L2N7002KDW1T1G

LESHAN RADIO COMPANY, LTD.
Small Signal MOSFET
380 mAmps, 60 Volts N–Channel SC88
L2N7002KDW1T1G
S- L2N7002KDW1T1G
●FEATURES
1)ESD Protected
2)Low RDS(on)
3)Surface Mount Package
4)This is a Pb−Free Device
5)We declare that the material of product compliant with
RoHS requirements and Halogen Free.
6) S- Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC-Q101
Qualified and PPAP Capable.
●APPLICATIONS
1)Low Side Load Switch
2)Level Shift Circuits
3)DC−DC Converter
4)Portable Applications i.e. DSC, PDA, Cell Phone, etc.
2000
ID MAX
(Note 1)
60 V
2.3 W @ 10 V
380 mA
Simplified Schematic
●MAXIMUM RATINGS(Tj= 25℃ unless otherwise stated))
Unit
Rating
Symbol
Value
Drain−to−Source Voltage
VDSS
60
Vdc
Gate−to−Source Voltage
VGS
±20
Vdc
Drain Current
ID
mAdc
– Steady State
TA = 25°C
320
TA = 85°C
230
–t<5s
TA = 25°C
380
TA = 85°C
270
Power Dissipation (Note 1)
PD
300
mW
Steady State
420
t<5s
Pulsed Drain Current (tp = 10 µs) IDM
1.5
A
s)
−55 to
Operating Junction and
TJ, TSTG
℃
+150
Storage Temperature Range
300
mA
Source Current (Body Diode)
IS
260
Lead Temperature for
TL
℃
Soldering Purposes (1/8〞from
case for 10 s)
ESD
RDS(on) MAX
2.7 W @ 5.0 V
●DEVICE MARKING AND ORDERING INFORMATION
Device
Marking
Shipping
L2N7002KDW1T1G
72K
3000/Tape&Reel
Gate−Source ESD Rating
(HBM, Method 3015)
V(BR)DSS
3
2
1
D2
G1
S1
S2
G2
D1
5
6
4
(Top View)
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq [1 oz] including traces)
May,2015
Rev.E 1/5
LESHAN RADIO COMPANY, LTD.
L2N7002KDW1T1G, S- L2N7002KDW1T1G
●THERMAL CHARACTERISTICS
Characteristic
Max
Junction−to−Ambient − Steady
RθJA
State (Note 1)
RθJA
Junction−to−Ambient
− t ≤5 s
(Note 1)
Value
417
300
Unit
℃/W
●ELECTRICAL CHARACTERISTICS (Ta= 25℃)
Test Condition
Characteristic
Symbol
OFF CHARACTERISTICS
Drain−to−Source Breakdown
V(BR)DSS VGS = 0 V, ID = 250 µA
Voltage
Drain−to−Source
Breakdown
V(BR)DSS/TJ
Voltage Temperature
Zero Gate Voltage Drain
Current
Gate−to−Source Leakage
Current
IDSS
IGSS
ON CHARACTERISTICS (Note 2.)
VGS(TH)
Gate Threshold Voltage
Negative Threshold
VGS(TH)/TJ
Temperature Coefficient
Drain−to−Source On
RDS(on)
Resistance
VGS = 0 V,
VDS = 60 V
VGS = 0 V,
VDS = 50 V
Min. Typ. Max. Unit
60
V
mV/C
71
TJ = 25C
1
TJ = 125C
500
TJ = 25C
100
nA
10
µA
2.5
V
mV/C
2.3
2.7
Ω
VDS = 0 V, VGS = 20 V
VGS = VDS, ID = 250 µA

1
4
VGS = 10 V, ID = 500 mA
VGS = 5.0 V, ID = 50 mA
VDS = 5 V, ID = 200 mA
80
Gfs
Forward Transconductance
CHARGES AND CAPACITANCES
34
CISS
Input Capacitance
VGS = 0 V, f = 1 MHz, VDS
3
COSS
Output Capacitance
= 25 V
2.2
CRSS
Reverse Transfer Capacitance
0.71
QG(TOT)
Total Gate Charge
0.1
QG(TH) VGS = 4.5 V, VDS = 10 V; ID
Threshold Gate Charge
0.32
= 500 mA
QGS
Gate−to−Source Charge
0.16
QGD
Gate−to−Drain Charge
SWITCHING CHARACTERISTICS (VGS = V (Note 3)
Turn−On Delay Time
td(ON)
3.8
Rise Time
VDS = 10 V, VGEN = 10 V, ID
tr
3.4
Turn−Off Delay Time
td(OFF) = 500 mA
19
tf
Fall Time
12
DRAIN−SOURCE DIODE CHARACTERISTICS
1.4
VGS = 0 V,
TJ = 25C
VSD
Forward Diode Voltage
IS = 115
0.7
TJ = 85C
µA
mS
pF
nC
ns
V
2. Pulse Test: pulse width ≤ 300 s, duty cycle ≤ 2%
3. Switching characteristics are independent of operating junction temperatures
May,2015
Rev.E 2/5
LESHAN RADIO COMPANY, LTD.
L2N7002KDW1T1G, S- L2N7002KDW1T1G
ELECTRICAL CHARACTERISTIC CURVES
May,2015
Fig. 1
Fig. 2
Fig. 3
Fig. 4
Rev.E 3/5
LESHAN RADIO COMPANY, LTD.
L2N7002KDW1T1G, S- L2N7002KDW1T1G
Fig. 5
Fig. 7
Fig. 6
Fig. 8
Fig. 9
May,2015
Rev.E 4/5
LESHAN RADIO COMPANY, LTD.
L2N7002KDW1T1G, S- L2N7002KDW1T1G
SC−88 (SOT−363)
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
G
6
5
4
DIM
A
B
C
D
G
H
J
K
N
S
−B−
S
1
2
3
D 6 PL
0.2 (0.008)
M
B
M
INCHES
MIN
MAX
0.071 0.087
0.045 0.053
0.031 0.043
0.004 0.012
0.026 BSC
−−− 0.004
0.004 0.010
0.004 0.012
0.008 REF
0.079 0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
N
J
C
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.025
0.40
0.0157
1.9
0.0748
May,2015
SCALE 20:1
mm inches
Rev.E 5/5