protected]