APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 1. Introduction This application note is a guide for migrating to the Macronix MX30UF2G18AC from the Micron® MT29F2G08ABBEA 2Gb, 1.8V, x8, NAND flash memory. The document does not provide detailed information on the individual devices, but highlights the major similarities and differences between them. The comparison covers the general features, performance, command codes and other differences. The information in this document is based on datasheets listed in Section 11. Newer versions of the datasheets may override the contents of this document. 2. Features Both flash device families have similar features and functions as shown in Tables 2-1. Table 2-1: Feature Comparison Feature Macronix MX30UF2G18AC Micron MT29F2G08ABAEA Vcc Voltage Range 1.7V ~ 1.95V 1.7V ~ 1.95V Operating Temperature -40°C ~ 85°C Interface -40°C ~ 85°C ONFI 1.0 Standard ONFI 1.0 Standard Block Size 128KB+4KB 128KB+4KB Bus Width x8 x8 Page Size 2KB+64B 2KB+64B Cache Read/Program Size 2KB+64B 2KB+64B 2 Planes x 1024 Blocks/Plane 2 Planes x 1024 Blocks/Plane 4b/528B N/A 4b/528B Enabled by command Yes Yes 30 pages Block 0 30 pages Block 0 (with 4-bit ECC) (with 1-bit ECC) ONFI standard ONFI standard - Reset (FFh) C2h/AAh/90h/15h/06h 2Ch/AAh/90h/15h/06h ONFI Signature 4Fh/4Eh/46h/49h 4Fh/4Eh/46h/49h Data Retention 10 Years 10 Years 100K Cycles 100K Cycles 48-TSOP (12x20mm) 48-VFBGA (6x8mm) 48-TSOP (12x20mm) 63-VFBGA (9x11mm) Plane Size ECC Requirement Internal ECC Option Block Protection OTP Size Guaranteed Good Blocks at Shipping Unique ID First Command ID Code Endurance Package P/N: AN-0373 1 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC Performance Tables 3-1 and 3-2 show Macronix and Micron NAND flash have similar Read/Write performance. Table 3-1: Read Performance (Read Latency and Sequential Read) Macronix MX30UF2G18AC Micron MT29F2G08ABBEA Read Latency time (tR) 25us (max.) 25us (max.) Sequential Read time (tRC) 25ns (min.) 25ns (min.) Read Function Table 3-2: Write Performance (Program and Erase) Write Function Page Program time (tPROG) Block Erase time (tERASE) Macronix MX30UF2G18AC Micron MT29F2G08ABBEA 320us (typ.) / 600us (max.) 200us (typ.) / 600us (max.) 1ms (typ.) / 3.5ms (max.) 0.7ms (typ.) / 3ms (max.) 4 (max.) 4 (max.) 100,000 100,000 NOP 1 Write/Erase Cycles* (Endurance) Note: 100K Endurance cycle with ECC protection. 3. DC Characteristics Read/Write power requirements (Table 4-1) and I/O voltage limits (Table 4-2) are similar. Table 4-1: Read / Write Current Sequential Read Current (ICC1) Macronix MX30UF2G18AC 23mA (typ.) / 30mA (max.) Micron MT29F2G08ABBEA 13mA (typ.) / 20mA (max.) Program Current (ICC2) 23mA (typ.) / 30mA (max.) 10mA (typ.) / 20mA (max.) Erase Current (ICC3) 15mA (typ.) / 30mA (max.) 10mA (typ.) / 20mA (max.) Standby Current – CMOS 10uA (typ.) / 50uA (max.) 10uA (typ.) / 50uA (max.) Macronix MX30UF2G18AC Micron MT29F2G08ABBEA Input Low Voltage (VIL) -0.3V (min.) / 0.2VCC (max.) -0.3V (min.) / 0.2Vcc (max.) Input High Voltage (VIH) 0.8VCC (min.) / VCC+0.3V (max.) 0.8Vcc (min.) / Vcc+0.3V (max.) Output Low Voltage (VOL) 0.1V (max.) 0.1V (max.) Output High Voltage (VOH) VCC-0.1 (min.) VCC-0.1 (min.) DC Characteristic Table 4-2: Input / Output Voltage DC Characteristic P/N: AN-0373 2 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 5. Package Pin/Ball Definition The Micron MT29F2G08ABBEA can be replaced by the Macronix MX30UF2G18AC without pin conflicts. The 48-TSOP pin #38 is designated “PT” which is a Chip Protection function on the MX30UF2G18AC-TI, and on the MT29F2G08ABBEA it is designated as “LOCK” with a similar function. If this pin has been left floating or is driven low, then there is no issue as the Macronix PT pin has a weak internal pull down. This is true for the Macronix 63-VFBGA PT ball E3, and Micron LOCK ball G5 as well. Tables 5-1 and 5-2 show differences in pin assignments between the Macronix and Micron devices. The 48-TSOP Package physical dimensions are similar to each other. Figure 5-1: 48-TSOP (12x20mm) Package and Pin Layout Comparison (x8) NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MX30UF2G18AC-TI 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 NC NC NC IO7 IO6 IO5 IO4 NC VCC*1 PT VCC VSS NC VCC*1 NC IO3 IO2 IO1 IO0 NC NC NC VSS*1 NC NC NC NC NC NC R/B# RE# CE# NC NC VCC VSS NC NC CLE ALE WE# WP# NC NC NC NC NC Pin38: PT Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 MT29F2G08ABBEAWP 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 VSS*1 DNU NC NC I/O7 I/O6 I/O5 I/O4 NC VCC*1 LOCK VCC VSS NC VCC*1 NC I/O3 I/O2 I/O1 IO0 NC NC NC VSS*1 Pin38: DNU Pin47: DNU Table 5-1: 48-TSOP Package Pin Definition Brand Macronix Micron Part Name MX30UF2G18AC-TI MT29F2G08ABBEAWP #38 pin PT*1 LOCK #47 pin NC DNU Note Pin functions are compatible. If pins are left unconnected, both pin functions are compatible Note: PT pin has internal weak pull low. It enables the protection function if active. Please refer to the datasheet for more details. P/N: AN-0373 3 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC The 6x8mm 48-VFBGA and 9x11mm 63-VFBGA pinouts and ball pitch are compatible. The ball diameter of the Macronix 48-VFBGA is 0.40mm, which is smaller than Micron’s 0.45mm ball used on the 63-VFBGA. For detailed information, please refer to the individual datasheets. Figure 5-2: 48-VFBGA vs 63-VFBGA Package and Ball Layout Comparison MX30UF2G18AC-XQI (6 x 8 x 1 mm) 1 2 3 4 5 MT29F2G08ABBEAH4 (9 x 11 x 1 mm) 6 1 2 A NC NC B NC 3 4 5 6 7 8 A WP# ALE VSS CE# WE# R/B# C WP# ALE VSS CE# WE# R/B# B NC RE# CLE NC NC NC D VCC *1 RE# CLE NC NC NC C NC NC NC NC NC NC E NC NC NC NC NC NC D NC NC NC NC NC NC F NC NC NC NC VSS *1 NC E NC NC PT NC NC NC G DNU VCC *1 LOCK NC NC DNU F NC IO0 NC NC NC VCC H NC I/O0 NC NC NC Vcc G NC IO1 NC VCC IO5 IO7 J NC I/O1 NC Vcc I/O5 I/O7 H VSS IO2 IO3 IO4 IO6 VSS K Vss I/O2 I/O3 I/O4 I/O6 Vss 9 10 NC NC NC NC L NC NC NC NC M NC NC NC NC E3: PT G3: DNU G5: LOCK G8: DNU Note: 1. These pins might not be connected internally. However it is recommended to connect these pins to power(or ground) as designated for ONFI compatibility. Table 5-2: 63-VFBGA Package Ball Definition Macronix Micron MX30UF2G18AC-XQI MT29F2G08ABBEAH4 ball E3 = PT*1 ball G5 = LOCK Note Pin functions are compatible. balls E1 and E6 = NC balls G3 and G8 = DNU If pins are left unconnected, both pin functions are compatible Note: PT pin has internal weak pull low. It enables the protection function if active. Please refer to the datasheet for more details. P/N: AN-0373 4 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 6. Command Set Basic command sets and status checking methods are similar (Table 6-1 and 6-2). Micron offers additional non-ONFI two plane commands, as well as a few commands used for block protection which are not listed in Table 6-2 (see datasheet for details). Table 6-1: Command Table Macronix MX30UF2G18AC 1st Cycle 2nd Cycle 85h 05h E0h 00h 31h 00h 30h 3Fh 90h FFh 80h 10h 80h 15h 60h D0h 70h ECh EDh EFh EEh 78h 7Ah Micron MT29F2G08ABBEA 1st Cycle 2nd Cycle 85h 05h E0h 00h 31h 00h 30h 3Fh 90h FFh 80h 10h 80h 15h 60h D0h 70h ECh EDh EFh EEh 78h 7Ah Table 6-2: Two-Plane Command Table Macronix MX30UF2G18AC Command 1st 2nd 3rd 4th Micron MT29F2G08ABBEA Command Random Data Input Random Data Output Cache Read Begin Read Mode Cache Read End Read ID Reset Page Program Cache Program Block Erase Read Status Read Parameter Page Unique ID Read Set Feature Get Feature Status Enhance Read Block Protection Status Read ONFI 2 Plane Program ONFI 2 Plane Cache Program ONFI 2 Plane Block Erase P/N: AN-0373 Cycle Cycle Cycle Cycle 1st Cycle 2nd Cycle 3rd Cycle 4th Cycle 80h 80h 60h 11h 11h D1h 80h 80h 60h 10h 15h D0h 80h 80h 60h 11h 11h D1h 80h 80h 60h 10h 15h D0h 5 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 6-2 Status Register When a flash Read, Program, or Erase operation is in progress, either the “Ready/Busy# Pin Checking” or “Status Output Checking” method may be used to monitor the operation. Both are standard NAND flash algorithms and can be used for both device families. Table 6-3 shows that Status Output content provided by the Read Status command (70h) is compatible. Table 6-4 shows that Two–plane Status provided by the Status Enhance Read command (78h) is compatible. If internal ECC is enabled in the Micron device, SR[3] indicates that up to 4-bits have been corrected and that the page should be rewritten. This function is not needed for the Macronix device, as it does not support internal ECC generation. Macronix also provides an internal ECC (or ECC Free) part with a different part number. Table 6-3: Status Output Status Output Macronix MX30UF2G18AC SR[0] PGM/ERS/RAD status: Pass/Fail Micron MT29F2G08ABBEA PGM/ERS/READ status: Pass/Fail SR[1] Cache Program status: Pass/Fail Cache Program status: Pass/Fail SR[2] Reserved Reserved SR[3] Reserved Rewrite Recommended SR[4] SR[6] Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[5] Table 6-4: Two-plane Status Output Status Output Macronix MX30UF2G18AC Micron MT29F2G08ABBEA Selected Plane PGM/ERS/READ SR[2] Selected Plane PGM/ERS/READ status: Pass/Fail Selected Plane Cache Program status: Pass/Fail Reserved status: Pass/Fail Selected Plane Cache Program status: Pass/Fail Reserved SR[3] Reserved Reserved SR[4] SR[6] Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy Reserved PGM/ERS/Read internal controller: Ready/Busy PGM/ERS/Read status: Ready/Busy SR[7] Write Protect Write Protect SR[0] SR[1] SR[5] P/N: AN-0373 6 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 7. Read ID Command The ID codes of the MT29F2G08ABBEA and MX30UF2G18AC are identical except for the first byte which indicates the Manufacturer (Table 7-1). The same command set is used to read both IDs. Table 7-1: Manufacturer and Device IDs ID code Macronix MX30UF2G18AC C2h/AAh/90h/15h/06h 2Ch/AAh/90h/15h/06h Manufacturer Code Manufacturer Code Device Identifier Device Identifier bit 1- 0 Number of Die per Chip Enable Number of Die per Chip Enable bit 3 - 2 Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Cell Structure Number of Simultaneously Programmed Pages Interleaved Programming Between Multiple Chips Cache Program Page Size (exclude Spare Area) Page Size (exclude Spare Area) Size of Spare Area (Byte per 512Byte) Size of Spare Area (Byte per 512Byte) bit 7, 3 Sequential Read Cycle Time (tRC) Serial Access Time (tRC) bit 5 - 4 Block Size (exclude Spare Area) Block Size (exclude Spare Area) Organization Organization bit 1- 0 ECC Level Requirement ECC Level Requirement bit 3 - 2 Number of Plane per CE Number of Plane per CE bit 6 - 4 Plane Size Plane Size bit 7 Reserved Internal ECC Enabled/Disabled Value 1st Byte nd 2 Byte rd 3 Byte bit 5 - 4 bit 6 bit 7 bit 1- 0 bit 2 4th Byte bit 6 5th Byte Micron MT29F2G08ABBEA P/N: AN-0373 7 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 8. Power-Up Timing Macronix and Micron® power-up sequences are similar, but the timing is slightly different. Although both devices use 1.7V (VCC min.) as the start point, timing references are different. Check the system timing to determine if adjustments are needed. Table 8-1: Power-Up Timing H/W Timing Characteristic Vcc (min.) to WE# low Vcc (min.) to R/B# high Vcc (min.) to R/B# low Vcc ramp start to R/B# low Macronix MX30UF2G18AC 1ms (max.)*1 N/A 10us (max.) N/A Micron MT29F2G08ABBEA N/A 100us (max.) 10us (max.) 50us (min.) Note: Micron requires Reset command as first command, but Macronix does not. Macronix requires an initialization delay during power on. Vcc(min.) VCC WE# R/B# Figure 8-1: Power-Up Timing P/N: AN-0373 8 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 9. Block Protection Both NAND flash have the ability to Hardware Write Protect the entire array if the WP# pin is low. Both flashes also have the ability to lock contiguous groups of blocks, but the methods are different. Micron uses their LOCK pin to enable the Block Protect commands at power up, which can be used to define an address range of blocks to be protected. Similarly, Macronix uses the PT pin (if high at power-up) to enable BP (Block Protect) bits. If enabled, the entire array comes up protected by volatile BP bits. The BP bits can be changed to protect or unprotect different regions of the memory array using the “Set Feature” cmd = EFh with Feature Adr = A0h and the data value of the BP bit setting. Additionally, we can lock the BP bits by setting the “SP” Solid Protect Bit = 1. Once the SP bit has been set, the only way to unlock the BP bits, is with the next power cycle. The SP bit can be set = 1, with the same method used to set the BP bits, using Set Feature command EFh with feature adr = A0h+data. To verify the Sub-Feature data is set correctly, we can read the data value with the Get Feature cmd = EEh + Feature Adr A0h (to read BP bit setting). We can check if a block is protected or if the SP bit is set, using the “Block Protect Status Read” cmd = 7Ah + Block Address. 10. Summary Macronix MX30UF2G18AC and Micron® MT29F2G08ABBEA NAND share the same basic Read, Program, and Erase commands, have similar features and pinouts, have the same Page, Block, Spare Area size, both require 4bit ECC, and are both ONFI 1.0 compatible. Overall, device migration may require minimal or no firmware modifications. If the Micron internal ECC generation function is required, Macronix may offer this function as well, in a different part number (please contact Macronix sales). 11. References Table 11-1 shows the datasheet versions used for comparison in this application note. For the most current, detailed Macronix specification, please refer to the Macronix website at http://www.macronix.com Table 11-1: Datasheet Version Datasheet Location MX30UF2G18AC MT29F2G08ABBEA Date Issue Jan. 15, 2015 Oct. 2012 Website - Revision Rev. 0.00 Rev. O Note: Macronix data sheet is subject to change without notice. P/N: AN-0373 9 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC 12. Appendix Cross Reference Table 12-1 shows basic part number and package information for the Macronix MX30UF2G18AC and Micron® MT29F2G08ABBEA products. Table 12-1: Part Number Cross Reference Macronix Part No. Micron Part No. Package Dimension 12x20mm Micron 63-VFBGA= 9x11mm Macronix 48-VFBGA = 6x8mm MX30UF2G18AC-TI MT29F2G08ABBEAWP 48-TSOP MX30UF2G18AC-XQI MT29F2G08ABBEAH4 VFBGA 13. Revision History Revision Description 1.0 Initial Release P/N: AN-0373 Date Mar. 14, 2015 10 Ver.1, Mar.14, 2015 APPLICATION NOTE Replacing Micron MT29F2G08ABBEA with Macronix MX30UF2G18AC Except for customized products which have been expressly identified in the applicable agreement, Macronix's products are designed, developed, and/or manufactured for ordinary business, industrial, personal, and/or household applications only, and not for use in any applications which may, directly or indirectly, cause death, personal injury, or severe property damages. In the event Macronix products are used in contradicted to their target usage above, the buyer shall take any and all actions to ensure said Macronix's product qualified for its actual use in accordance with the applicable laws and regulations; and Macronix as well as it’s suppliers and/or distributors shall be released from any and all liability arisen therefrom. Copyright© Macronix International Co., Ltd. 2015. All rights reserved, including the trademarks and tradename thereof, such as Macronix, MXIC, MXIC Logo, MX Logo, Integrated Solutions Provider, NBit, Nbit, NBiit, Macronix NBit, eLiteFlash, HybridNVM, HybridFlash, XtraROM, Phines, KH Logo, BE-SONOS, KSMC, Kingtech, MXSMIO, Macronix vEE, Macronix MAP, Rich Au-dio, Rich Book, Rich TV, and FitCAM. The names and brands of third party referred thereto (if any) are for identification purposes only. For the contact and order information, please visit Macronix’s Web site at: http://www.macronix.com P/N: AN-0373 11 Ver.1, Mar.14, 2015