HT6751A/HT6751B Camera Motor Driver (1.5 Channel) Features · Operating voltage: 2.0V~6.0V · Built-in H bridge control circuit · Operating current < 2mA at 3.0V, No load · Built-in spark killer diode · Standby current IVDD< 2mA, no load · Provides strong ESD (min. of 4KV) per pin · Separate logic power supply and motor power supply · 8-pin SOP package · Built-in thermal shutdown circuit Applications · Camera motor driver · Toy motor driver General Description The IC can control H Bridge circuit for motor driving. It provides Spark Killer Diode/Thermal Shutdown function/Forward function/Reverse function/Brake func- tion/Stop function for motor driver application. It is designed by LSI high technology with low power process. Block Diagram V D D R C O s c illa to r C h a rg e P u m p V S S IN 1 IN 2 IN 3 H B r id g e M o to r D r iv e C ir c u it T h e rm a l S h u td o w n C ir c u it In p u t C o n tro l V M O U T 1 O U T 2 Pin Assignment V M 1 8 O U T 1 2 7 O U T 2 IN 2 IN 3 3 6 V D D V S S 4 5 IN 1 H T 6 7 5 1 A /H T 6 7 5 1 B 8 S O P Pin Description Pin No. Pin Name I/O Description 1 VM P Power of motor driving circuit 2 OUT1 O Connect to motor terminal 3 IN3 I Input signal 4 VSS ¾ 5 IN1 I 6 VDD ¾ 7 IN2 I Input signal 8 OUT2 O Connect to motor terminal Rev. 1.10 Negative power supply, ground Input signal Positive power supply 1 April 11, 2012 HT6751A/HT6751B Absolute Maximum Ratings Supply Voltage...................................VDD-0.3V to 7.0V Storage Temperature ............................-40°C to 125°C Voltage to Input Terminal....................-0.3V to VDD+0.3 Operating Temperature...........................-20°C to 85°C Junction Temperature ..........................................150°C Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Electrical Characteristics Symbol Ta=25°C Test Conditions Parameter VDD Conditions ¾ Min. Typ. Max. Unit VDD Operating Voltage 1 ¾ 2.0 ¾ 6.0 V VM Operating Voltage 2 ¾ Motor loading 1.8 ¾ 6.0 V IVM VM Current 5V Standby mode with internal pump ¾ ¾ 10 mA IOPR Operating Current 5V No load @ VDD=5V ¾ ¾ 2 mA ¾ 1 2 mA -1.0 ¾ 1.0 mA 0.3VDD V ¾ VDD+0.3 V IVDD Standby Current 5V Standby mode IIL Input Leakage Current 5V 0<Vin<VDD VIL Input Low Voltage 5V ¾ -0.3 VIH Input High Voltage 5V ¾ 0.6VDD RON H Bridge On Resistance 3V (up_NMOS+down_NMOS) at 3V ¾ ¾ 0.4 W tCP_ON Charge Pump Turn On Time 5V VDD=VM=5V, Ivm=0.5A ¾ ¾ 2 ms tCP_OFF Charge Pump Turn Off Time 5V VDD=VM=5V, Ivm=0.5A ¾ ¾ 1 ms tH_ON H Bridge Turn On Time 5V VDD=VM=5V, Ivm=0.5A ¾ ¾ 10 ms tH_OFF H Bridge Turn Off Time 5V VDD=VM=5V, Ivm=0.5A ¾ ¾ 5 ms Functional Description · In HT6751A function IN1 IN2 IN3 0 1 1 1 0 1 0 0 1 Function MOS On MOS Off Motor1 forward P1/N2 P2/N1 Motor1 reverse P2/N1 P1/N2 Motor1 brake N1/N2 P1/P2 1 1 1 Standby mode ¾ P1/P2/N1/N2 0 1 0 Motor2 forward P2/(N3) N2/(P3) 1 0 0 Motor2 reverse N2/(P3) P2/(N3) 0 0 0 Motor2 brake N2/(N3) P2/(P3) MOS On Mos Off · In HT6751B function IN1 IN2 IN3 Function 1 0 0 Motor1 forward P1/N2 P2/N1 0 1 0 Motor1 reverse P2/N1 P1/N2 1 1 0 Motor1 brake N1/N2 P1/P2 0 0 0 Standby mode ¾ P1/P2/N1/N2 1 0 1 Motor2 forward P2/(N3) N2/(P3) 0 1 1 Motor2 reverse N2/(P3) P2/(N3) 1 1 1 Motor2 brake N2/(N3) P2/(P3) Rev. 1.10 2 April 11, 2012 HT6751A/HT6751B ¨ ¨ In normal state and standby mode - Charge pump circuit is in off state - Oscillator circuit is in off state - Standby current is below 2mA - For HT6751A, the oscillator circuit and charge pump circuit is on until IN1 or IN2 or IN3 is low input - For HT6751B, the oscillator circuit and charge pump circuit is on until IN1 or IN2 or IN3 is high input The system enters thermal shutdown mode (current is limited below 500mA) when the temperature of the internal sensor is greater than Junction Temperature and then release this mode until the temperature of the internal sensor below (Junction Temperatue >150°C). The system can accept IN1/IN2/IN3 signal when in thermal shutdown mode. Application Circuits 1 C h a n n e l fo r m C /A S IC V D D V M V D D V M IN 1 F o rw a rd O U T 1 M 1 V D D IN 2 O U T 2 IN 3 V S S B ra k e R e v e rs e V D D H T 6 7 5 1 A V D D V M V D D V M IN 1 O U T 1 IN 2 O U T 2 IN 3 V S S H T 6 7 5 1 A V D D V D D V M IN 1 O U T 1 IN 2 O U T 2 IN 3 V S S F o rw a rd M 1 B ra k e V D D 1 .5 C h a n n e l fo r m C /A S IC IN 1 R e v e rs e V M V D D IN 1 O U T 1 IN 2 O U T 2 IN 3 V S S M H T 6 7 5 1 B H T 6 7 5 1 B V D D V M V M V D D 1 C h a n n e l fo r m C /A S IC M V M N 3 V M O U T 3 O U T 1 M 1 IN 2 O U T 2 IN 3 V S S M 2 E x te rn a l P 3 H T 6 7 5 1 A /B Rev. 1.10 3 April 11, 2012 HT6751A/HT6751B Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website (http://www.holtek.com.tw/english/literature/package.pdf) for the latest version of the package information. 8-pin SOP (150mil) Outline Dimensions A 5 8 1 B 4 C C ' G H D E a F · MS-012 Symbol Nom. Max. A 0.228 ¾ 0.244 B 0.150 ¾ 0.157 C 0.012 ¾ 0.020 C¢ 0.188 ¾ 0.197 D ¾ ¾ 0.069 E ¾ 0.050 ¾ F 0.004 ¾ 0.010 G 0.016 ¾ 0.050 H 0.007 ¾ 0.010 a 0° ¾ 8° Symbol A Rev. 1.10 Dimensions in inch Min. Dimensions in mm Min. Nom. Max. 5.79 ¾ 6.20 B 3.81 ¾ 3.99 C 0.30 ¾ 0.51 C¢ 4.78 ¾ 5.00 D ¾ ¾ 1.75 E ¾ 1.27 ¾ F 0.10 ¾ 0.25 G 0.41 ¾ 1.27 H 0.18 ¾ 0.25 a 0° ¾ 8° 4 April 11, 2012 HT6751A/HT6751B Product Tape and Reel Specifications Reel Dimensions D T 2 A C B T 1 SOP 8N Symbol Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter D Key Slit Width T1 Space Between Flange T2 Reel Thickness Dimensions in mm 330.0±1.0 100.0±1.5 13.0 +0.5/-0.2 12.8 +0.3/-0.2 2.0±0.5 18.2±0.2 5 November 10, 2008 HT6751A/HT6751B Carrier Tape Dimensions P 0 D P 1 t E F W B 0 C D 1 P K 0 A 0 R e e l H o le IC p a c k a g e p in 1 a n d th e r e e l h o le s a r e lo c a te d o n th e s a m e s id e . SOP 8N Symbol Description Dimensions in mm +0.3/-0.1 W Carrier Tape Width P Cavity Pitch 8.0±0.1 E Perforation Position 1.75±0.1 F Cavity to Perforation (Width Direction) 5.5±0.1 D Perforation Diameter 1.55±0.1 D1 Cavity Hole Diameter P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.4±0.1 B0 Cavity Width 5.2±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness C Cover Tape Width Rev. 1.10 12.0 1.50 +0.25/-0.00 0.30±0.05 9.3±0.1 6 April 11, 2012 HT6751A/HT6751B Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538 Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright Ó 2012 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek¢s products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.10 7 April 11, 2012