HT93LC46 CMOS 1K 3-Wire Serial EEPROM Features General Description • Operating voltage: 1.8V~5.5V The HT93LC46 is a 1K-bit low voltage nonvolatile, serial electrically erasable programmable read only memory device using the CMOS floating gate process. Its 1024 bits of memory are organized into 64 words of 16 bits each when the ORG pin is connected to VCC or organized into 128 words of 8 bits each when it is tied to VSS. The device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. By popular microcontroller, the versatile serial interface including chip select (CS), serial clock (SK), data input (DI) and data output (DO) can be easily controlled. • Low power consumption –– Operating: 5mA max. –– Standby: 2µA max. • User selectable internal organization –– 1K: 128×8 or 64×16 • 3-wire Serial Interface • Write cycle time: 5ms max. • Automatic erase-before-write operation • Word/chip erase and write operation • Write operation with built-in timer • Software controlled write protection • 40-year data retention • 106 rewrite cycles per word • Industrial temperature range (−40°C to +85°C) • 8-pin DIP/SOP/TSSOP package Block Diagram Pin Assignment Rev. 2.10 1 January 16, 2014 HT93LC46 Pin Description Pin Name I/O Description CS I Chip select input SK I Serial clock input DI I Serial data input DO O Serial data output VSS — Negative power supply, ground ORG I Internal Organization When ORG is connected to VDD or ORG is floated, the (×16) memory organization is selected. When ORG is tied to VSS, the (×8) memory organization is selected. There is an internal pull-up resistor on the ORG pin. NC — No connection VCC — Positive power supply Absolute Maximum Ratings Supply Voltage .......................... VSS−0.3V to VSS+6.0V Storage Temperature............................−50°C to 125°C Input Voltage............................. VSS−0.3V to VCC+0.3V Operating Temperature..........................−40°C to 85°C Note: These are stress ratings only. Stresses exceeding the range specified under ″Absolute Maximum Ratings″ may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. D.C. Characteristics Symbol Parameter Ta=-40°C~+85°C Test Conditions VCC Conditions Min. Typ. Max. Unit VCC Operating Voltage — −40°C to +85°C 1.8 — 5.5 V ICC1 Operating Current (TTL) 5V DO unload, SK=1MHz — — 5 mA 5V DO unload, SK=1MHz — — 5 mA ICC2 Operating Current (CMOS) DO unload, 1.8V~5.5V SK=250kHz — — 5 mA 1.8V~5.5V CS=SK=DI=0V ISTB Standby Current (CMOS) — — 2 µA ILI Input Leakage Current 5V VIN=VSS~VCC 0 — 1 µA ILO Output Leakage Current 5V VOUT=VSS~VCC, CS=0V 0 — 1 µA 5V — 0 — 0.8 V 1.8V~5.5V — 0 — 0.1VCC V 2 — VCC V 0.9VCC — VCC V VIL Input Low Voltage 5V VIH Input High Voltage VOL Output Low Voltage VOH Output High Voltage CIN Input Capacitance (see note) — COUT Output Capacitance (see note) — — 1.8V~5.5V — IOL=2.1mA — — 0.4 V 1.8V~5.5V IOL=100µA — — 0.2 V V 5V 5V IOH=−400µA 2.4 — — VCC−0.2 — — V VIN=0V, f=250kHz — — 5 pF VOUT=0V, f=250kHz — — 5 pF 1.8V~5.5V IOH=−100µA Note: These parameters are periodically sampled but not 100% tested. Rev. 2.10 2 January 16, 2014 HT93LC46 A.C. Characteristics Symbol Ta=-40°C~+85°C VCC=5V±10% Parameter VCC=3V±10% Min. Max. VCC=1.8V Min. Max. Min. Max. Unit fSK Clock Frequency 0 2000 0 1000 0 500 kHz tSKH SK High Time 250 — 500 — 1000 — ns tSKL SK Low Time 250 — 500 — 1000 — ns tCSS CS Setup Time 50 — 100 — 100 — ns tCSH CS Hold Time 0 — 0 — 0 — ns tCDS CS Deselect Time 250 — 250 — 500 — ns tDIS DI Setup Time 100 — 150 — 200 — ns tDIH DI Hold Time 100 — 150 — 200 — ns tPD1 DO Delay to ″1″ — 250 — 500 — 1000 ns tPD0 DO Delay to ″0″ — 250 — 500 — 1000 ns tSV Status Valid Time — 250 — 250 — 250 ns tHZ DO Disable Time — 100 — 200 — 400 ns tPR Write Cycle Time — 5 — 5 — 5 ms Endurance 25°C, Page Mode, 5.0V Write Cycles 1,000,000 Note: These parameters are periodically sampled but not 100% tested. For relative timing, refer to timing diagrams. A.C. Test Conditions Input rise and fall time: 5ns (1V to 2V) Input and output timing reference levels: 1.5V Output load: See Figure right V C C = 1 .9 5 2 V 8 0 0 D O 1 0 0 p F * * ln c lu d in g s c o p e a n d jig Output Load Circuit Rev. 2.10 3 January 16, 2014 HT93LC46 Functional Description ERASE The HT93LC46 is accessed via a three-wire serial communication interface. The device is arranged into 64 words by 16 bits or 128 words by 8 bits depending whether the ORG pin is connected to VCC or VSS. The HT93LC46 contains seven instructions: READ, ERASE, WRITE, EWEN, EWDS, ERAL and WRAL. When the user selectable internal organization is arranged into 64×16 (128×8), these instructions are all made up of 9(10) bits data: 1 start bit, 2 op code bits and 6(7) address bits. The ERASE instruction erases data at the specified addresses in the programming enable mode. After the ERASE op-code and the specified address have been issued, the data erase is activated by the falling edge of CS. Since the internal auto-timing generator provides all timing signals for the internal erase, so the SK clock is not required. During the internal erase, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over, the DO pin will return to high and further instructions can be executed. By using the control signal CS, SK and data input signal DI, these instructions can be given to the HT93LC46. These serial instruction data presented at the DI input will be written into the device at the rising edge of SK. During the READ cycle, DO pin acts as the data output and during the WRITE or ERASE cycle, DO pin indicates the BUSY/READY status. When the DO pin is active for read data or as a BUSY/READY indicator the CS pin must be high; otherwise DO pin will be in a high-impedance state. For successful instructions, CS must be low once after the instruction is sent. After power on, the device is by default in the EWDS state. And, an EWEN instruction must be performed before any ERASE or WRITE instruction can be executed. The following are the functional descriptions and timing diagrams of all seven instructions. WRITE The WRITE instruction writes data into the device at the specified addresses in the programming enable mode. After the WRITE op-code and the specified address and data have been issued, the data writing is activated by the falling edge of CS. Since the internal auto-timing generator provides all timing signal for the internal writing, so the SK clock is not required. The auto-timing write cycle includes an automatic erase-before-write capability. So, it is not necessary to erase data before the WRITE instruction. During the internal writing, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over, the DO pin will return to high and further instructions can be executed. READ ERAL The READ instruction will stream out data at a specified address on the DO pin. The data on DO pin changes during the low-to-high edge of SK signal. The 8 bits or 16 bits data stream is preceded by a logical ″0″ dummy bit. Irrespective of the condition of the EWEN or EWDS instruction, the READ command is always valid and independent of these two instructions. After the data word has been read the internal address will be automatically incremented by 1 allowing the next consecutive data word to be read out without entering further address data. The address will wrap around with CS High until CS returns to LOW. The ERAL instruction erases the entire 64×16 or 128×8 memory cells to logical ″1″ state in the programming enable mode. After the erase-all instruction set has been issued, the data erase feature is activated by the falling edge of CS. Since the internal auto-timing generator provides all timing signal for the erase-all operation, so the SK clock is not required. During the internal erase-all operation, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over, the DO pin will return to high and further instruction can be executed. EWEN/EWDS WRAL The EWEN/EWDS instruction will enable or disable the programming capabilities. At both the power on and power off state the device automatically entered the disable mode. Before a WRITE, ERASE, WRAL or ERAL instruction is given, the programming enable instruction EWEN must be issued, otherwise the ERASE/WRITE instruction is invalid. After the EWEN instruction is issued, the programming enable condition remains until power is turned off or a EWDS instruction is given. No data can be written into the device in the programming disabled state. By so doing, the internal memory data can be protected. Rev. 2.10 The WRAL instruction writes data into the entire 64×16 or 128×8 memory cells in the programming enable mode. After the write-all instruction set has been issued, the data writing is activated by the falling edge of CS. Since the internal auto-timing generator provides all timing signals for the write-all operation, so the SK clock is not required. During the internal write-all operation, we can verify the busy/ready status if CS is high. The DO pin will remain low but when the operation is over the DO pin will return to high and further instruction can be executed. 4 January 16, 2014 HT93LC46 Timing Diagrams READ EWEN/EWDS WRITE ERASE Rev. 2.10 5 January 16, 2014 HT93LC46 ERAL tC C S D S v e r ify S ta n d b y S K D I 0 (1 ) S ta r t b it 0 1 0 tS H ig h Z D O tP tH V Z re a d y b u s y R WRAL Instruction Set Summary Instruction Comments Start Bit Op Code Address ORG=0 ORG=1 ×8 ×16 Data ORG=0 ORG=1 ×8 ×16 D7~D0 READ Read data 1 10 A6~A0 A5~A0 ERASE Erase data 1 11 A6~A0 A5~A0 D15~D0 — WRITE Write data 1 01 A6~A0 A5~A0 EWEN Erase/Write Enable 1 00 11XXXXX 11XXXX D7~D0 — D15~D0 EWDS Erase/Write Disable 1 00 00XXXXX 00XXXX — ERAL Erase All 1 00 10XXXXX 10XXXX WRAL Write All 1 00 01XXXXX 01XXXX — D7~D0 D15~D0 Note: ″X″ stands for ″don′t care″ Data should be written to the EEPROM in the format (8-bit or 16-bit mode) in which it is to be read. Rev. 2.10 6 January 16, 2014 HT93LC46 Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website for the latest version of the package information. Additional supplementary information with regard to packaging is listed below. Click on the relevant section to be transferred to the relevant website page. • Further Package Information (include Outline Dimensions, Product Tape and Reel Specifications) • Packing Meterials Information • Carton information Rev. 2.10 7 January 16, 2014 HT93LC46 8-pin DIP (300mil) Outline Dimensions Symbol Min. Nom. Max. A 0.355 0.365 0.400 B 0.240 0.250 0.280 C 0.115 0.130 0.195 D 0.115 0.130 0.150 E 0.014 0.018 0.022 0.070 F 0.045 0.060 G — 0.100 BSC — H 0.300 0.310 0.325 I — — 0.430 Symbol Rev. 2.10 Dimensions in inch Dimensions in mm Min. Nom. Max. 10.16 A 9.02 9.27 B 6.10 6.35 7.11 C 2.92 3.30 4.95 D 2.92 3.30 3.81 E 0.36 0.46 0.56 F 1.14 1.52 1.78 G — 2.54 BSC — H 7.26 7.87 8.26 I — — 10.92 8 January 16, 2014 HT93LC46 8-pin SOP (150mil) Outline Dimensions Symbol A Dimensions in inch Min. Nom. Max. — 0.236 BSC — B — 0.154 BSC — C 0.012 — 0.020 C′ — 0.193 BSC — D — — 0.069 E — 0.050 BSC — F 0.004 — 0.010 G 0.016 — 0.050 H 0.004 — 0.010 α 0° — 8° Symbol Rev. 2.10 Dimensions in mm Min. Nom. Max. A — 6.00 BSC — B — 3.90 BSC — C 0.31 — 0.51 C′ — 4.90 BSC — D — — 1.75 E — 1.27 BSC — F 0.10 — 0.25 G 0.40 — 1.27 H 0.10 — 0.25 α 0° — 8° 9 January 16, 2014 HT93LC46 8-pin TSSOP Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A — — 0.047 A1 0.002 — 0.006 A2 0.031 0.039 0.041 B 0.007 — 0.012 C 0.004 — 0.006 D 0.114 0.118 0.122 E — 0.252 BSC — E1 0.169 0.173 0.177 e — 0.026 BSC — L 0.018 0.024 0.030 L1 — 0.039 BSC — y — 0.004 — θ 0° — 8° Symbol Rev. 2.10 Dimensions in mm Min. Nom. Max. A — — 1.20 A1 0.05 — 0.15 A2 0.80 1 1.05 B 0.19 — 0.30 C 0.09 — 0.16 D 2.90 3.00 3.10 E — 6.40 BSC — E1 4.30 4.40 4.50 e — 0.65 BSC — L 0.45 0.60 0.75 L1 — 1.0 BSC — y — 0.10 — θ 0° — 8° 10 January 16, 2014 HT93LC46 Copyright© 2014 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 2.10 11 January 16, 2014