RENESAS HD74HC85P

HD74HC85
4-bit Magnitude Comparator
REJ03D0555-0200
(Previous ADE-205-427)
Rev.2.00
Oct 06, 2005
Description
The HD74HC85 is designed for high speed comparison of two four bit words. This circuit has eight comparison input,
4 for each word; three cascade inputs (A < B, A > B, A = B); and three decision outputs (A < B, A > B, A = B). The
result of a comparison is indicated by a high level on one of the decision outputs. Thus it may be determined whether
one word is “greater than,” “less than,” or “equal to” the other word. By connecting the outputs of the least significant
stage to the cascade inputs of the next stage, words of greater than four bits can be compared. In addition the least
significant stage must have a high level applied to the A = B input, and a low level to the A < B, and A > B inputs.
Features
•
•
•
•
•
•
High Speed Operation: tpd (Data Word Input to Output) = 20 ns typ (CL = 50 pF)
High Output Current: Fanout of 10 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max (Ta = 25°C)
Ordering Information
Part Name
Package Type
HD74HC85P
DILP-16 pin
HD74HC85FPEL
SOP-16 pin (JEITA)
HD74HC85RPEL
SOP-16 pin (JEDEC)
Package Code
(Previous Code)
PRDP0016AE-B
(DP-16FV)
PRSP0016DH-B
(FP-16DAV)
PRSP0016DG-A
(FP-16DNV)
Package
Abbreviation
P
—
FP
EL (2,000 pcs/reel)
RP
EL (2,500 pcs/reel)
Note: Please consult the sales office for the above package availability.
Rev.2.00, Oct 06, 2005 page 1 of 7
Taping Abbreviation
(Quantity)
HD74HC85
Function Table
Data Word Inputs
Cascading Inputs
Outputs
A3, B3
A3 > B3
A2, B2
X
A1, B1
X
A0, B0
X
A > Bin
X
A = Bin
X
A < Bin
X
A > Bout
H
A = Bout
L
A < Bout
L
A3 < B3
A3 = B3
X
A2 > B2
X
X
X
X
X
X
X
X
X
X
L
H
L
L
H
L
A3 = B3
A3 = B3
A2 < B2
A2 = B2
X
A1 > B1
X
X
X
X
X
X
X
X
L
H
L
L
H
L
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A1 < B1
A1 = B1
X
A0 > B0
X
X
X
X
X
X
L
H
L
L
H
L
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A1 = B1
A1 = B1
A0 < B0
A0 = B0
X
L
X
L
X
L
L
H
L
L
H
H
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A1 = B1
A1 = B1
A0 = B0
A0 = B0
L
H
L
L
H
L
L
H
L
L
H
L
A3 = B3
A3 = B3
A2 = B2
A2 = B2
A1 = B1
A1 = B1
A0 = B0
A0 = B0
H
X
L
H
H
X
L
L
L
H
L
L
H:
L:
X:
High level
Low level
Irrelevant
Pin Arrangement
B3
Data 1
Input
16 VCC
B3
A<B 2
A<B
A3
15 A3
A=B 3
A=B In B2
14 B2
A>B 4
A>B
A2
13 A2
A>B 5
A>B
A1
12 A1
A=B 6
A=B out B1
11 B1
A<B 7
A<B
10 A0
B0
A0
GND 8
9 B0
(Top view)
Rev.2.00, Oct 06, 2005 page 2 of 7
HD74HC85
Logic Diagram
B3
A3
A>Bout
B2
A2
B1
A1
A<Bout
B0
A0
A<Bin
A=Bout
A=Bin
A>Bin
Absolute Maximum Ratings
Item
Symbol
Ratings
Unit
Supply voltage range
Input / Output voltage
VCC
Vin, Vout
–0.5 to 7.0
–0.5 to VCC +0.5
V
V
IIK, IOK
IO
±20
±25
mA
mA
ICC or IGND
PT
±50
500
mA
mW
Input / Output diode current
Output current
VCC, GND current
Power dissipation
Storage temperature
Tstg
–65 to +150
°C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item
Supply voltage
Symbol
VCC
Ratings
2 to 6
Unit
V
Input / Output voltage
Operating temperature
VIN, VOUT
Ta
0 to VCC
–40 to 85
V
°C
tr , tf
0 to 1000
0 to 500
Input rise / fall time
Note:
*1
0 to 400
1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Rev.2.00, Oct 06, 2005 page 3 of 7
ns
Conditions
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
HD74HC85
Electrical Characteristics
Ta = 25°C
Item
Input voltage
Symbol VCC (V)
VIH
VIL
Output voltage
VOH
VOL
Ta = –40 to+85°C
Unit
Test Conditions
2.0
Min
1.5
Typ
—
Max
—
Min
1.5
Max
—
4.5
6.0
3.15
4.2
—
—
—
—
3.15
4.2
—
—
2.0
4.5
—
—
—
—
0.5
1.35
—
—
0.5
1.35
6.0
2.0
—
1.9
—
2.0
1.8
—
—
1.9
1.8
—
4.5
6.0
4.4
5.9
4.5
6.0
—
—
4.4
5.9
—
—
4.5
6.0
4.18
5.68
—
—
—
—
4.13
5.63
—
—
2.0
4.5
—
—
0.0
0.0
0.1
0.1
—
—
0.1
0.1
6.0
4.5
—
—
0.0
—
0.1
0.26
—
—
0.1
0.33
—
—
—
—
0.26
±0.1
—
—
0.33
±1.0
IOL = 5.2 mA
µA Vin = VCC or GND
—
—
4.0
—
40
µA Vin = VCC or GND, Iout = 0 µA
Input current
Iin
6.0
6.0
Quiescent supply
current
ICC
6.0
V
V
V
Vin = VIH or VIL IOH = –20 µA
IOH = –4 mA
IOH = –5.2 mA
V
Vin = VIH or VIL IOL = 20 µA
IOL = 4 mA
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C
Item
Propagation delay
time
Symbol VCC (V)
tPLH, tPHL
tPLH, tPHL
tPLH, tPHL
tPLH, tPHL
Output fall time
Input capacitance
tTHL
Cin
Ta = –40 to +85°C
2.0
Min
—
Typ
—
Max
210
Min
—
Max
265
4.5
6.0
—
—
20
—
42
36
—
—
53
45
2.0
4.5
—
—
—
20
175
35
—
—
220
44
6.0
2.0
—
—
—
—
30
125
—
—
37
155
4.5
6.0
—
—
12
—
25
21
—
—
31
26
2.0
4.5
—
—
—
14
155
31
—
—
195
39
6.0
2.0
—
—
—
—
26
75
—
—
33
95
4.5
6.0
—
—
5
—
15
13
—
—
19
16
—
—
5
10
—
10
Rev.2.00, Oct 06, 2005 page 4 of 7
Unit
Test Conditions
ns
C0 to Σ1
ns
A1 or B1 to Σ1
ns
C0 to C4
ns
A1 or B1 to C4
ns
pF
HD74HC85
Test Circuit
VCC
VCC
Output
Pulse generator
Zout = 50 Ω
See Function Table
Input
A3
B3
A2
B2
A1
B1
A0
B0
A>B
CL = 50 pF
Output
A=B
CL = 50 pF
Output
A<B
A=B
A>B
A<B
CL = 50 pF
Note: CL includes the probe and jig capacitance.
Waveforms
tr
tf
90 %
50 %
Input
10 %
10 %
t PLH
0V
t PHL
90 %
Same-phase output
VCC
90 %
50 %
VOH
90 %
50 %
10 %
t PHL
50 %
10 %
t TLH
t PLH
t THL
90 %
90 %
Inverse-phase output
50 %
10 %
t THL
VOL
50 %
10 %
VOH
VOL
t TLH
Notes: 1. Input waveform: PRR ≤ 1 MHz, Zo = 50 Ω, tr ≤ 6 ns, tf ≤ 6 ns
2. The output are measured one at a time with one transition per measurement.
Rev.2.00, Oct 06, 2005 page 5 of 7
HD74HC85
Package Dimensions
JEITA Package Code
P-DIP16-6.3x19.2-2.54
RENESAS Code
PRDP0016AE-B
Previous Code
DP-16FV
MASS[Typ.]
1.05g
D
9
E
16
1
8
b3
0.89
Z
A1
A
Reference
Symbol
L
e
Nom
c
e1
D
19.2
E
6.3
JEITA Package Code
P-SOP16-3.95x9.9-1.27
RENESAS Code
PRSP0016DG-A
*1
Previous Code
FP-16DNV
7.4
A1
0.51
b
p
0.40
b
3
0.48
0.56
1.30
c
0.19
θ
0°
e
2.29
0.25
0.31
2.54
2.79
15°
1.12
L
2.54
MASS[Typ.]
0.15g
D
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
F
16
20.32
5.06
Z
( Ni/Pd/Au plating )
Max
7.62
1
A
θ
bp
e
Dimension in Millimeters
Min
9
c
*2
Index mark
HE
E
bp
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
Dimension in Millimeters
Min
Nom
Max
D
9.90
10.30
E
3.95
A2
1
Z
8
e
*3
bp
x
A1
0.10
0.14
0.25
0.34
0.40
0.46
0.15
0.20
0.25
6.10
6.20
1.75
A
M
L1
bp
b1
c
A
c
A1
θ
L
y
Detail F
1
θ
0°
HE
5.80
1.27
e
x
0.25
y
0.15
Z
0.635
0.40
L
L
Rev.2.00, Oct 06, 2005 page 6 of 7
8°
1
0.60
1.08
1.27
HD74HC85
JEITA Package Code
P-SOP16-5.5x10.06-1.27
RENESAS Code
PRSP0016DH-B
*1
Previous Code
FP-16DAV
MASS[Typ.]
0.24g
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
D
F
16
9
c
HE
*2
E
bp
Index mark
Reference
Symbol
Terminal cross section
( Ni/Pd/Au plating )
1
Z
*3
bp
Nom
D
10.06
E
5.50
Max
10.5
A2
8
e
Dimension in Millimeters
Min
x
A1
M
0.00
0.10
0.20
0.34
0.40
0.46
0.15
0.20
0.25
7.80
8.00
2.20
A
L1
bp
b1
c
A
c
A1
θ
y
L
Detail F
1
θ
0°
HE
7.50
1.27
e
x
0.12
y
0.15
Z
0.80
0.50
L
L
Rev.2.00, Oct 06, 2005 page 7 of 7
8°
1
0.70
1.15
0.90
Sales Strategic Planning Div.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
http://www.renesas.com
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology (Shanghai) Co., Ltd.
Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China
Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> 2-796-3115, Fax: <82> 2-796-2145
Renesas Technology Malaysia Sdn. Bhd.
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
© 2005. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .3.0