MPTS Series Polymeric PTC MERITEK Feature and Applications ROHS Compliant & Halogen Free Excellent for high density applications Surface Mount, 0603, 0805, 1206, 1210, 1812, 2920 Faster time to trip than standard SMD devices Lower resistance than standard SMD devices Operation Current: 0.05A ~ 3.0A Maximum Voltage: 6V ~ 60V Temperature Range: -40ºC to 85ºC PART NUMBERING SYSTEM MPTS 0805 L 10 R Meritek Series 0603 0805 Size 1206 1210 1812 2920 Current rating Semi-circular Termination Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23ºC) MPTS0603 Hold Current Trip Current Rated Voltage Max Current Typical Power IH , A IT, A VMAX, VDC IMAX, A MPTS0603L001R 0.01 0.03 60 MPTS0603L002R 0.02 0.06 Part Number Max Time to Trip Resistance Current Time RMIN R1MAX Pd, W A Sec Ω Ω 40 0.5 0.20 1.00 20.00 150.00 60 40 0.5 0.20 1.00 12.00 60.00 28.00 E223037 R50223766 MPTS0603L003R 0.03 0.09 30 40 0.5 0.20 1.00 3.50 MPTS0603L004R 0.04 0.12 24 40 0.5 0.20 1.00 4.00 40.00 MPTS0603L005R 0.05 0.15 15 40 0.5 0.50 0.10 3.80 30.00 ● ● MPTS0603L010R 0.10 0.25 15 40 0.5 0.70 0.10 0.90 8.00 MPTS0603L012R 0.12 0.30 9 40 0.5 0.80 0.10 1.10 5.80 ● ● ● ● MPTS0603L016R 0.16 0.40 9 40 0.5 1.00 0.10 1.00 4.20 ● ● MPTS0603L020R 0.20 0.45 9 40 0.5 2.00 0.10 0.55 3.50 ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0603 Part Number A B C D E MPTS0603L001R Min 1.40 Max 1.80 Min 0.45 Max 1.00 Min 0.35 Max 0.75 Min 0.10 Max 0.50 Min 0.08 Max 0.40 MPTS0603L002R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L003R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L004R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L005R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L010R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L012R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L016R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 MPTS0603L020R 1.40 1.80 0.45 1.00 0.35 0.75 0.10 0.50 0.08 0.40 Rev. 7b Polymeric PTC MPTS Series MERITEK Thermal Derating Curve Typical Time-To-Trip at 23ºC A = MPTS0603L001R B = MPTS0603L002R C = MPTS0603L003R D = MPTS0603L004R E = MPTS0603L005R F = MPTS0603L010R G = MPTS0603L012R H = MPTS0603L016R I = MPTS0603L020R Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS0603 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Device A Nominal B Nominal C Nominal All 0603 Series 0.80 0.60 0.80 Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23ºC) MPTS0805 Rated Max Voltage Current Typical Power Max Time to Trip Resistance Hold Current Trip Current Current Time RMIN R1MAX IH , A IT, A VMAX, VDC IMAX, A Pd, W Amp Sec Ω Ω MPTS0805L010R 0.10 0.30 15 100 0.5 0.50 1.50 0.700 6.000 E223037 ● R50223766 ● MPTS0805L020R 0.20 0.50 9 100 0.5 8.00 0.02 0.400 3.500 ● ● MPTS0805L035R 0.35 0.75 6 100 0.5 8.00 0.10 0.250 1.200 ● ● MPTS0805L050R 0.50 1.00 6 100 0.5 8.00 0.10 0.150 0.850 ● ● MPTS0805L050-9R 0.50 1.00 9 100 0.5 8.00 0.10 0.150 0.850 MPTS0805L075R 0.75 1.50 6 40 0.6 8.00 0.20 0.090 0.350 ● ● MPTS0805L100R 1.00 1.95 6 40 0.6 8.00 0.30 0.060 0.210 ● ● Part Number IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS0805 Part Number Min Max Min Max Min Max Min Max Min Max MPTS0805L010R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 MPTS0805L020R 2.00 2.30 1.20 1.50 0.55 1.00 0.20 0.60 0.10 0.45 MPTS0805L035R 2.00 2.30 1.20 1.50 0.45 0.75 0.20 0.60 0.10 0.45 MPTS0805L050R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 MPTS0805L050-9R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 MPTS0805L075R 2.00 2.30 1.20 1.50 0.55 1.25 0.20 0.60 0.10 0.45 MPTS0805L100R 2.00 2.30 1.20 1.50 0.75 1.80 0.20 0.60 0.10 0.45 A B C D E Rev. 7b MPTS Series Polymeric PTC MERITEK Thermal Derating Curve Typical Time-To-Trip at 23ºC A 100 B C D E F 10 Time-to-trip (S) A =MPTS0805L010R B =MPTS0805L020R C =MPTS0805L035R D =MPTS0805L050R E =MPTS0805L075R F =MPTS0805L100R 1 0.1 0.01 0.1 1 10 Fault current (A) Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS0805 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Device A Nominal B Nominal C Nominal All 0805 Series 1.20 1.00 1.50 Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : 217 ℃ 60-150 seconds 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23º) MPTS1206 Part Number Hold Trip Rated Max Current Current Voltage Current IH , A IT, A VMAX, VDC MPTS1206L005R 0.05 0.15 60 MPTS1206L010R 0.10 0.25 MPTS1206L012R 0.12 0.39 MPTS1206L016R 0.16 MPTS1206L020R Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX E223037 R50223766 50.00 ● ● 1.60 15.00 ● ● 1.40 6.50 ● ● 0.30 1.10 5.00 ● ● 8.00 0.10 0.600 2.500 ● ● 0.6 8.00 0.08 0.550 2.300 ● ● 0.6 8.00 0.08 0.550 2.300 16 100 100 0.4 8.00 0.10 0.300 1.200 ● ● 1.200 IMAX, A Pd, W Amp Sec Ω Ω 0.4 0.25 1.50 3.60 60 100 100 0.4 0.50 1.00 48 100 0.6 1.00 0.20 0.45 48 100 0.6 1.00 0.20 0.40 30 100 0.4 MPTS1206L025R 0.25 0.50 16 100 MPTS1206L025-24R 0.25 0.50 24 MPTS1206L035R 0.35 0.75 MPTS1206L035-30R 0.35 0.75 30 100 0.6 8.00 0.10 0.300 MPTS1206L050R 0.50 1.00 8 100 0.4 8.00 0.10 0.150 0.700 ● ● MPTS1206L050-24R 0.50 1.00 24 100 0.6 8.00 0.10 0.150 0.750 ● ● MPTS1206L075-8R 0.75 1.50 8 100 0.6 8.00 0.20 0.090 0.290 ● ● MPTS1206L075-16R 0.75 1.50 16 100 0.6 8.00 0.20 0.090 0.290 ● ● MPTS1206L100R 1.00 1.80 6 100 0.6 8.00 0.30 0.055 0.210 ● ● ● MPTS1206L110-8R 1.10 2.20 8 100 0.8 8.00 0.30 0.040 0.180 ● MPTS1206L150-8R 1.50 3.00 8 100 0.8 8.00 1.00 0.030 0.120 ● ● MPTS1206L200R 2.00 3.50 6 100 0.8 8.00 1.50 0.018 0.080 ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. VMAX=Maximum voltage device can withstand without damage at its rated current (I MAX) IMAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev. 7b MPTS Series Polymeric PTC MERITEK Product Dimensions (Millimeters) MPTS1206 Part Number Min Max Min Max Min Max Min Max Min Max MPTS1206L005R 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 MPTS1206L010R 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 MPTS1206L012R 3.00 3.50 1.50 1.80 0.45 0.85 0.10 0.75 0.10 0.45 MPTS1206L016R 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 MPTS1206L020R 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 MPTS1206L025R 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 MPTS1206L025-24R 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 MPTS1206L035R 3.00 3.50 1.50 1.80 0.45 0.75 0.10 0.75 0.10 0.45 MPTS1206L035-30R 3.00 3.50 1.50 1.80 0.90 1.30 0.25 0.75 0.10 0.45 MPTS1206L050R 3.00 3.50 1.50 1.80 0.25 0.55 0.10 0.75 0.10 0.45 A B C D E MPTS1206L050-24R 3.00 3.50 1.50 1.80 0.90 1.30 0.25 0.75 0.10 0.45 MPTS1206L075-8R 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45 MPTS1206L075-16R 3.00 3.50 1.50 1.80 0.45 1.25 0.25 0.75 0.10 0.45 MPTS1206L100R 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45 MPTS1206L110-8R 3.00 3.50 1.50 1.80 0.45 1.00 0.25 0.75 0.10 0.45 MPTS1206L150-8R 3.00 3.50 1.50 1.80 0.80 1.40 0.25 0.75 0.10 0.45 MPTS1206L200R 3.00 3.50 1.50 1.80 0.85 1.60 0.25 0.75 0.10 0.45 Rev. 7b MPTS Series Polymeric PTC MERITEK Thermal Derating Curve Typical Time-To-Trip at 23º A B C DE F G H I J KL 100 Time-to-trip (S) Z= MPTS1206L005R A= MPTS1206L010R B= MPTS1206L012R C= MPTS1206L016R D= MPTS1206L020R E= MPTS1206L025R / MPTS1206L025-24R F= MPTS1206L035R / MPTS1206L035-30R G= MPTS1206L050R MPTS1206L050-24R H= MPTS1206L075-8R MPTS1206L075-16R I= MPTS1206L100R J= MPTS1206L110-8R K= MPTS1206L150-8R L= MPTS1206L200R 10 1 Z 0.1 0.01 0.1 1 10 100 Fault current (A) Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1206 device Pad dimensions (millimeters) Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Device A Nominal B Nominal All 1206 Series 2.00 1.00 Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) Time (tL) 217 ℃ 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 1.90 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage together components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23º) MPTS1210 Hold Trip Rated Current Current Voltage Part Number Max Current Typical Power IMAX, A Max Time to Trip Resistance Current Time RMIN R1MAX Pd, W Amp Sec Ω Ω IH , A IT, A MPTS1210L005R 0.05 0.15 VMAX, VDC 60 100 0.60 0.25 1.50 3.600 MPTS1210L010R 0.10 0.25 60 100 0.60 0.50 1.50 1.600 MPTS1210L020R 0.20 0.40 30 100 0.60 8.00 0.02 MPTS1210L035R 0.35 0.70 16 100 0.60 8.00 MPTS1210L050R 0.50 1.00 16 100 0.60 MPTS1210L075R 0.75 1.50 8 100 MPTS1210L075-24R 0.75 1.50 24 MPTS1210L110R 1.10 2.20 MPTS1210L150R 1.50 MPTS1210L175R 1.75 MPTS1210L200R 2.00 E223037 R50223766 50.000 ● ● 15.000 ● ● 0.800 5.000 ● ● 0.20 0.320 1.300 ● ● 8.00 0.10 0.250 0.900 ● ● 0.60 8.00 0.10 0.130 0.400 ● ● 100 0.60 8.00 0.10 0.130 0.400 8 100 0.80 8.00 0.30 0.060 0.210 ● ● 3.00 6 100 0.80 8.00 0.50 0.040 0.110 ● ● 4.00 6 100 0.80 8.00 0.60 0.020 0.080 ● ● 4.00 6 100 0.80 8.00 1.00 0.015 0.070 ● ● IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Product Dimensions (Millimeters) MPTS1210 Part Number Min Max Min Max Min Max Min Max Min Max MPTS1210L005R 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 MPTS1210L010R 3.00 3.43 2.35 2.80 0.60 1.15 0.25 0.75 0.10 0.45 MPTS1210L020R 3.00 3.43 2.35 2.80 0.40 0.85 0.25 0.75 0.10 0.45 MPTS1210L035R 3.00 3.43 2.35 2.80 0.40 0.80 0.25 0.75 0.10 0.45 MPTS1210L050R 3.00 3.43 2.35 2.80 0.30 0.75 0.25 0.75 0.10 0.45 MPTS1210L075R 3.00 3.43 2.35 2.80 0.30 0.70 0.25 0.75 0.10 0.45 MPTS1210L075-24R 3.00 3.43 2.35 2.80 0.90 1.30 0.25 0.75 0.10 0.45 A B C D E MPTS1210L110R 3.00 3.43 2.35 2.80 0.60 1.00 0.25 0.75 0.10 0.45 MPTS1210L150R 3.00 3.43 2.35 2.80 0.50 0.90 0.25 0.75 0.10 0.45 MPTS1210L175R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 MPTS1210L200R 3.00 3.43 2.35 2.80 0.80 1.40 0.25 0.75 0.10 0.45 Rev. 7b MPTS Series Polymeric PTC MERITEK Thermal Derating Curve Typical Time-To-Trip at 23ºC B C D E F G H I J 100 10 Time-to-trip (S) A = MPTS1210L005R B = MPTS1210L010R C = MPTS1210L020R D = MPTS1210L035R E = MPTS1210L050R F = MPTS1210L075R MPTS1210L075-24R G = MPTS1210L110R H = MPTS1210L150R I = MPTS1210L175R J = MPTS1210L200R A A 1 0.1 0.01 0.001 0.1 1 10 100 Fault Current (A) Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1210 device Pad dimensions (millimeters) B A Device Nominal Nominal All 1210 Series 2.00 1.00 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) 217 ℃ Time (tL) 60-150 seconds Peak/Classification Temperature(Tp) : 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 2.80 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23º) MPTS1812 Part Number Hold Trip Rated Max Current Current Voltage Current Typical Power Max Time to Trip Resistance Current Time RMIN R1MAX E223037 R50223766 15.00 ● ● 6.500 ● ● 5.000 ● ● 0.800 5.000 ● 0.200 1.750 IH , A IT, A VMAX, VDC IMAX, A Pd, W Amp Sec Ω Ω MPTS1812L010R 0.10 0.30 60 100 0.8 8.0 0.020 1.600 MPTS1812L014R 0.14 0.30 60 100 0.8 8.0 0.008 1.200 MPTS1812L020R 0.20 0.40 30 100 0.8 8.0 0.020 0.800 MPTS1812L020-60R 0.20 0.40 60 40 0.8 8.0 0.020 MPTS1812L030R 0.30 0.60 30 100 0.8 8.0 0.100 MPTS1812L035R 0.35 0.70 16 40 0.8 8.0 0.100 0.320 1.500 ● MPTS1812L035-30R 0.35 0.70 30 100 0.8 8.0 0.100 0.320 1.500 ● ● MPTS1812L050R 0.50 1.00 16 100 0.8 8.0 0.150 0.150 1.000 ● MPTS1812L050-30R 0.50 1.00 30 100 0.8 8.0 0.150 0.150 1.000 ● MPTS1812L075R 0.75 1.50 16 100 0.8 8.0 0.200 0.110 0.450 ● ● MPTS1812L075-24R 0.75 1.50 24 40 1.0 8.0 0.200 0.110 0.290 ● ● MPTS1812L075-33R 0.75 1.50 33 40 1.0 8.0 0.200 0.110 0.400 ● ● 0.210 ● ● ● MPTS1812L110R 1.10 2.20 8 100 0.8 8.0 0.300 0.040 MPTS1812L110-16R 1.10 2.20 16 100 0.8 8.0 0.500 0.040 0.180 ● ● MPTS1812L110-24R 1.10 2.20 24 1.0 8.0 0.500 0.060 0.200 ● ● 0.8 8.0 0.400 0.050 0.140 ● ● 0.8 8.0 0.500 0.040 0.180 ● MPTS1812L125R 1.25 2.50 6 100 100 MPTS1812L125-16R 1.25 2.50 16 100 MPTS1812L150R 1.50 3.00 8 100 0.8 8.0 0.500 0.040 0.110 ● ● 1.0 0.500 0.040 0.110 ● ● ● MPTS1812L150-12R 1.50 3.00 12 100 MPTS1812L150-24R 1.50 3.00 24 100 1.0 8.0 8.0 1.500 0.040 0.120 ● MPTS1812L160R 1.60 3.20 8 100 0.8 8.0 0.500 0.030 0.100 ● ● MPTS1812L160-12R 1.60 3.20 12 100 1.0 8.0 1.000 0.030 0.100 ● ● MPTS1812L160-16R 1.60 3.20 16 100 1.0 8.0 1.000 0.030 0.100 ● ● MPTS1812L200R 2.00 3.50 8 100 1.0 8.0 2.000 0.020 0.070 ● ● MPTS1812L260-8R 2.60 5.00 8 100 1.0 8.0 2.500 0.015 0.047 ● ● MPTS1812L260-13R 2.60 5.00 13.2 100 1.3 8.0 5.000 0.015 0.050 ● ● MPTS1812L260-16R 2.60 5.00 16 100 1.3 8.0 5.000 0.015 0.050 ● ● 6 100 1.0 8.0 4.000 0.012 0.040 ● ● MPTS1812L300R 3.00 5.00 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev. 7b MPTS Series Polymeric PTC MERITEK Product Dimensions (Millimeters) MPTS1812 A B C D E Part Number Min Max Min Max Min Max Min Max Min Max MPTS1812L010R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L014R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L020R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L020-60R 4.37 4.73 3.07 3.41 0.60 0.90 0.30 0.95 0.25 0.65 MPTS1812L030R 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65 MPTS1812L035R 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65 MPTS1812L035-30R 4.37 4.73 3.07 3.41 0.40 0.70 0.30 0.95 0.25 0.65 MPTS1812L050R 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 MPTS1812L050-30R 4.37 4.73 3.07 3.41 0.45 0.75 0.30 0.95 0.25 0.65 MPTS1812L075R 4.37 4.73 3.07 3.41 0.35 0.65 0.30 0.95 0.25 0.65 MPTS1812L075-24R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L075-33R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L110R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L110-16R 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 MPTS1812L110-24R 4.37 4.73 3.07 3.41 0.80 1.30 0.25 0.95 0.25 0.65 MPTS1812L125R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L125-16R 4.37 4.73 3.07 3.41 0.50 1.00 0.30 0.95 0.25 0.65 MPTS1812L150R 4.37 4.73 3.07 3.41 0.25 0.55 0.30 0.95 0.25 0.65 MPTS1812L150-12R 4.37 4.73 3.07 3.41 0.60 1.10 0.25 0.95 0.25 0.65 MPTS1812L150-24R 4.37 4.73 3.07 3.41 0.60 1.55 0.25 0.95 0.25 0.65 MPTS1812L160R 4.37 4.73 3.07 3.41 0.25 0.90 0.30 0.95 0.25 0.65 MPTS1812L160-12R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 MPTS1812L160-16R 4.37 4.73 3.07 3.41 0.60 1.35 0.25 0.95 0.25 0.65 MPTS1812L200R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 MPTS1812L260-8R 4.37 4.73 3.07 3.41 0.55 1.20 0.25 0.95 0.25 0.65 MPTS1812L260-13R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L260-16R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 MPTS1812L300R 4.37 4.73 3.07 3.41 0.80 1.55 0.25 0.95 0.25 0.65 Rev. 7b Polymeric PTC MPTS Series MERITEK Thermal Derating Curve ---- MPTS1812L010R MPTS1812L014R MPTS1812L020R / MPTS1812L020-60R MPTS1812L030R MPTS1812L035R / MPTS1812L035-30R MPTS1812L050R / MPTS1812L050-30R ── MPTS1812L075R MPTS1812L075-24R MPTS1812L075-33R MPTS1812L110R MPTS1812L110-16R MPTS1812L110-24R MPTS1812L125R / MPTS1812L125-16R MPTS1812L150R MPTS1812L150-12R MPTS1812L150-24R MPTS1812L160R MPTS1812L160-12R MPTS1812L160-16R MPTS1812L200R MPTS1812L260-8R MPTS1812L260-13R MPTS1812L260-1R MPTS1812L300R Typical Time-To-Trip at 23ºC A = MPTS1812L010R B = MPTS1812L014R C = MPTS1812L020R / MPTS1812L020-60R D = MPTS1812L030R E = MPTS1812L035R / MPTS1812L035-30R F = MPTS1812L050R MPTS1812L050-30R G = MPTS1812L075R MPTS1812L075-24R MPTS1812L075-33R H = MPTS1812L110R / MPTS1812L110-16R / MPTS1812L110-24R I = MPTS1812L125R MPTS1812L125-16R J = MPTS1812L150R MPTS1812L150-12R MPTS1812L150-24R K = MPTS1812L160R / MPTS1812L160-12R / MPTS1812L160-16R L = MPTS1812L200R M = MPTS1812L260-8R / MPTS1812L260-13R / MPTS1812L260-16R = MPTS1812L300R N Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS1812 device Pad dimensions (millimeters) B A Device Nominal Nominal All 1812 Series 3.45 1.78 Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Time maintained above: Temperature(TL) Time (tL) Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Peak/Classification Temperature(Tp) : 217 ℃ 60-150 seconds 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 3.50 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b MPTS Series Polymeric PTC MERITEK Electrical Characteristics (23ºC) MPTS2920 Max Time to Trip Resistance Hold Current Trip Current Rated Voltage Max Current Typical Power Current Time RMIN R1MAX IH , A IT, A VMAX, VDC IMAX, A Pd, W Amp Sec Ω Ω MPTS2920L030R 0.30 0.60 60 100 1.5 1.5 3.0 1.000 4.800 E223037 ● R50223766 ● MPTS2920L050R 0.50 1.00 60 100 1.5 2.5 4.0 0.300 1.400 ● ● MPTS2920L075R 0.75 1.50 33 100 1.5 8.0 0.3 0.180 1.000 ● ● Part Number MPTS2920L075-60R 0.75 1.50 60 100 1.5 8.0 0.3 0.180 1.000 ● ● MPTS2920L100R 1.10 2.20 33 100 1.5 8.0 0.5 0.090 0.410 ● ● MPTS2920L100-60R 1.10 2.20 60 100 1.5 8.0 0.5 0.090 0.410 ● MPTS2920L125R 1.25 2.50 33 100 1.5 8.0 2.0 0.050 0.250 ● ● MPTS2920L150R 1.50 3.00 33 100 1.5 8.0 2.0 0.050 0.230 ● ● MPTS2920L185R 1.85 3.70 33 100 1.5 8.0 2.5 0.040 0.150 ● ● MPTS2920L200R 2.00 4.00 16 100 1.5 8.0 4.5 0.035 0.120 ● ● MPTS2920L200-24R 2.00 4.00 24 8.0 5.0 0.035 0.120 ● ● 2.50 5.00 16 100 100 1.5 MPTS2920L250R 1.5 8.0 16.0 0.025 0.085 ● ● MPTS2920L260R 2.60 5.20 6 100 1.5 8.0 20.0 0.020 0.075 ● ● 1.5 8.0 25.0 0.010 0.048 ● ● 1.5 8.0 25.0 0.010 0.048 MPTS2920L300R 3.00 5.20 6 100 MPTS2920L300-15R 3.00 5.20 15 100 IH=Hold current-maximum current at which the device will not trip at 23ºC still air. IT=Trip current-minimum current at which the device will always trip at 23ºC still air. V MAX=Maximum voltage device can withstand without damage at its rated current (I MAX) I MAX= Maximum fault current device can withstand without damage at rated voltage (V MAX). Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23ºC still air environment. RMIN=Minimum device resistance at 23ºC prior to tripping. R1MAX=Maximum device resistance at 23ºC measured 1 hour after tripping or reflow soldering of 260ºC for 20 seconds. Termination pad characteristics Termination pad materials: Pure Tin Rev. 7b MPTS Series Polymeric PTC MERITEK Product Dimensions (Millimeters) MPTS2920 Part Number Min Max Min Max Min Max Min Max Min Max MPTS2920L030R 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 MPTS2920L050R 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 A B C D E MPTS2920L075R 6.73 7.98 4.80 5.44 0.40 1.15 0.50 1.20 0.50 0.90 MPTS2920L075-60R 6.73 7.98 4.80 5.44 0.60 1.15 0.50 1.20 0.50 0.90 MPTS2920L100R 6.73 7.98 4.80 5.44 0.40 1.00 0.50 1.20 0.50 0.90 MPTS2920L100-60R 6.73 7.98 4.80 5.44 0.40 1.70 0.50 1.20 0.50 0.90 MPTS2920L125R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 MPTS2920L150R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 MPTS2920L185R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 MPTS2920L200R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 MPTS2920L200-24R 6.73 7.98 4.80 5.44 0.20 0.80 0.50 1.20 0.50 0.90 MPTS2920L250R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 MPTS2920L260R 6.73 7.98 4.80 5.44 0.30 0.90 0.50 1.20 0.50 0.90 MPTS2920L300R 6.73 7.98 4.80 5.44 0.40 0.90 0.50 1.20 0.50 0.90 MPTS2920L300-15R 6.73 7.98 4.80 5.44 0.40 1.15 0.50 1.20 0.50 0.90 Rev. 7b MPTS Series Polymeric PTC MERITEK Thermal Derating Curve ---- MPTS2920L030R MPTS2920L050R MPTS2920L075R MPTS2920L075-60R MPTS2920L100R / MPTS2920L100-60R ── MPTS2920L125R MPTS2920L150R MPTS2920L185R MPTS2920L200R MPTS2920L200-24R MPTS2920L250R MPTS2920L260R MPTS2920L300R MPTS2920L300-15R Typical Time-To-Trip at 23ºC A B C D EFGHIJK 100 10 Time-to-trip (S) A = MPTS2920L030R B = MPTS2920L050R C = MPTS2920L075R / MPTS2920L075-60R D = MPTS2920L100R E = MPTS2920L125R F = MPTS2920L150R G = MPTS2920L185R H = MPTS2920L200R / MPTS2920L200-24R I = MPTS2920L250R J = MPTS2920L260R K= MPTS2920L300R / MPTS2920L300-15R 1 0.1 0.01 0.001 0.1 1 10 100 Fault current (A) Rev. 7b MPTS Series Polymeric PTC MERITEK The dimension in the table below provides the recommended pad layout for each MPTS2920 device Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) Pad dimensions (millimeters) B A Device Nominal Nominal All 2920 Series 5.10 2.30 Pb-Free Assembly 3 ℃/second max. 150 ℃ 200 ℃ 60-180 seconds Time maintained above: Temperature(TL) Time (tL) Peak/Classification Temperature(Tp) : 217 ℃ 60-150 seconds 260 ℃ Time within 5℃ of actual Peak : Temperature (tp) Ramp-Down Rate : Time 25 ℃ to Peak Temperature : 20-40 seconds 6 ℃/second max. 8 minutes max. C Nominal 5.60 Solder reflow Due to “Lead Free” nature, Temperature and Dwell time for the soldering zone is higher than those for Non-compliant parts. This may cause damage to other components. Recommended max solder paste thickness > 0.25mm. Devices can be cleaned using standard methods and aqueous solvent. Rework should utilize standard industry practices. These changes should apply to all notes for each case size. Storage Environment : < 30ºC / 60%RH Caution: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements. Devices are not designed to be wave soldered to the bottom side of the board. Rev. 7b