RENESAS M61110GP

M61110FP/GP
Coil-less VIF/SIF
REJ03F0021-0200Z
Rev.2.0
Mar.12.2004
Description
M61110FP is a semiconductor integrated circuit consisting of VIF/SIF signal processing for CTVs and VCRs.
M61110FP provides low cost and high performance system with the coil-less AFT
Feature
•
•
•
•
•
•
•
•
•
Coil-less AFT
PLL FM demodulation for Audio. No external parts and adjustment. (Target S/N=70dB)
The PLL-SPLIT system provides good sound sensitivity and reduces buzz.
Video output is 2.2Vp-p through EQ AMP
Easy to add Buzz cancel
Hi speed IF AGC
Built-in QIF AGC
Improve over modulation characteristics and Vcc ripple rejection
Open collector RF AGC output (5-9V available).
Application
TV set, VCR tuners.
Recommended Operating Condition (Ta = 25°C, unless otherwise noted)
Supply Voltage Range (Vcc)...............4.75 to 5.25 V
Rated Supply Voltage (Vcc)..............................5.0 V
Pin configuration
1
24
EQ F / B
2
23
IF AGC FILTER
APC FILTER
3
22
RF AGC DELAY
EQ IN
4
21
VIF IN
Vcc
5
20
VIF IN
VCO COIL
6
19
GND
VCO COIL
7
18
AFT OUT
IF AGC FILTER
8
17
RF AGC OUT
VIDEO OUT
9
16
QIF DET IN
15
NFB
M61110FP/GP
EQ OUT
Vreg.OUT
QIF OUT
10
GND
11
14
AUDIO OUT
LIMITER IN
12
13
QIF AGC FILTER
Rev.2.0, Mar.12.2004, page 1 of 19
M61110FP/GP
Block diagram and peripheral circuit
IF IN
Vcc
AF OUT
RF AGC
Delay
24
23
22
AFT
OUT
21
20
RF AGC
OUT
19
18
17
16
15
VIF AMP
IF AGC
14
13
AF AMP
RF AGC
QIF AMP
EQ
AMP
APC
VIDEO
DET
AFT
FM DET
QIF AGC
QIF DET
LIM AMP
REG
VCO
1
2
3
Vreg.
OUT
EQ OUT
4
5
+
6
7
8
9
10
11
12
Vcc
+
VIDEO OUT
4.5MHz Trap
Rev.2.0, Mar.12.2004, page 2 of 19
4.5MHz B.P.F.
M61110FP/GP
Absolute maximum ratings (Ta = 25°C, unless otherwise noted)
Parameter
Symbol
Ratings
Unit
Supply Voltage
Vcc
6.0
V
Power Consumption
Operating Temperature
Pd
Topr
1190(FP), 728(GP)
–20 to +75
mW
°C
Storage Temperature
Tstg
–40 to +150
°C
Allowable power consumption Pd ( mW )
Temperature Characteristics
Note
( maximum ratings )
Mounting in standard circuit board
1750
1500
1250
1190
FP
1000
728
714
750
GP
500
438
250
0
-20
0
25
50
75
100
Ambient temperature Ta ( C )
Rev.2.0, Mar.12.2004, page 3 of 19
125
150
M61110FP/GP
Electrical Characteristics (Vcc=5V, Ta=25°C, unless otherwise noted)
VIF Section
Measurement
Limits
No. Parameter
Symbol
Test
Test Input Input switches set to
Circuit Point Point SG
position 1 unless
otherwise noted
Min
Typ
Max Unit
1
2
Circuit Current
Vreg. Output
Voltage
Icc
Vreg.
1
1
A
TP2
—
—
40
3.2
50
3.5
60
3.8
3
Video Output
Voltage 9
Video Output
Voltage 1
Vo det9
1
TP9
VIF IN SG1
0.85
1.1
1.35 Vp-p
Vo det
1
TP1A VIF IN SG1
1.85
2.2
2.55 Vp-p
5
6
Video S/N
Video Band
Width
Video S/N 1
BW
1
TP1B VIF IN SG2
TP1A VIF IN SG3
51
5.0
56
7.0
—
—
dB
MHz
1
2
7
8
Input Sensitivity VIN MIN 1
Maximum
VIN MAX 1
Allowable
TP1A VIF IN SG4
TP1A VIF IN SG5
—
104
48
110
52
—
dBµ
dBµ
3
4
9
AGC Control
GR
Range Input
IF AGC Voltage V8
1
—
—
—
55
62
—
dB
5
1
TP8
VIF IN SG6
2.8
3.1
3.4
V
1
TP23 VIF IN SG6
2.8
3.1
3.4
V
1
TP17 VIF IN SG6
4.5
4.9
—
V
V17L
1
TP17 VIF IN SG7
—
0.1
0.5
V
V17
1
TP17 VIF IN SG8
86
89
92
dBµ
6
1
TP1A VIF IN SG9
1.0
1.5
—
MHz
7
1
TP1A VIF IN SG9
1.1
1.6
—
MHz
8
—
—
2.3
3.1
—
MHz
9
1
TP18 VIF IN SG10
22
32
44
mV
10
V18H
1
TP18 VIF IN SG10
4.4
4.8
—
V
10
V18L
1
TP18 VIF IN SG10
—
0.1
0.5
V
10
2.2
35
2.5
40
2.8
—
V
dB
11
—
2
5
%
—
2
5
deg
4
10
11
12
13
14
15
16
17
18
19
20
IF AGC Voltage V23
2
Maximum RF
V17H
AGC
Minimum RF
AGC
RF AGC
Delay Point
Capture Range CR-U
U
Capture Range CR-L
L
Capture Range CR-T
T
AFT Sensitivity µ
AFT Minimum
Voltage
AFT Maximum
Voltage
—
—
—
SW5 = 2
SW1 = 2
SW8 = 2
V8 = Variable
—
—
21
22
AFT defeat
AFT def
Inter Modulation IM
1
1
23
Differential
Gain
DG
1
TP18 VIF IN —
TP1A VIF IN SG11 SW8 = 2
V8 = Variable
TP1A VIF IN SG12
24
Differential
Phase
DP
1
TP1A VIF IN SG12
Rev.2.0, Mar.12.2004, page 4 of 19
Note
mA
V
/ kHz
M61110FP/GP
Electrical Characteristics (Vcc=5V, Ta=25°C, unless otherwise noted)
SIF Section
Measurement
No. Parameter
Symbol
Test
Test Input
Circuit Point Point
Input
SG
TP10 VIF IN
QIF IN
TP10 VIF IN
QIF IN
SG2
SG13
SG2
SG14
switches set to
position 1 unless Min
otherwise noted
Limits
Typ
Max
Unit
94
100
106
dBµ
94
100
106
dBµ
Note
25
QIF det OUT1 QIF1
1
26
QIF det OUT2 QIF2
1
27
28
AF Output
AFOutput
Distortion
1
1
TP14 SIF IN
TP14 SIF IN
SG16
SG16
400
—
600
0.2
880
0.9
mVrms
%
29
1
TP14 SIF IN
SG17
—
42
55
dBµ
12
30
Limiting
LIM
Sensitivity
AM Rejection AMR
1
TP14 SIF IN
SG18
61
68
—
dB
13
31
AF S/N
1
TP14 SIF IN
SG19
63
70
—
dB
14
VoAF
THD AF
AF S/N
Rev.2.0, Mar.12.2004, page 5 of 19
M61110FP/GP
Measurement Circuit Diagram
VIF IN
SIF IN
51
Vcc
150K
22K
51
TP18
Vcc
150K
TP23
39K
1K
24
TP17
22
21
20
19
18
17
16
15
VIF AMP
IF AGC
0.1u
7.5K
20K
1:1
23
TP14
0.1u
33K
14
13
AF AMP
RF AGC
QIF AMP
EQ
AMP
APC
VIDEO
DET
AFT
FM DET
QIF AGC
QIF DET
LIM AMP
REG
VCO
1
2
3
+
33u
4
5
6
11
12
TP10
33u
1K
51 1000p
L
TP1A P
F
10
0.22u
+
SW1
2
8 TP8 9
0.47u
+
1
7
15u
VCO
COIL
1
2
51
V8
330
TP2
LIM IN
TP9
4.5MHz Trap
TP1B
SW5 1
Vcc
2
A
* All the capacitors are 0.01uF, unless otherwise noted.
* The Measurement Circuit 1 is Mitsubishi standard evaluation fixture.
Rev.2.0, Mar.12.2004, page 6 of 19
M61110FP/GP
Input Signal
SG
50 Ω Termination
1
f0 = 45.75MHz AM 20kHz 77.8% 90dBµ
2
3
f0 = 45.75MHz 90dBµ CW
f1 = 45.75MHz 90dBµ CW
f2 = Frequency Variable 70dBµ
4
5
f0 = 45.75MHz AM 20kHz 77.8% Level Variable
f0 = 45.75MHz AM 20kHz 14.0% Level Variable
6
7
f0 = 45.75MHz 80dBµ CW
f0 = 45.75MHz 110dBµ CW
8
9
f0 = 45.75MHz Level Variable CW
f0 = Frequency Variable AM 20kHz 77.8% 90dBµ
10
11
f0 = Frequency Variable 90dBµ CW
f1 = 45.75MHz 90dBµ CW
f2 = 42.17MHz 80dBµ CW
Mixed Signal
f3 = 41.25MHz 80dBµ CW
12
f0 = 45.75MHz 87.5% TV modulation 10stair-steps waveform
Sync Tip Level 90dBµ
f1 = 41.25MHz 95dBµ CW
13
}
CW Mixed Signal
}
14
15
f1 = 41.25MHz 75dBµ CW
f1 = 45.75MHz 90dBµ CW
f2 = 41.25MHz 70dBµ CW
16
17
f0 = 4.5MHz 90dBµ FM 400Hz +/–25kHzdev
f0 = 4.5MHz Level Variable FM 400Hz +/–25kHzdev
18
19
f0 = 4.5MHz 90dBµ AM 400Hz 30%
f0 = 4.5MHz 90dBµ CW
20
f0 = 4.5MHz Level Variable CW
Rev.2.0, Mar.12.2004, page 7 of 19
}
Mixed Signal
M61110FP/GP
Notes
1. Video S/N
Input SG2 to VIF IN and measure the video out (Pin 1) noise in r.m.s. at TP1B
through a 5MHz (–3dB) L.P.F.
S/N=20 log
0.7 x Vo det
( —————— )
NOISE
[dB]
2. Video Band Width : BW
1. Measure the 1MHz component level of Video output TP1A with a spectrum analyzer when SG3 (f2 =
44.75MHz) is input to VIF IN. At that time, measure the voltage at TP8 with SW8, set to position 2, and then fix
V8 at that voltage.
2. Reduce f2 and measure the value of (f2-f1) when the (f2-f1) component level reaches –3dB from the 1MHz
component level as shown below.
TP1A
-3dB
( f2 - f1 )
1MHz
BW
3. Input Sensitivity : VIN MIN
Input SG4 (Vi = 90dBµ) to VIF IN , and then gradually reduce Vi and measure the input level when the 20kHz
component of Video output TP1A reaches –3dB from Vo det level.
4. Maximum Allowable Input : VIN MAX
1. Input SG5 (Vi = 90dBµ) to VIF IN , and measure the level of the 20kHz component of Video output.
2. Gradually increase the Vi of SG and measure the input level when the output reaches –3dB.
5. AGC Control Range: GR
GR = VIN MAX – VIN MIN [dB]
Rev.2.0, Mar.12.2004, page 8 of 19
M61110FP/GP
6. RF AGC Operating Voltage: V17
Input SG8 to VIF IN and gradually reduce Vi and then measure the input level when RF AGC output TP17 reaches
1/2Vcc, as shown below.
TP17
Voltage
V17H
1/2VCC
V 17L
Vi (dBu)
Vi
7. Capture range: CR-U
1. Increase the frequency of SG9 until the VCO is out of locked-oscillation.
2. And decrease the frequency of SG9 and measure the frequency fU when the VCO is locked.
CR-U = fU – 45.75 [MHz]
8. Capture range: CR-L
1. Decrease the frequency of SG9 until the VCO is out of locked-oscillation.
2. And increase the frequency of SG9 and measure the frequency fL when the VCO is locked.
CR-L = 45.75 – fL [MHz]
9. Capture range: CR-T
CR-T = CR-U + CR-L [MHz]
10. AFT sensitivity : µ, Maximum AFT voltage : V18H , Minimum AFT voltage : V18L
1. Input SG10 to VIF IN, and set the frequency of SG10 so that the voltage of AFT output TP18 is 3[V] . This
frequency is named f(3).
2. Set the frequency of SG10 so that the AFT output voltage is 2[V].
This frequency is named f(2).
3. IN the graph shown below, maximum and minimum DC voltage are V 18H and V18L , respectively.
TP18
Voltage
3V
µ=
1000
f(2) - f(3)
[mV]
[kHz]
V 18H
[mV/kHz]
2V
V 18L
f(3)
Rev.2.0, Mar.12.2004, page 9 of 19
f(2)
f(MHz)
M61110FP/GP
11. Inter modulation: IM
1. Input SG11 to VIF IN, and measure video output TP9 with an oscilloscope.
2. Adjust AGC filter voltage V8 so that the minimum DC level of the output waveform is 1.5V.
3. At that time, measure TP1A with a spectrum analyzer .
The inter modulation is defined as a difference between 0.92MHz and 3.58 MHz frequency components.
12. Limiting Sensitivity: LIM
1. Input SG17 to LIM IN, and measure the 400Hz component level of AF output TP14.
2. Input SG20 to LIM IN, and measure the noise level of AF output TP14 .
3. The input limiting sensitivity is defined as the input level when the difference between each 400Hz components
of audio output (TP14) is 30dB, as shown below.
Audio Output
(mVrms)
Audio output while SG17 is input.
30dB
Audio output while SG20 is input.
LIM Input level
(dBµ)
13. AM Rejection: AMR
1. Input SG18 to LIM IN, and measure the output level of Audio output (TP14).
This level is named VAM.
2. AMR is;
AMR = 20log
VoAF (mVrms)
( ———————
)
VAM (mVrms)
[dB]
14. AF S/N: AF S/N
1. Input SG19 to LIM IN, and measure the output noise level of Audio output (TP14).
This level is named VN.
2. S/N is;
S/N = 20log
VoAF (mVrms)
( ———————
)
VN (mVrms)
Rev.2.0, Mar.12.2004, page 10 of 19
[dB]
M61110FP/GP
Pin peripheral circuit explanation
*Pin 1 (EQ OUT)
EQ output amplitude is positive 2.2Vp-p in case
of 87.5% video modulation.
1
internal current :
1.2mA
1.1Vo-p
*Pin 2 (Vreg.OUT)
2
It is a regulated 3.5V output which has current
drive capability of approximately 1mA.
+
In the locked state, the cut-off frequency of the
filter is adjusted effectively by an external resistor
so that it will be in the range of around 30 to
200kHz.
In case the cut-off frequency is lower, the pull-in
speed becomes slow. On the other hand, a
higher cut-off frequency widen the pull-in range
and band width, which results in a degradation in
the S/N ratio.
So, in the actual TV system design, the
appropriate constant should be chosen for getting
desirable performance considering above
conditions.
*Pin3 (APC FILTER)
3
Bias
12K
Pin 3 output
[V3]
2.8Vo-p
fo
[IF input frequency]
Rev.2.0, Mar.12.2004, page 11 of 19
FM mod.frequency
100KHz
M61110FP/GP
*PIN 4 (EQ IN)
The input is open base.
If DC information is not input to pin9, IF AGC
dose not work normally.
Please pay attention.
4
*PIN 5 (Vcc)
Vcc
It is Vcc pin. (only one Vcc pin in this IC)
5
*PIN 6, PIN 7 (VCO COIL)
800
800
6
7
Rev.2.0, Mar.12.2004, page 12 of 19
Connecting a tuning coil and capacitor to these
pins enables an oscillation. The oscillation
frequency is tuned in 'fo' .In the actual adjustment,
the coil is tuned so that the AFT voltage reaches to
Vcc/2 with 'fo' as an input.
The printed pattern around these pins should be
designed carefully to prevent an pull-in error of
VCO,
caused by the leakage interference from the large
signal level oscillator to adjacent pins. The
interconnection
should be designed as short as possible.
In case the printed pattern has the interference
problem, a capacitor of about 1pF is connected
between pin6 or pin7 and GND so as to cancel
the interference and keep enough pull-in range
even in a low input level.
M61110FP/GP
*PIN 8, PIN 23 (IF AGC FILTER)
2-pins filter characteristics are available by
utilizing the dynamic AGC circuit .
And AGC speed can be changed, if pin23 on the
external resistor is variable.
8
1K
10K
[V8]
[V23]
weak
electric field
23
0
strong
electric field
[IF input]
*PIN 9 (VIDEO OUT)
Video output amplitude is positive 1.1Vp-p in
case of 87.5% video modulation.
9
internal current:
4mA
*PIN 10 (QIF OUT)
10
In the split carrier system, the carrier signal to SIF
is provided from pin10 through the emitter
follower.
And please open this pin, when it is used in the
inter carrier system.
internal current:
1mA
*PIN 11 (GND)
This is GND of the SIF part .
11
Rev.2.0, Mar.12.2004, page 13 of 19
M61110FP/GP
*PIN 12 (LIMITER IN)
12
Bias
150
6K
The input impedance is 6.15KΩ.
6K
*PIN 13 (QIF AGC FILTER)
AGC speed can be changed by this
pin's external capacity.
13
*PIN 14 (AUDIO OUT)
14
internal current :
0.8mA
*PIN 15 (NFB)
15
50K
50K
Rev.2.0, Mar.12.2004, page 14 of 19
The FM detector can respond to SIF signals
without an adjustment and external components
by adopting the PLL technique. The capacitor
between pin14 and pin15, which fixes the
de-emphasis characteristics, can be determined
considering the combination of an equivalent
resistance of the IC and this capacitor itself.
Frequency response of audio output is decided
with external capacitor value of pin15.
And audio output level can be made it small
when it connected external capacitor to pin15
and resistance in series.
M61110FP/GP
*PIN 16 (QIF DET IN)
SAW
16
Bias
1.5K
The input impedance is 1.5KΩ.
1.5K
*PIN 17 (RF AGC OUT)
Vcc (MAX 9V)
Vcc
Tuner
17
( in open-loop condition )
[V17]
inflow current :
2 mA (max)
Low
High
0
[ IF input ]
Connecting a non-polarity capacitor of 1uF
between pin17 to pin22 improves AGC
operating speed.
In that case, the capacitors between pin17
and pin22 to ground should be removed.
It is possible for Pin17 to connect to Vcc with 9V.
*PIN 18 (AFT OUT)
Vcc
The maximum
outflow current :
0.2 mA
18
The maximum
inflow current :
0.2 mA
Tuner
AFT output is provided by a high impedance
source,the detection sensitivity can be set by an
external resistor. The muting operation will be on
in following two cases;
1) the APC is out of locked
2) the video output becomes small enough in a
low input level.
Vcc
[V18]
( in open-loop condition )
Vcc
2
0
[fo]
Rev.2.0, Mar.12.2004, page 15 of 19
M61110FP/GP
*PIN 19 (GND)
19
This is GND other than SIF part.
*PIN 20, PIN 21 (VIF IN)
20
21
Bias
SAW
It should be designed carefully for impedance
matching with the SAW filter.
1.2K
1.2K
*PIN 22 (RF AGC DELAY)
Vreg.
The applied voltage to the pin22 is for changing
RF AGC delay point .
22
*PIN 24 (EQ F/B)
500
24
5.3K
Bias
5K
5K
Rev.2.0, Mar.12.2004, page 16 of 19
Both the external coil and capacitor determine the
frequency response of EQ output .
The series connected resistor is for damping.
M61110FP/GP
21
20
19
18
0.01µ
17
16
15
VIF AMP
IF AGC
14
13
AF AMP
RF AGC
EQ
AMP
0.1 µ
RF AGC
OUT
AF OUT
7.5 K
20K 0.1 µ
0.01µ
39K
150K
AFT
OUT
Vcc
150K
0.01µ
22
Vcc
0.01µ
33K 22K
1K 0.01µ
23
Vcc
0.01µ
1K
24
51
2.2 K
SAW
IF IN
0.01µ
560
27
1.2 K
1µ
0.01µ
2200 P
Application Example 1
APC
FM DET
QIF AGC
VIDEO
DET
AFT
QIF AMP
LIM AMP
QIF DET
REG
VCO
4
5
6
7
8
9
10
11
12
0.22µ
15µ
+
33 µ
TP2
0.01µ
33µ
1K
0.01µ
EQ
OUT
3
0.47µ
+
2
100
1
VCO COIL
1K
Vcc
330
4.5 MHz
Trap
4.5 MHz
B.P.F.
TP9
special components
SAW : SAFW45MCC80Z(MURATA)
TRAP : TPSRA4M50B00(MURATA)
B.P.F. : SFSRA4M50EF00(MURATA)
VCO : 292GCS- 5540Z(TOKO)
Rev.2.0, Mar.12.2004, page 17 of 19
M61110FP/GP
21
20
19
18
0.01µ
17
16
15
VIF AMP
IF AGC
0.1 µ
RF AGC
OUT
AF OUT
7.5 K
20K 0.1 µ
0.01µ
39K
150K
AFT
OUT
Vcc
150K
0.01µ
22
Vcc
0.01µ
33K 22 K
1K 0.01µ
23
Vcc
0.01µ
1K
24
51
2.2 K
SAW
IF IN
0.01µ
560
27
1.2 K
1µ
0.01µ
2200 P
Application Example 2
14
13
AF AMP
RF AGC
QIF AMP
EQ
AMP
APC
QIF AGC
VIDEO
DET
AFT
FM DET
LIM AMP
QIF DET
REG
VCO
6
7
+
33 µ
0.01µ
1M
TP2
8
9
10
11
12
0.22µ
5
1p
4
22 µ 56 p
51
33µ
1K
0.01µ
EQ
OUT
3
0.47µ
+
2
1000 p
1
Vcc
15 µ
330
4.5 MHz
Trap
VCO COIL
4.5 MHz
B.P.F.
TP9
special components
SAW : SAFW45MCC80Z(MURATA)
TRAP : TPSRA4M50B00(MURATA)
B.P.F. : SFSRA4M50EF00(MURATA)
VCO : 292GCS - 5540Z(TOKO)
Rev.2.0, Mar.12.2004, page 18 of 19
Rev.2.0, Mar.12.2004, page 19 of 19
G
Z1
E
HE
e
1
24
EIAJ Package Code
SSOP24-P-300-0.80
z
Detail G
D
y
JEDEC Code
—
b
12
13
Weight(g)
0.2
Detail F
A2
A
Lead Material
Cu Alloy
L1
MMP
A1
F
c
L
A
A1
A2
b
c
D
E
e
HE
L
L1
z
Z1
y
Symbol
e1
b2
e1
I2
b2
Dimension in Millimeters
Min
Nom
Max
—
—
2.1
0
0.1
0.2
—
1.8
—
0.3
0.35
0.45
0.18
0.2
0.25
10.0
10.1
10.2
5.2
5.3
5.4
—
0.8
—
7.5
7.8
8.1
0.4
0.6
0.8
—
1.25
—
—
—
0.65
—
—
0.8
—
—
0.1
0˚
—
8˚
—
0.5
—
—
7.62
—
—
1.27
—
Recommended Mount Pad
e
Plastic 24pin 300mil SSOP
I2
24P2Q-A
M61110FP/GP
Detailed Diagram Of Package Outline
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
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use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
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