DA9278.004 11 November, 2010 MAS9278 IC for 10.00 – 30.00 MHz VCXO • • • • • • • • Low Power Wide Supply Voltage Range True Sine Wave Output Very High Level of Integration Integrated Varactor Electrically Trimmable Very Low Phase Noise Low Cost DESCRIPTION The MAS9278 is an integrated circuit well suited to build VCXO for mobile communication. The crystal offset trimming is done through a serial bus and the calibration information is stored in an internal PROM. FEATURES • • • • • To build a VCXO only one additional component, a crystal, is needed. APPLICATIONS Very small size Minor current draw Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset Programmable Vc sensitivity • • • VCXO for mobile phones VCXO for other telecommunications systems Replacement for TCXO modules BLOCK DIAGRAM VC OUT 2 DA MAS9278 CLK PV Digital VDD 5 2 VSS X1 X2 XO1 1 (5) DA9278.004 11 November, 2010 PIN DESCRIPTION Pin Description Symbol x-coordinate y-coordinate Power Supply Voltage Serial Bus Data Input Serial Bus Clock Input VDD DA CLK 177 435 201 172 1015 1015 Programming Input Voltage Control Input Crystal Oscillator Output Power Supply Ground Crystal/Varactor Oscillator Input Buffer Output PV VC X1 VSS X2 OUT 1042 1012 374 830 817 665 1015 158 158 1008 158 1015 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Symbol Min Max Unit Supply Voltage Input Voltage Power Dissipation Storage Temperature VDD - VSS VIN PMAX TST -0.3 VSS -0.3 6.0 VDD + 0.3 20 150 V V mW o C -55 Note 1) Note: Not valid for programming pin PV. RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operating Temperature Crystal Load Capacitance Symbol VDD ICC TC CL Conditions Min Typ Max Unit 2.7 2.8 0.85 5.5 V mA o C pF Vcc = 2.8 Volt -30 +85 7.0 2 (5) DA9278.004 11 November, 2010 ELECTRICAL CHARACTERISTICS (recommended operation conditions) Parameter Symbol Min Frequency Range fo Voltage Control Range VC Voltage Control Sensitivity Typ Max Unit 10.00 30.00 MHz 0 Vdd Note VCSENS 15..30 ppm/V Output Voltage (10kΩ // 10 pF) Vout 1.0 Vpp Compensation CDAC1 (2 Bit) CX1 C10 C10 + 4.5 pF 2) Compensation CDAC2 (4 Bit) CX2 C20 C20 + 18 pF 3) Startup Time TSTART 2 1) ms Note 1: programmable by DN/DP switches Note 2: typ C10 = 4.5 pF Note 3: typ C20 = 12.5 pF IC OUTLINES DA OUT VSS PV 1182 µm CLK MAS9278 VDD X1 X2 VC Die map reference 1200 µm Note 1: MAS9278 pads are round with 80 µm diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating and pin PV can either be connected to VDD or left floating in VCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. 3 (5) DA9278.004 11 November, 2010 SAMPLES IN SB20 DIL PACKAGE 1 20 VDD 2 19 3 18 CLK 4 17 DA 6 MAS9278 YYWW XXXXX.X X1 5 16 OUT 15 GND X2 7 14 8 13 9 12 PV VC 10 Top marking: YYWW = Year, Week XXXXX.X = Lot number 11 4 (5) DA9278.004 11 November, 2010 ORDERING INFORMATION Product Code Version Package Comments MAS9278ATG1 MAS9278A MAS9278B1TG00 A A B EWS tested wafers 215 µm SMD Package TBD EWS tested wafers 215 µm Larger range of VC sensitivity Larger range of VC sensitivity Smaller range of VC sensitivity See DAE9278 page 4 for definition of versions. Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kutomotie 16 FI-00380 Helsinki, FINLAND Tel. +358 10 835 1100 Fax +358 10 835 1119 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 5 (5)