LMBR120ET1G thru LMBR1200ET1G Schottky Barrier Rectifiers Reverse Voltage 20 to 200V Forward Current 1.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * Low power loss,high efficiency * For use in low voltage high frequency inverters, free wheeling,and polarity protection applications * Guardring for over voltage protection * High temperature soldering guaranteed: 260°C/10 seconds at terminals Mechanical Data Case: SOD-323HE molded plastic over sky die Terminals: Tin Plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.011 g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) 1.Electrical Characteristic Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol device marking code LMBR LMBR LMBR LMBR 120ET1G 130ET1G 140ET1G 150ET1G LMBR 160ET1G LMBR 180ET1G LMBR LMBR LMBR 1100ET1G 1150ET1G 1200ET1G 12 13 14 15 16 18 110 115 120 100 150 200 Unit Maximum repetitive peak reverse voltage VRRM 20 30 40 50 60 80 Maximum RMS voltage VRMS 14 21 28 35 42 56 70 105 140 V Maximum DC blocking voltage VDC 20 30 40 50 60 80 100 150 200 V V Maximum average forward rectified current at TC = 75°C IF(AV) 1.0 A Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 22 A Typical thermal resistance (Note 1) RθJA RθJL 220 50 °C/W TJ –55 to +150 °C TSTG –65 to +150 °C Operating junction temperature range storage temperature range Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol LMBR LMBR LMBR LMBR 120ET1G 130ET1G 140ET1G 150ET1G LMBR 160ET1G LMBR 180ET1G LMBR LMBR LMBR 1100ET1G 1150ET1G 1200ET1G Unit Maximum instantaneous forward voltage at(IF = 0.7 A, TJ = 25°C) (IF = 1.0 A, TJ = 25°C) VF Maximum DC reverse current at rated DC blocking voltage TA = 25°C TJ = 125°C IR 0.02 10 mA Typical junction capacitance at 4.0V, 1MHz CJ 160 PF NOTES: 1. 8.0mm2 (.013mm thick) land areas 0.48 0.55 0.7 0.85 0.9 0.92 V LMBR120ET1G thru LMBR1200ET1G 2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 1.0 0.5 11 0 100 25 50 75 100 125 150 175 Case Temperature, °C Fig 3. – Typical Instantaneous Forward Characteristics TJ = 25°C Pulse width = 300µs 1% Duty Cycle 10 1.0 0.1 1000 10 Tj=125 1.0 Tj=75 0.1 0.01 0.01 0.1 1.0 10 t,Pulse duration,sec 100 Tj=25 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance TJ = 25°C f = 1.0 MHz Vsig = 100 10 1 10 100 Number of Cycles at 60Hz 10 1000 100 1 Fig 4. – Typical Reverse Characteristics 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (V) Fig 5. –typical transient thermal impedance TJ = TJ max 8.3ms Single Half Sine-wave 22 0 Instantaneous Reverse Current (mA) 0 0.01 0.2 Transient thermal impedance(°C/W) Peak forward surge current (A) 60 Hz Resistive or Inductive Load Junction Capacitance (pF) Instantaneous Forward Current (A) Average Forward Rectified Current (A) Fig. 1 – Forward Current Derating Curve 0.1 1 Reverse Voltage (V) 10 100 LMBR120ET1G thru LMBR1200ET1G 3. dimension: SOD-323HE MILLIMETERS MIN MAX 2.30 2.70 1.20 1.40 1.75 1.95 0.30Typ 0.55 0.75 0.10 0.20 0.65 0.95 0.50 0.70 0.40 0.80 1.15 1.55 0.8Typ DIM A B C D E F G H I J K INCHES MIN MAX 0.091 0.106 0.047 0.055 0.069 0.077 0.012Typ 0.030 0.022 0.004 0.008 0.026 0.037 0.020 0.028 0.016 0.031 0.045 0.061 0.032Typ Suggested solder pad layout D B C A E F Dimensions in inches and (millimeters) PACKAGE A B C D E F SOD123-FL 0.044(1.10) 0.079(2.00) 0.019(0.5) 0.032(0.8) 0.04(1.00) 0.075(1.90) LMBR120ET1G thru LMBR1200ET1G 5.Suggested thermal profile for soldering process 1. Storage environment：Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(t s) Tsmax to T L - Ramp-up Rate Time maintained above: - Temperature (T L) 150℃ 200℃ 60~120sec <3sec 217℃ - Time(t L) 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) Ramp-down Rate Time 25℃ to Peak Temperature 10~30sec <6℃/sec <6minutes LMBR120ET1G thru LMBR1200ET1G 6.High reliability test capabilities Item Test Solder Resistance Solderability High Temperature Reverse Bias Forward Operation Life Intermittent Operation Life Condition at 260±5℃ for 10±2sec immerse at 245±5℃ for 5 sec VR=80% rate at Tj=150℃ for 168hrs Rated average rectifier current Reference TA=25℃，IF=IO MIL-STD-750D METHOD-1036 Pressure Cooker 15PSIG at TA=121℃ for 4hrs JESD22-A102 Temperature Cycling -55℃ to +125℃ dwelled for 30 min. and transferred for 5min. Total 10 cycles MIL-STD-750D METHOD-1051 Thermal Shock 0℃ for 5min. Rise to 100℃ for 5min. Total 10 cycles MIL-STD-750D METHOD-1056 Forward Surge 8.3ms single half sine-wave superimposed on rated load,one surge MIL-STD-750D METHOD-4066-2 Humidity at TA=85℃，RH=85% for 1000hrs MIL-STD-750D METHOD-1021 High Temperature Storage Life at 175℃ for 1000hrs MIL-STD-750D METHOD-1031 MIL-STD-750D METHOD-2031 MIL-STD-202F METHOD-208 MIL-STD-750D METHOD-1038 MIL-STD-750D METHOD-1027 Title : DOC NO.： Power Diode SMD Package Pa cking Spec Version: 5 WI-258 Modification: 0 Page: 2 5.1 、SMD Packing Reel Spec & Packing Quantity 5.1.1 Reel Packing A. Reel Spec unit：mm SPEC SMA 7" reel SMA13" reel SMA-FL13" reel TO277 13" reel SMB13" reel SMC13" reel SOD123FL 7" reel SOD323HE 7" reel SMB-FL 13" reel A 177.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 330.0±2.0 177.0±2.0 177.0±2.0 330.0±2.0 B 54.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 75.0±0.5 50.0±0.5 50.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 Quantity/Reel 2K 5K 5K 5K 3K 3K 3K 3K 5K W 13.2±0.2 13.2±0.2 13.2±0.2 13.2±0.2 13.5±0.5 17.0±0.5 9.4±1.5 9.4±1.5 13.2±0.2 B. 13" reel packing box unit：mm A 335±5.0 size B 335±2.0 as per above packing Spec SMA13" reel SMB13" reel SMC13" reel TO277 13" reel SMB-FL 13" reel Q'ty/Box 10K 6K 6K 10K 10K C 40±1.0 Title : Power Diode SMD Package Packing Spec DOC NO.： WI-258 DOC NO.： WI-258 Page: 3 C. 7" reel packing box unit：mm B 188±2.0 C 138±2.0 186±2.0 139±2.0 as per above packing Q'ty/Box 16K SMA/SMA-FL SOD123FL 30K SOD323HE 30K unit：mm 185±2.0 SMA/SMA-FL A 188±2.0 SOD123FL SOD323HE D. reel packing carton A 350±2.0 size B 340±2.0 C 350±2.0 as per above packing Spec SMA/SMA-FL 7" reel SMA13"reel SMB13"reel SMC13"reel SMA-FL13"reel TO277 13" reel SMB-FL 13" reel Q'ty/Carton 80K 80K 48K 36K 80K 80K 80K unit：mm SOD123FL SOD323HE A B C 455±2.0 400±2.0 410±2.0 as per above packing Spec SOD123-FL 7" reel SOD323HE 7" reel 5.1.2 Tape Spec A. Cover Tape unit：mm A SMA /SMA-FL SMB-FL /SMB /TO277 SMC B 9.5±0.10 0.062±0.007 13.30±0.10 SOD123FL 5.4±0.10 SOD323HE Q'ty/Carton 360K 360K Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 4 B. Carrier Tape Do P2 Po t P1 A D1 A' Bo W F E B' B SEC.:B-B' Cathode(tape hole side） Ko Ao SEC.:A-A' Item W P1 E F D0 D1 P0 P2 10P0 A0 B0 K0 T SOD323HE 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.45±0.1 2.75±0.1 0.80±0.1 0.25±0.05 SOD123FL 8±0.3 4±0.1 1.75±0.1 3.5±.05 1.55±0.05 1.1±0.1 4±0.1 2±0.05 40±0.2 1.95±0.1 3.95±0.1 1.30±0.1 0.25±0.05 SMA 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.79±0.1 5.33±0.1 2.36±0.1 0.25±0.05 SMA-FL 12±0.3 4±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 2.83±0.1 4.75±0.1 1.42±0.1 0.25±0.05 SMB 12±0.3 8±0.1 1.75±0.1 5.5±0.05 1.55±0.05 1.55±0.05 4±0.1 2±0.05 40±0.2 3.8±0.1 5.4±0.1 2.45±0.1 0.25±0.05 SMB-FL 12±0.3 8±0.1 1.75±0.1 5.5±0.05 1.55±0.05 1.55±0.05 4±0.1 2±0.05 40±0.2 3.8±0.1 5.75±0.1 1.4±0.1 0.25±0.05 TO277 12±0.3 8±0.1 1.75±0.1 5.5±.05 1.55±0.05 1.5±0.1 4±0.1 2±0.05 40±0.2 4.3±0.1 6.8±0.1 1.35±0.1 0.25±0.05 SMC 16±0.3 8±0.1 1.75±0.1 7.5±.05 1.55±0.05 1.55±0.05 4±0.1 2±0.05 40±0.2 6.05±0.1 8.31±0.1 2.54±0.1 0.25±0.05 Title : DOC NO.： Power Diode SMD Package Packing Spec Version: 5 WI-258 Modification: 0 Page: 5 5.2、SMD Power Diode General Packing Spec A. 7" reel all labels will be at cathode side of reel ； Ｂ C A C side front A:LRC label; B:Environment Label C:Halide free label B. 13" reel A Ｂ C Ｂ C A A:LRC label; B:Environment Labe C:Halide free label C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel. 标题: DOC NO.： Power Diode SMD Package Packing Spec Version: 5 Modification: 0 Page: C. Label Content ： LRC Label WI-258 6 Two-dimension code Manufacturing it P/N ` Lot No. Date code Maker Quantity lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code Environment Label Halide-free Label Green LMBR120ET1G thru LMBR1200ET1G 7. Update Record 版次 更新记录 更新作者 更新日期 1 第一版 周杰 2014.02.26