LBH1025

LBH1025
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CONTENTS
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1. Features
2. Package Outline Dimensions and Materials
3. Specifications
4. Taping Dimensions
5. Packing
6. Reliability
7. Cautions
8. Warranty
9. Others
10. Characteristic Diagrams
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LBH1025
1. Features
• Package : Transparency SMD Side View Type
• 2.8 × 1.2 × 0.8 mm(L×W×H) small size surface mount type
• Viewing angle : extremely wide(110˚)
• Technology : InGaN
• Soldering methods : IR reflow soldering
• Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
3,500pcs/reel, Φ180 mm wheel
2. Package Outline Dimensions and Materials
Genel Tolerance : ±0.1
(1) Material Construction
Number
Item
Material
1
LED Chip
InGaN
2
Wire
Au Wire
3
Lead Frame
Copper Alloy/Ni/Ag Plating
4
Encapsulating Resin
Transparent encapsulation
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LBH1025
3. Specifications
(1) Absolute Maximum Ratings
(Ta=25°c)
Item
Symbol
Absolute Maximum Rating
Unit
IF
30
mA
IFP
100
mA
Reverse Voltage
VR
5
V
Power Dissipation
PD
120
mW
Operating Temperature
Topr
-30∼+85
℃
Storage Temperature
Tstg
-40∼+100
℃
Soldering Temperature
Tsol
Forward Current
*1Pulse Forward Current
Reflow Soldering : 260℃ for 10 sec 이내
*1. IFP Conditions : Pulse Width ≤ 10msec. and Duty ≤ 1/10
(2) Initial Electrical/Optical Characteristics
Characteristic
(Ta=25°c)
Symbol
Test Condition
Min.
Typ.
Max.
Unit
ESD Check Forward Voltage
VF2
IF= 10uA
2.0
-
-
V
Forward Voltage
VF
IF= 20mA
-
3.3
3.6
V
Reverse Current
IR
VR=5V
-
-
10
uA
Dominant Wavelength
λd
IF= 20mA
465
-
475
nm
θ1/2
IF= 20mA
-
±55
-
deg
*2Half Angle
*2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity
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LBH1025
(3) Dominant Wavelength
Wd RANK
(IF=20mA, Ta=25℃)
Test Condition
A
Min.
Typ.
Max.
465
-
470
470
-
475
IF= 20mA
B
Unit
nm
* Chromaticity coordinates Measured : 0.01sr(CIE. LED_B)
* Measurement Uncertainty of the Wavelength : ±0.1nm
(4) Luminous intensity ranks
Iv RANK
Test Condition
R
IF= 20mA
S
T
(Ta=25℃)
Min.
Typ.
Max.
70
-
100
100
-
150
150
-
220
Unit
mcd
* Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±10%.
* Luminous Intensity Measured : 0.01sr(CIE. LED_B)
(5) Forward Voltage
VF RANK
(Ta=25℃)
Test Condition
11
Min.
Typ.
Max.
2.9
-
3.1
3.1
-
3.3
3.3
-
3.4
3.4
-
3.6
Unit
1
12
21
IF= 20mA
2
22
* Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V.
(6) Precautions On LED using
* To avoid optical difference, Please do not mix differently-ranked product.
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V
LBH1025
4. Taping Dimensions
(1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω)
(Unit : mm)
(2) Dimension of tape(Material : PS Conductive, 10E4~5Ω)
(Unit : mm)
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LBH1025
(3) Details of CHIP LEDs loading on tape
(End)
more than 40mm
unloaded tape
(Start)
mounted with LED
(3,500ea)
more than 40mm
150 ~ 380mm
unloaded tape
leading part
5. Packing
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LBH1025
6. Reliability
(1) Criteria for judging the damage
Criteria for Judgement
ITEM
Symbol
Test Condition
Min.
Max.
Forward Voltage
VF
IF = 20mA
-
U.S.L. *) × 1.1
Reverse Current
IR
VR = 5V
-
U.S.L. *) × 2.0
Luminous Intensity
Iv
IF = 20mA
I.V × 0.7
I.V × 1.3
*) U.S.L. : Upper Standard Level
L.S.L : Lower Standard Level
(2) Results of reliability Test
Test
NO
Item
Test Conditions
Hours
/Cycle
H : +100℃ 30min
1
Temperature Cycle
25℃ 5min
L : -40℃ 30min
2
3
4
5
High Temperature
TEMP : 85℃
Operating Life
(IF=5mA)
Low Temperature
TEMP : -30℃
Operating Life
(IF=20mA)
DC Operating Life
TEMP : 24℃
(IF=30mA)
High Temperature/
60℃/90% RH,
High Humidity
(IF=15mA)
100
Sample
Size
Ac/Re
21 pcs
0/1
1000HR’s
21 pcs
0/1
1000HR’s
21 pcs
0/1
500HR’s
21 pcs
0/1
500HR’s
21 pcs
0/1
Cycle
(3) Reference
The estimated average time of a 50% degradation in luminous intensity is 8,000 hr’s. under
the room temperature, If=20mA.
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LBH1025
7. Cautions
(1) Moisture Proof Package
• When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs.
For this reason, the moisture proof package is used to keep
moisture to a minimum in the package.
• A package of a moisture absorbent material (silica gel) is inserted into the shielding bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
• Storage Conditions
Before opening the package :
The LEDs should be kept at 30℃ or less and 90%RH or less. The LEDs should be used
within a year. When storing the LEDs, moisture proof packaging with absorbent material
(silica gel) is recommended.
After opening the package :
The LEDs should be kept at 30℃ or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel). It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
• If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65±5℃
• Luxpia LED electrode sections are comprised of a silver plated copper alloy. The silver surface
may be affected by environments which contain corrosive gases and so on. Please avoid
condition may cause difficulty during soldering operations. It is recommended that the User
use the LEDs as soon as possible.
• Please avoid rapid transitions in ambient temperature, especially in high humidity environments
where condensation can occur.
(3) Heat Generation
• Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when making the system design. The coefficient of temperature increase
per input electric power is affected by the thermal resistance of the circuit board and
density of LED placement on the board, as well as other components. It is necessary to avoid
intense heat generation and operate within the maximum ratings given in this specification.
• The operating current should be decided after considering the ambient maximum temperature
of LEDs.
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(4) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method. Luxpia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Lead Solder
Hand Soldering
Lead-free Solder
Pre-heat
120~150℃
180~200℃
Temperature
350℃ Max
Pre-heat time
120sec Max
120sec Max
Soldering time
3sec Max
Peak temperature
240℃ Max
260℃ Max
Soldering time
Condition
10sec Max
10sec Max
refer to
refer to
Temperature-
Temperature-
profile ①
profile ②
(one time only)
* After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
<① : Lead Solder>
<② : Lead-free Solder>
2.5~5℃/sec
2.5~5℃/sec
1~5℃/sec
240℃ Max
sec Max
Pre-heating
120~150℃
1~5℃/sec
60sec Max
Above 200℃
120sec Max
260℃ Max
10sec Max
Pre-heating
180~200℃
60sec Max
Ave 220℃
120sec Max
[Recommended soldering pad design]
Use the following conditions shown in the figue.
1.4
1.0
1.4
0.9
(Unit : mm)
• Occasionally there is a brightness decrease caused by the influence of heat or ambient
atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method.
• Repairing should not be done after the LEDs have been soldered. When repairing is
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LBH1025
unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand
whether the characteristics of the LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board.
(5) Cleaning
• It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When
using other solvents, it should be confirmed beforehand whether the solvents will
dissolve the package and the resin or not. Freon solvents should not be
used to clean the LEDs because of worldwide regulations. Do not clean the LEDs by the
ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will
occur.
(6) Static Electricity
• Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the
LEDs.
• All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts
the LEDs.
• When inspecting the final products in which LEDs were assembled, it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find staticdamaged LEDs by a light-on test or a VF test at a lower current(below 1mA is recommended).
• Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at IF=10㎂)
(7) Others
• Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
• The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds.
• Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had
LEDs incorporated into it.
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8. Warranty
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will convey
good title to all LEDs sold.
(2) LUXPIA Disclaims all other warranties including the implied warranties of merchantability and
fitness for a particular purpose.
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing specifications
within ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s discretion, provided
that the User (1) promptly notifies Luxpia in writing of the details of the defect (2) ships the LEDs
at the User’s expense to Luxpia for examination, and (3) the defect is due to the negligence of
Luxpia and not mishandling or misuse by the User.
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at conditions
exceeding our specifications.
(5) These specifications are applied only when a LED stands alone and it is strongly recommended
that the User of the LEDs confirms the properties upon assembly. Luxpia is not responsible for
failures caused during and after assembling.
It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.
(6) A claim report stating details about the defect shall be made when returning defective LEDs.
Luxpia will investigate the report immediately and inform the user of the results.
(7) The LEDs described in this brochure are intended to be used for ordinary electronic equipment
(Such as office equipment, communications equipment, on the applications in which exceptional
quality and reliability are required, particularly when the failure or malfunction of the LEDs may
directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters,
nuclear reactor control systems, automobiles, traffic control equipment, life support systems and
safety devices)
(8) LUXPIA’s liability for defective lamps shall be limited to replacement and in no event shall
LUXPIA be liable for consequential damage or lost profits.
9. Others
(1) The warranties of quality set forth herein are exclusive. All previous negotiations and agreements
not specifically incorporated herein are superseded and rendered null and void.
(2) Both parties shall sincerely try to find a solution when any disagreement occurs regarding these
specifications.
(3) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior
written consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia
directly before disassembling or analysis.
(4) These specifications can be revised upon mutual agreement.
(5) Luxpia understands that the User accepts the content of these specifications, if the User does
not return these specifications with signatures within 3 weeks after receipt.
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10. Characteristic Diagrams
(1) Forward Voltage vs Forward Current
(2) Forward Current vs Relative Luminosity
Ta=25℃
Ta=25℃
4.0
3.5
100
Relative Luminosity[au]
Forward Current IFP[mA]
200
50
20
10
5
3.0
2.5
2.0
1.5
1.0
0.5
0
1
2.5
3.0
3.5
4.0
4.5
5.0
0
Forward Voltage VF[V]
60
80
100
120
(4) Ambient Temperature vs Relative Luminosity
Forward Current
10
60
50
Relative Luminosity[au]
Allowable Forward current IF[mA]
40
Forward Current IFP[mA]
(3) Ambient Temperature vs
Allowable
20
40
30
20
10
-20
0
20
40
60
80
1
0.1
-40
100
Ambient Temperature Ta[℃]
-20
0
20
40
60
80
Ambient Temperature Ta[℃]
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100
LBH1025
(5) Radiation Characteristic
Ta=25℃, IF = 20mA
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